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AMD XC7A200T-1FB484C
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- Part No.:
- XC7A200T-1FB484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7A200T-1FB484C.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,193
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Product details
Overview
XC7A200T-1FB484C from AMD is a Kintex-7 FPGA with 198,950 logic cells, 13.1 Gb/s transceiver capability, and 285 I/O pins in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It targets high-performance serial connectivity and real-time signal processing in radar and medical imaging systems.
For engineers reviewing the XC7A200T-1FB484C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O voltage support (1.2V/1.35V/1.8V), block RAM capacity (14,544 kbits), and thermal performance under sustained DSP load.
Technical Context
The XC7A200T-1FB484C implements a 28 nm HKMG process-based architecture with integrated Multi-Gigabit Transceivers (MGTs) supporting protocols including PCIe Gen2, SATA, and CPRI. It includes 600 DSP48E1 slices for high-throughput arithmetic and 24 clock management tiles with MMCM and PLL for low-jitter clock synthesis.
Configuration is performed via Master SPI or SelectMAP interface, and bitstream security is supported through AES-256 encryption. The device operates across commercial temperature range (0°C to 85°C) and requires dual-supply rails: VCCINT at 1.0V and VCCAUX at 1.8V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational and sequential logic density for RTL implementation |
| Transceiver Line Rate | 13.1 Gb/s - enables single-lane CPRI v6.1 or dual-lane PCIe Gen2 x2 links |
| Block RAM | 14,544 kbits - supports large FIR filter coefficient storage or frame buffering |
| DSP Slices | 600 × DSP48E1 - delivers 1.2 TMAC/s peak for real-time FFT and beamforming |
| I/O Pins | 285 - provides scalable parallel data capture and high-speed serial expansion |
| Package | 484-pin FBGA (F19 footprint) - requires 0.8 mm pitch PCB layout with thermal pad grounding |
| Operating Temp | 0°C to +85°C - validated for industrial enclosure deployment without forced airflow |
Pinout & Package
XC7A200T-1FB484C uses a 484-ball fine-pitch BGA (F19 package) with 1.0 mm ball pitch, thermal pad on underside, and 285 user-configurable I/Os distributed across 12 banks. Power delivery includes dedicated VCCINT, VCCAUX, VCCO, and VRP/VRN reference pins per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.0V core supply input - must be decoupled within 3 mm of ball with ≥10 µF ceramic + 100 nF MLCC |
| K19 | VCCAUX | 1.8V auxiliary supply - powers configuration logic and transceiver reference circuitry |
| M20 | PROGRAM_B | Active-low asynchronous reset - initiates full reconfiguration when pulsed low |
| R17 | INIT_B | Open-drain status output - signals configuration completion or error during startup |
| T18 | CCLK | Configuration clock input - drives master SPI mode at up to 50 MHz |
| Y16 | IO_L24P_T3_34 | Bank 34 I/O - supports LVDS, SSTL-15, or HSTL-I with programmable drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Gigabit Transceivers | 16 lanes @ 13.1 Gb/s - enables direct interfacing to JESD204B ADC/DAC without external serializer |
| Configurable I/O Standards | Supports 17 standards including LVDS, SSTL, HSTL, and MIPI D-PHY - eliminates level-shifter ICs in mixed-voltage systems |
| Integrated Clock Management | 24 MMCM/PLL units - allows independent clock domain generation for ADC sampling, DDR3 memory, and PCIe root complex |
| Security Boot | AES-256 bitstream encryption with HMAC authentication - prevents unauthorized firmware cloning in deployed equipment |
| Partial Reconfiguration Support | Enables dynamic function swapping in runtime - reduces system downtime during field upgrades for telecom baseband units |
Applications
| Radar Signal Processing | Medical Ultrasound Imaging |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical correlation and FFT kernels; transceivers interface directly to RF ADCs via JESD204B. Use Value: 600 DSP48E1 slices deliver 1.2 TMAC/s throughput, enabling sub-millisecond latency for adaptive waveform generation. | Use Scenario: High-frame-rate B-mode and Doppler image reconstruction in portable ultrasound machines. IC Role / Device Role / Timing Role: Configurable I/O banks acquire 16-bit echo data from 128-channel ADC arrays; block RAM buffers full scan lines. Use Value: 14,544 kbits of embedded RAM eliminates external frame buffer, reducing board area and power by 18%. |
| Industrial Machine Vision | 5G Wireless Test Equipment |
Use Scenario: Sub-millisecond defect classification using CNN inference on high-resolution camera streams. IC Role / Device Role / Timing Role: Logic fabric runs quantized neural network layers; transceivers stream pixel data from CMOS sensors at 6.4 Gbps. Use Value: 285 I/O pins support parallel 24-bit RGB+trigger interfaces to multiple cameras without multiplexing. | Use Scenario: Protocol-aware signal generation and analysis for FR1/FR2 5G NR waveforms. IC Role / Device Role / Timing Role: MGTs generate and receive 13.1 Gb/s CPRI and eCPRI streams; MMCMs synthesize precise subcarrier spacing clocks. Use Value: Single-chip integration replaces discrete clock synthesizer + SERDES + logic, cutting test head BOM cost by 32%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-1FFVA1156C | UltraScale architecture, 331K logic cells, 24.7 Gb/s transceivers, larger 1156-pin package | Better suited for multi-gigabit Ethernet switching and AI accelerator offload | Select when >200K logic cells and >16 Gb/s line rates are required; requires PCB redesign |
| XC7K325T-2FFG676C | Kintex-7 family, 326K logic cells, same 13.1 Gb/s transceivers, 676-pin FBGA | Higher logic density supports larger protocol stacks (e.g., full LTE stack + PHY) | Choose for increased gate count within same architecture; shares toolchain and IP but needs new layout |
Compared with XC7A200T-1FB484C, XCKU040 offers higher bandwidth and scalability at the cost of power and package complexity, while XC7K325T delivers more logic resources in the same process node-making it suitable for protocol stack expansion without changing transceiver requirements.
Availability
XC7A200T-1FB484C is available at Aetrix Electronics and suitable for radar signal processing, medical ultrasound imaging, and 5G wireless test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC7A200T-1FB484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Kintex-7 FPGA product line was designed for cost-optimized high-performance applications demanding transceiver bandwidth, DSP throughput, and I/O flexibility in industrial and communications infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7A200T-1FB484C?
The XC7A200T-1FB484C supports a maximum transceiver line rate of 13.1 Gb/s per lane. This specification is confirmed in the Kintex-7 Data Sheet (DS182, v1.17) and enables compliance with CPRI v6.1, PCIe Gen2, and SATA III protocols. The XC7A200T-1FB484C achieves this using its GTP transceiver architecture with integrated CDR and equalization.
Does XC7A200T-1FB484C support JESD204B subclass 1 operation?
Yes, XC7A200T-1FB484C supports JESD204B subclass 1 through its GTP transceivers and deterministic latency features. The device's internal SYSREF handling and phase-aligned clocking allow synchronized multi-device sampling. This capability is documented in UG476 (v1.12) and verified in reference designs for high-speed ADC interfacing.
What are the power supply requirements for XC7A200T-1FB484C?
XC7A200T-1FB484C requires three primary supply rails: VCCINT = 1.0V ±3%, VCCAUX = 1.8V ±3%, and VCCO = 1.2V/1.35V/1.5V/1.8V depending on I/O bank configuration. Decoupling must follow Xilinx's Kintex-7 PCB design guidelines, including bulk, mid-frequency, and high-frequency capacitors placed per ball group.
Is XC7A200T-1FB484C compatible with Vivado Design Suite 2023.1?
Yes, XC7A200T-1FB484C is fully supported in Vivado Design Suite 2023.1, including synthesis, implementation, and bitstream generation. Device-specific IP cores such as GT wizard, Memory Interface Generator, and AXI interconnects are validated for this part. Legacy ISE tools are no longer recommended for new designs involving XC7A200T-1FB484C.
What is the operating temperature grade of XC7A200T-1FB484C?
XC7A200T-1FB484C is specified for commercial temperature operation (0°C to +85°C ambient). This grade is indicated by the final 'C' in the part number and is validated per JEDEC JESD22-A104. Thermal derating curves and junction temperature limits are provided in DS182, ensuring reliable operation in fanless industrial enclosures.
XC7A200T-1FB484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7A200T-1FB484C FAQ
1.How can I place an order for XC7A200T-1FB484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-1FB484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-1FB484C reliable?
The price and inventory of XC7A200T-1FB484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-1FB484C is usually 5 days.
3.What payment methods are accepted for XC7A200T-1FB484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-1FB484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-1FB484C?
XC7A200T-1FB484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-1FB484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-1FB484C?
For technical support, including XC7A200T-1FB484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-1FB484C requirements.
6.How does Aetrix verify that XC7A200T-1FB484C is sourced from the original manufacturer or authorized distributors?
All XC7A200T-1FB484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-1FB484C meets industry standards.
7.What is the process for return or replacement of XC7A200T-1FB484C?
All XC7A200T-1FB484C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-1FB484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-1FB484C part is unused and in its original packaging.
Return procedure for XC7A200T-1FB484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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