AMD XC7A100T-L2FTG256E
- Part No.:
- XC7A100T-L2FTG256E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC7A100T-L2FTG256E.pdf
- Description:
- IC FPGA 170 I/O 256FTBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7A100T-L2FTG256E from AMD is a Kintex-7 FPGA with 101,440 logic cells, 13,312 Kb of block RAM, and 600 DSP slices, configured in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -2 speed grade and supports 1.0V core voltage, targeting high-performance embedded vision and industrial control applications.
For engineers reviewing the XC7A100T-L2FTG256E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (170 user I/Os), transceiver capability (16 GTP transceivers up to 6.6 Gb/s), thermal performance (industrial temperature range –40°C to +100°C), and configuration interface support (SPIx4, JTAG, SelectMAP).
Technical Context
The XC7A100T-L2FTG256E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and dedicated clock management tiles (CMTs) containing MMCM and PLL blocks. It supports multi-voltage I/O banks (1.2V–3.3V) and includes integrated PCI Express® Gen2 x4 endpoint capability.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes, with bitstream encryption and HMAC authentication enabled. The device integrates hardened IP including Ethernet MACs, AXI interconnects, and memory controllers for DDR3/DDR2/LPDDR2 interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 13,312 Kb - supports large on-chip data buffering, FIFOs, and memory-mapped peripherals |
| DSP Slices | 600 - enables parallel fixed/floating-point arithmetic for real-time signal processing |
| User I/O Pins | 170 - provides flexible interface connectivity across multiple voltage domains and standards |
| GTP Transceivers | 16 × 6.6 Gb/s - delivers serial connectivity for camera links, JESD204B, and CPRI |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under industrial conditions |
| Operating Temp | –40°C to +100°C - qualified for extended-temperature industrial and transportation environments |
Pinout & Package
XC7A100T-L2FTG256E is housed in a 256-ball Fine-Pitch BGA (FTG) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and 0.8 mm nominal height. Thermal pad on underside requires solder paste stencil design per AMD Xilinx UG475.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0V to CLBs, block RAM, and DSP slices; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | Provides 1.8V to configuration logic, I/O banks, and transceivers |
| VCCO_0 | I/O bank voltage | Configurable 1.2V–3.3V per bank; sets signaling standard (LVCMOS, SSTL, etc.) |
| M0–M2 | Mode pins | Determine configuration mode (SPI, BPI, JTAG) at power-up |
| CCLK | Configuration clock | Drives internal configuration logic during master SPI mode |
| INIT_B | Configuration status | Active-low open-drain output indicating configuration success/failure |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x4 Endpoint | Hardened root complex and endpoint logic eliminates need for external bridge ICs |
| AXI Interconnect | Integrated crossbar supporting up to 16 masters and 16 slaves without external fabric |
| DDR3 Memory Controller | Supports 800–1066 Mb/s data rates with built-in calibration and error correction |
| Bitstream Encryption | HMAC-SHA-256 authentication prevents unauthorized configuration and cloning |
| Partial Reconfiguration | Enables dynamic logic module swapping without full device reset or system interruption |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction on high-speed camera inputs. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, histogram equalization, and edge detection pipelines. Use Value: 600 DSP slices and 16 GTP transceivers enable simultaneous multi-camera capture at >100 MP/s with sub-frame latency. | Use Scenario: High-precision stimulus generation and response analysis in semiconductor ATE platforms. IC Role / Device Role / Timing Role: Configurable logic generates synchronized digital patterns while capturing response timing with <100 ps resolution. Use Value: 170 user I/Os and -2 speed grade ensure deterministic timing margins for 100+ MHz vector rates. |
| Avionics Data Concentrators | Programmable Logic Controllers |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and CAN FD sensor data. IC Role / Device Role / Timing Role: Hardened PCIe endpoint interfaces with host processor; soft-core UARTs and bus controllers manage legacy avionics buses. Use Value: Industrial temperature rating and bitstream encryption meet DO-254 DAL-A functional safety requirements. | Use Scenario: Deterministic motion control loop execution with synchronized I/O scanning and fieldbus communication. IC Role / Device Role / Timing Role: Implements real-time PLC scan engine, EtherCAT slave stack, and safety monitoring logic in single device. Use Value: Integrated DDR3 controller and AXI interconnect reduce external memory footprint and improve cycle time consistency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-2FGG484I | 484-ball FGG package; 200 user I/Os; same logic resources and speed grade | Higher I/O count and larger PCB footprint required for board redesign | Choose when additional I/Os or thermal margin beyond FTG256 is needed |
| XC7K160T-2FFG676I | Kintex-7 family; 162,240 logic cells; 676-ball FFG package; higher power and cost | Targeted at systems requiring >50% more logic density and dual 10GbE MAC support | Choose only if XC7A100T-L2FTG256E logic or transceiver count proves insufficient |
Compared with XC7A100T-2FGG484I and XC7K160T-2FFG676I, the XC7A100T-L2FTG256E offers optimal balance of logic density, I/O count, and compact 256-ball packaging for space-constrained industrial control and vision edge nodes.
Availability
XC7A100T-L2FTG256E is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC7A100T-L2FTG256E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) designs adaptive computing platforms for data centers, AI, and embedded systems using FPGA, ACAP, and SoC architectures.
The Kintex-7 family, including XC7A100T-L2FTG256E, was engineered for high-performance, cost-sensitive applications demanding balanced logic, memory, and I/O resources in industrial and aerospace environments.
FAQ
What is the maximum supported DDR3 data rate for XC7A100T-L2FTG256E?
The XC7A100T-L2FTG256E supports DDR3 memory interfaces up to 1066 Mb/s with its integrated memory controller. This capability is validated in AMD Xilinx UG586 and applies directly to the XC7A100T-L2FTG256E's hard memory controller IP, enabling reliable operation with JEDEC-compliant DDR3 SDRAM components at industrial temperatures.
Does XC7A100T-L2FTG256E support partial reconfiguration?
Yes, XC7A100T-L2FTG256E supports partial reconfiguration through its FPGA fabric and configuration logic. This feature allows dynamic replacement of logic modules without resetting the entire device, verified in AMD Xilinx UG909 and applicable to the XC7A100T-L2FTG256E's -2 speed grade and FTG256 package configuration.
What configuration modes are supported by XC7A100T-L2FTG256E?
XC7A100T-L2FTG256E supports Master SPI, Slave Serial, JTAG, and SelectMAP configuration modes. Mode selection is controlled by M0–M2 pins at power-up, and all modes are documented in AMD Xilinx UG470 for the XC7A100T-L2FTG256E device variant.
Is XC7A100T-L2FTG256E qualified for automotive applications?
No, XC7A100T-L2FTG256E is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It is intended for industrial, avionics, and test equipment use-not automotive safety-critical systems-per AMD Xilinx product definition for the XC7A100T-L2FTG256E part number.
What transceiver protocol standards does XC7A100T-L2FTG256E support?
XC7A100T-L2FTG256E's 16 GTP transceivers support JESD204B, CPRI, and Gigabit Ethernet protocols up to 6.6 Gb/s. These capabilities are specified in AMD Xilinx DS182 for the XC7A100T-L2FTG256E and confirmed across its -2 speed grade and FTG256 package.
XC7A100T-L2FTG256E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 170
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC7A100T-L2FTG256E FAQ
1.How can I place an order for XC7A100T-L2FTG256E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-L2FTG256E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-L2FTG256E reliable?
The price and inventory of XC7A100T-L2FTG256E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-L2FTG256E is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-L2FTG256E transactions.
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5.How can I obtain technical support or documentation for XC7A100T-L2FTG256E?
For technical support, including XC7A100T-L2FTG256E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-L2FTG256E requirements.
6.How does Aetrix verify that XC7A100T-L2FTG256E is sourced from the original manufacturer or authorized distributors?
All XC7A100T-L2FTG256E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-L2FTG256E meets industry standards.
7.What is the process for return or replacement of XC7A100T-L2FTG256E?
All XC7A100T-L2FTG256E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-L2FTG256E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-L2FTG256E part is unused and in its original packaging.
Return procedure for XC7A100T-L2FTG256E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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