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AMD XC7A100T-L2FGG676E
- Part No.:
- XC7A100T-L2FGG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7A100T-L2FGG676E.pdf
- Description:
- IC FPGA 300 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,119
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Product details
Overview
XC7A100T-L2FGG676E from AMD is a Kintex-7 FPGA with 101,440 logic cells, 12.5 Gbps transceiver capability, and 400 I/O pins in a 676-pin FCBGA package; it serves as a high-performance programmable logic fabric for PCIe Gen2 endpoint designs in industrial vision systems.
For engineers reviewing the XC7A100T-L2FGG676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage support, configuration interface type, and thermal performance under sustained 28 nm process operation.
Technical Context
The XC7A100T-L2FGG676E implements a 28 nm HKMG process-based architecture with integrated Block RAM (up to 4,860 kbits), DSP48E1 slices (240 units), and clock management tiles (CMT) containing MMCM and PLL blocks. It supports SelectIO standards including LVDS, SSTL, HSTL, and TMDS across 16 I/O banks.
Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces; bitstream security includes AES-256 encryption and HMAC authentication. The device operates across Industrial temperature range (–40°C to +100°C) with core voltage of 1.0V ±3%.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 LUTs + flip-flops; determines maximum combinational/sequential logic capacity for custom IP integration. |
| Transceiver Speed | 12.5 Gbps per lane; enables PCIe Gen2 x8 or dual-lane 10GbE PHY implementation without external retimers. |
| I/O Pins | 400 user-configurable I/Os; supports mixed-voltage interfacing across 16 banks with independent VCCO control. |
| Block RAM | 4,860 kbits distributed across 285 BRAM primitives; provides on-chip memory for FIFOs, frame buffers, or lookup tables. |
| DSP Slices | 240 DSP48E1 units; delivers 220+ GMAC/s for real-time filtering, FFT, or motor control algorithms. |
| Operating Temp | –40°C to +100°C (Industrial grade); ensures reliability in enclosed enclosures without forced airflow. |
Pinout & Package
676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) with 1.0 mm pitch, 27 × 27 mm body size, and exposed thermal pad. RoHS-compliant, Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Inputs | Determine boot source (SPI/JTAG/Slave SelectMAP) at power-up; pulled internally to default state if unconnected. |
| CCLK | Configuration Clock | Drives internal configuration shift register during Master SPI mode; frequency ≤ 50 MHz. |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading; must be externally pulled high to enable startup. |
| INIT_B | Configuration Initialization | Active-low open-drain output signaling readiness to accept configuration data or error condition. |
| GND / VCCINT / VCCAUX / VCCO | Power Supply Terminals | Dedicated rails for core (1.0V), auxiliary (1.8V), and I/O (1.2–3.3V) domains; require separate decoupling per bank. |
Key Features
| Feature | Design Value |
|---|---|
| AES-256 Bitstream Encryption | Prevents unauthorized cloning or reverse-engineering of configured logic by encrypting configuration memory. |
| HMAC Authentication | Verifies bitstream integrity before loading, blocking corrupted or tampered configuration images. |
| Integrated PCI Express Endpoint | Hard IP block supporting Gen2 x1/x2/x4/x8 with AXI4 streaming interface and DMA engine. |
| UltraScale-Compatible I/O | Supports 1.2V–3.3V single-ended and differential standards including MIPI D-PHY, LVDS, and RSDS. |
| Thermal Monitoring Diode | On-die diode enables real-time junction temperature measurement using external ADC for dynamic thermal throttling. |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: High-speed camera sensor aggregation and real-time image preprocessing in automated optical inspection systems. IC Role / Device Role / Timing Role: FPGA fabric processes pixel streams from multiple CMOS sensors, synchronizes timing via dedicated clock networks, and formats data for PCIe upstream transmission. Use Value: Enables sub-100 µs latency path from sensor input to host memory via integrated PCIe Gen2 endpoint and AXI DMA. | Use Scenario: DICOM-compliant video capture and compression pipeline in portable ultrasound devices. IC Role / Device Role / Timing Role: Configurable logic handles sensor interface (LVDS/MIPI), motion compensation, and JPEG2000 encoding while managing DDR3 memory bandwidth. Use Value: Delivers deterministic 12-bit grayscale throughput at 60 fps using 240 DSP48E1 slices and 4,860 kbits of Block RAM. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Deterministic I/O scanning and fieldbus protocol bridging (PROFINET, EtherCAT) in modular PLC backplanes. IC Role / Device Role / Timing Role: Implements hard real-time state machines, time-triggered communication stacks, and isolated digital I/O control logic. Use Value: Achieves <1 µs jitter on 1 ms cycle times using dedicated clock routing and deterministic timing closure tools. | Use Scenario: Multi-channel signal acquisition and real-time FFT analysis in portable spectrum analyzers. IC Role / Device Role / Timing Role: Digitizes analog inputs via external ADCs, performs 4k-point FFTs in pipeline, and streams results over USB 3.0 or Gigabit Ethernet. Use Value: Sustains 220+ GMAC/s compute density with 240 DSP48E1 slices and low-latency memory access paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 215K logic cells, 16.3 Gbps transceivers, higher static power, 0.85V core voltage. | Better suited for PCIe Gen3 and 25G Ethernet; requires revised power delivery and thermal design. | Select when migrating to higher bandwidth protocols or requiring hardened 100G MAC/PCS blocks. |
| XC7K160T-2FFG676E | Kintex-7 family, same 28 nm node, 162K logic cells, identical 676-pin FCBGA package, but no -L2 speed grade. | Higher logic density but slower timing closure for high-frequency transceiver links. | Choose for logic-intensive designs where transceiver speed is secondary to resource count. |
Compared with XC7A100T-L2FGG676E, XCKU035-2FFVA676E offers greater bandwidth at higher power and cost, while XC7K160T-2FFG676E trades transceiver speed for additional LUTs in the same footprint-enabling upgrade paths without PCB redesign only when speed grade compatibility is verified.
Availability
XC7A100T-L2FGG676E is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7A100T-L2FGG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family targets cost-optimized high-performance applications such as video processing, wireless infrastructure, and industrial connectivity-balancing logic density, transceiver capability, and power efficiency.
FAQ
What is the maximum supported transceiver data rate for XC7A100T-L2FGG676E?
The XC7A100T-L2FGG676E supports a maximum transceiver line rate of 12.5 Gbps per lane. This rating is validated under the -L2 speed grade and applies to all GTY transceiver quads on the device. It enables compliance with PCIe Gen2, SATA III, and 10GBASE-R protocols without gearbox or retimer ICs. The XC7A100T-L2FGG676E achieves this performance with built-in equalization and clock data recovery circuitry.
Does XC7A100T-L2FGG676E support AES-256 bitstream encryption?
Yes, XC7A100T-L2FGG676E includes hardware-accelerated AES-256 encryption for configuration bitstreams. This feature uses a dedicated on-die engine that decrypts the bitstream during loading from external SPI flash. Keys are stored in battery-backed RAM or eFUSE, and the XC7A100T-L2FGG676E enforces secure boot by rejecting unauthenticated or corrupted images.
What I/O standards are supported by XC7A100T-L2FGG676E?
XC7A100T-L2FGG676E supports 21 I/O standards across its 16 banks, including LVDS, SSTL-18/25, HSTL-I/II, MIPI D-PHY, RSDS, and TMDS. Each bank operates independently with configurable VCCO (1.2V–3.3V) and reference voltages. The XC7A100T-L2FGG676E does not support DDR4 or LPDDR4 native interfaces without external PHYs.
What is the operating temperature range for XC7A100T-L2FGG676E?
The XC7A100T-L2FGG676E is rated for Industrial temperature range: –40°C to +100°C case temperature. This specification is guaranteed under specified voltage tolerances (VCCINT = 1.0V ±3%, VCCAUX = 1.8V ±3%) and thermal derating curves published in the Kintex-7 DC and Switching Characteristics datasheet. The XC7A100T-L2FGG676E includes an on-die thermal sensor for system-level monitoring.
Is XC7A100T-L2FGG676E pin-compatible with other Kintex-7 FPGAs in the 676-pin FCBGA package?
XC7A100T-L2FGG676E shares the same 676-pin FCBGA mechanical footprint with other Kintex-7 devices like XC7K160T-2FFG676E, but pin functions are not fully interchangeable due to differing transceiver quad placement, I/O bank assignments, and power rail distribution. Migration requires verification of signal mapping, power integrity, and thermal layout-even within the same package code. The XC7A100T-L2FGG676E has unique power sequencing requirements tied to its -L2 speed grade.
XC7A100T-L2FGG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC7A100T-L2FGG676E FAQ
1.How can I place an order for XC7A100T-L2FGG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-L2FGG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-L2FGG676E reliable?
The price and inventory of XC7A100T-L2FGG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-L2FGG676E is usually 5 days.
3.What payment methods are accepted for XC7A100T-L2FGG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-L2FGG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-L2FGG676E?
XC7A100T-L2FGG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-L2FGG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-L2FGG676E?
For technical support, including XC7A100T-L2FGG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-L2FGG676E requirements.
6.How does Aetrix verify that XC7A100T-L2FGG676E is sourced from the original manufacturer or authorized distributors?
All XC7A100T-L2FGG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-L2FGG676E meets industry standards.
7.What is the process for return or replacement of XC7A100T-L2FGG676E?
All XC7A100T-L2FGG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-L2FGG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-L2FGG676E part is unused and in its original packaging.
Return procedure for XC7A100T-L2FGG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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