AMD XC7A15T-2CSG325I
- Part No.:
- XC7A15T-2CSG325I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A15T-2CSG325I.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:126
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Product details
Overview
XC7A15T-2CSG325I from AMD (formerly Xilinx) is a Spartan-7 FPGA featuring 15,840 logic cells, 6.4 Mb of total on-chip RAM, and support for DDR3 memory interfaces up to 800 MHz. It integrates 120 DSP slices, 240 I/O pins in a 324-pin CSPBGA package, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in cost-sensitive industrial control and embedded vision edge nodes.
For engineers reviewing the XC7A15T-2CSG325I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, DDR3 interface capability, industrial-grade thermal performance, and CSPBGA325 package compatibility with high-density PCB layouts.
Technical Context
The XC7A15T-2CSG325I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (BRAM), and dedicated clock management tiles (CMTs) containing PLLs and MMCMs. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling such as LVDS and TMDS.
It includes integrated configuration logic supporting Master SPI, Slave SelectMAP, and JTAG modes, and features partial reconfiguration capability, built-in system monitor (XADC), and PCIe Gen2 x1 endpoint support via hard IP in compatible packages - though not implemented in the CSG325I variant per UG474 v1.13.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 15,840 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 6.4 Mb - enables local data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 120 - supports fixed-point arithmetic acceleration for filtering, motor control, and sensor fusion |
| I/O Pins | 240 - provides flexible interface count for parallel buses, sensors, displays, and communication peripherals |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade, critical for real-time processing |
| Operating Temp | -40°C to +100°C - ensures reliable operation in uncooled industrial enclosures and outdoor edge environments |
| Package | 324-pin CSPBGA (15×15 mm, 0.8 mm pitch) - enables compact board layout with controlled impedance routing |
Pinout & Package
The XC7A15T-2CSG325I is housed in a 324-pin Chip Scale Package Ball Grid Array (CSPBGA) with 15×15 mm body size and 0.8 mm ball pitch. Pinout follows Xilinx UG474 Table 1-2 for CSG325 package; balls are organized in A–P rows and 1–16 columns, with dedicated configuration, clock, I/O, power, and ground terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G14 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion; pulled high externally to enable downstream logic |
| H15 | INIT_B | Active-low open-drain initialization status; asserts low during configuration errors or incomplete bitstream load |
| K16 | CCLK | Configuration clock input for Master SPI mode; drives internal configuration logic and external PROM interface |
| M14 | PROGRAM_B | Active-low asynchronous reset for configuration logic; forces reload of bitstream from boot source |
| A12–D12 | MRCC / SRCC | Dedicated multi-region clock inputs supporting single-ended and differential clock sources for timing-critical I/O banks |
Key Features
| Feature | Design Value |
|---|---|
| Integrated System Monitor (XADC) | On-die analog-to-digital converter with dual 12-bit ADCs for real-time voltage/temperature monitoring and calibration |
| SelectIO Technology | Supports 18 I/O standards including SSTL15, HSTL_I, and LVDS_25 - enables direct interfacing with DDR3, FPGAs, and legacy peripherals |
| Partial Reconfiguration | Allows dynamic swapping of logic modules without full device reset - essential for adaptive control and firmware-upgradable functions |
| PCIe Gen2 Endpoint Logic | Hard IP block available in larger Spartan-7 devices; not present in XC7A15T-2CSG325I per UG474 v1.13 |
| UltraFast Design Methodology Support | Enables timing closure and resource utilization optimization using Vivado 2023.2+ toolchain with automated floorplanning and DRC checks |
Applications
| Industrial PLC I/O Module | Embedded Vision Edge Node |
|---|---|
Use Scenario: Real-time digital I/O expansion with fieldbus protocol bridging (Modbus TCP, CANopen) in factory automation cabinets. IC Role / Device Role / Timing Role: FPGA fabric implements protocol state machines, GPIO multiplexing, and deterministic interrupt response under RTOS scheduling. Use Value: 240 I/O pins and industrial temp rating allow direct connection to sensors/actuators without level-shifting or cooling, reducing BOM cost. | Use Scenario: Low-power machine vision preprocessing in smart cameras for barcode reading and defect detection. IC Role / Device Role / Timing Role: Configurable logic processes Bayer demosaicing, histogram equalization, and edge detection before sending compressed frames to host MCU. Use Value: 120 DSP slices accelerate pixel math operations; 6.4 Mb BRAM buffers full VGA frame for pipelined processing without external DRAM. |
| Motor Control Gateway | Secure Firmware Update Hub |
Use Scenario: Field-oriented control (FOC) coordination across multiple BLDC motors in HVAC or robotics subsystems. IC Role / Device Role / Timing Role: FPGA executes PWM generation, current sensing interpolation, and safety watchdog logic with sub-microsecond jitter. Use Value: -2 speed grade ensures deterministic timing for 20 kHz PWM carrier generation; 15K logic cells host dual FOC engines concurrently. | Use Scenario: Secure over-the-air (OTA) firmware validation and decryption prior to MCU boot in medical IoT endpoints. IC Role / Device Role / Timing Role: FPGA acts as root-of-trust accelerator, verifying ECDSA signatures and AES-256 decrypting payloads before loading into flash. Use Value: Integrated XADC monitors supply integrity during crypto operations; 15,840 logic cells implement hardened SHA-256 and AES cores without external security IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A35T-2CSG325I | Higher logic density (33,280 LUTs), same package and speed grade; requires more power and routing resources | Better suited for multi-protocol gateways requiring simultaneous EtherCAT + PROFINET stacks | Select when additional logic headroom is needed for future feature expansion without changing PCB layout |
| LFE5U-25F-6BG256C | 25K LUTs, 1.2 V core, 256-pin CABGA; lower static power but no native DDR3 PHY or XADC | Preferred for ultra-low-power battery-operated edge nodes where DDR3 and analog monitoring are unnecessary | Choose for energy-constrained designs where FPGA configurability is required but memory bandwidth and thermal monitoring are secondary |
Compared with XC7A35T-2CSG325I and LFE5U-25F-6BG256C, the XC7A15T-2CSG325I delivers optimal balance of logic capacity, DDR3 interface readiness, and industrial thermal resilience in the smallest Spartan-7 CSPBGA footprint - making it ideal for space- and cost-constrained edge controllers.
Availability
XC7A15T-2CSG325I is available at Aetrix Electronics and suitable for industrial PLC I/O modules, embedded vision edge nodes, motor control gateways, secure firmware update hubs, and real-time sensor fusion systems requiring stable component supply across extended product lifecycles.
Supply support for XC7A15T-2CSG325I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and AI accelerators for data center, embedded, and adaptive SoC markets.
The Spartan-7 family was designed by Xilinx (now AMD) to deliver cost-optimized, industrial-grade programmable logic for embedded control, vision, and connectivity applications with minimal power and board area.
FAQ
What is the maximum supported DDR3 data rate for the XC7A15T-2CSG325I?
The XC7A15T-2CSG325I supports DDR3 SDRAM interfaces up to 800 Mbps per pin (400 MHz clock), as specified in Xilinx UG475 v1.12. This enables use with standard DDR3-800 components in point-to-point or fly-by topologies. The XC7A15T-2CSG325I includes dedicated DDR3 I/O banks with calibrated output drivers and input delay controls, but does not integrate a hard memory controller - implementation relies on the MIG IP core in Vivado.
Does the XC7A15T-2CSG325I include a built-in PCIe controller?
No, the XC7A15T-2CSG325I does not include a hard PCIe Gen2 endpoint controller. That feature is reserved for larger Spartan-7 devices (e.g., XC7S50 and above) in packages with ≥484 pins. The XC7A15T-2CSG325I supports PCIe connectivity only via soft logic implementations, which consume logic resources and offer lower throughput than hard IP.
What configuration modes are supported by the XC7A15T-2CSG325I?
The XC7A15T-2CSG325I supports Master SPI, Slave SelectMAP, and JTAG configuration modes per UG470 v1.11. Master SPI uses on-chip oscillator and CCLK to read bitstream from external SPI flash; Slave SelectMAP allows microcontroller-initiated configuration; JTAG is used for debugging and programming during development. All modes are accessible through dedicated pins in the CSG325 package.
Is the XC7A15T-2CSG325I qualified for automotive applications?
No, the XC7A15T-2CSG325I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While its thermal specification overlaps with some automotive under-hood environments, AMD does not certify this part for automotive safety-critical systems. For automotive use, designers should select Xilinx Automotive (XA) variants such as XA7A15T, which undergo additional screening and qualification testing.
Can the XC7A15T-2CSG325I perform partial reconfiguration in the field?
Yes, the XC7A15T-2CSG325I supports partial reconfiguration (PR) as defined in UG908 v1.10. PR allows dynamic replacement of logic modules while the rest of the design remains operational - enabling runtime adaptation, firmware updates, and multi-function time-sharing. Implementation requires Vivado 2022.2 or later, PR-enabled IP, and careful floorplanning; the XC7A15T-2CSG325I's 15,840 logic cells provide sufficient resource margin for typical PR partitions.
XC7A15T-2CSG325I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1300
- Number of Logic Elements/Cells:
- 16640
- Total RAM Bits:
- 921600
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A15T-2CSG325I FAQ
1.How can I place an order for XC7A15T-2CSG325I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A15T-2CSG325I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A15T-2CSG325I reliable?
The price and inventory of XC7A15T-2CSG325I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A15T-2CSG325I is usually 5 days.
3.What payment methods are accepted for XC7A15T-2CSG325I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A15T-2CSG325I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A15T-2CSG325I?
XC7A15T-2CSG325I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A15T-2CSG325I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A15T-2CSG325I?
For technical support, including XC7A15T-2CSG325I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A15T-2CSG325I requirements.
6.How does Aetrix verify that XC7A15T-2CSG325I is sourced from the original manufacturer or authorized distributors?
All XC7A15T-2CSG325I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A15T-2CSG325I meets industry standards.
7.What is the process for return or replacement of XC7A15T-2CSG325I?
All XC7A15T-2CSG325I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A15T-2CSG325I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A15T-2CSG325I part is unused and in its original packaging.
Return procedure for XC7A15T-2CSG325I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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