AMD XC7A200T-1FB676I
- Part No.:
- XC7A200T-1FB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7A200T-1FB676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,941
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7A200T-1FB676I from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA with 198,950 logic cells, 13.1 Mb of block RAM, and 740 DSP slices, packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch. It operates at -1 speed grade (1.0 ns CLB delay), supports I/O voltages from 1.2 V to 3.3 V, and targets high-bandwidth, cost-sensitive embedded vision and industrial control applications.
For engineers reviewing the XC7A200T-1FB676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, transceiver count (16 GTP serial transceivers), I/O bank configuration (24 banks), thermal performance (industrial temperature range –40°C to +100°C), and JTAG/debug interface support.
Technical Context
The XC7A200T-1FB676I implements a fully programmable fabric based on 6-input LUTs and distributed RAM, with integrated clock management including MMCM and PLL blocks for jitter reduction and frequency synthesis. It includes SelectIO technology supporting LVDS, SSTL, HSTL, and MIPI D-PHY standards across configurable I/O banks.
Its 16 GTP transceivers operate up to 3.75 Gb/s and support protocols including PCIe Gen1/Gen2, SATA, and CPRI. Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption and HMAC authentication available for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational and sequential logic density for custom digital functions |
| Block RAM | 13.1 Mb - enables large on-chip data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 740 - supports parallel multiply-accumulate operations for real-time filtering and FFT processing |
| GTP Transceivers | 16 × 3.75 Gb/s - provides native SerDes for high-speed serial interfaces like PCIe and SATA |
| I/O Banks | 24 - allows independent voltage and standard assignment per bank for mixed-signal interfacing |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under worst-case conditions |
Pinout & Package
XC7A200T-1FB676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch, 27 × 27 array, and thermal lid. The package supports reflow soldering per IPC/JEDEC J-STD-020 and includes dedicated power, ground, configuration, and multi-standard I/O balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT / VCCAUX / VCCO | Core, auxiliary, and I/O supply rails | Three independent power domains enable low-power core operation while supporting mixed-voltage I/O interfaces |
| M0–M2 | Configuration mode select | Determines boot source (SPI/BPI/JTAG) and configuration width during power-up |
| CCLK / INIT_B / PROGRAM_B | Configuration clock and control | Controls synchronous configuration flow and device reset/reinitialization sequence |
| IO_Lx_y | Configurable I/O bank pins | Each supports selectable I/O standards (LVDS, SSTL, etc.) and internal termination |
| GTX_CLK / GTX_TX / GTX_RX | GTP transceiver differential pairs | Provide full-duplex high-speed serial links with built-in clock recovery and equalization |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reboot-critical for adaptive radar and protocol gateways |
| Integrated PCI Express Endpoint | Hard IP block supporting Gen1/Gen2 x1/x2/x4 configurations reduces FPGA resource usage and verification effort |
| AXI Interconnect Infrastructure | Provides standardized, scalable on-chip communication between processors, peripherals, and accelerators |
| Secure Boot with AES/HMAC | Protects bitstream integrity and confidentiality against cloning and tampering in field-deployed systems |
| UltraScale-Compatible Toolflow | Allows migration path to higher-density families using same Vivado design environment and IP library |
Applications
| Industrial Machine Vision | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction on high-resolution camera inputs in factory-floor inspection systems. IC Role / Device Role / Timing Role: Configurable logic fabric executes pixel-level algorithms; GTP transceivers stream raw sensor data from CMOS image sensors. Use Value: Eliminates need for external frame grabbers and DSP chips by integrating processing, I/O, and memory control in one device. | Use Scenario: High-precision signal generation, capture, and analysis across multiple DUT channels with synchronized timing. IC Role / Device Role / Timing Role: Acts as pattern generator, digitizer controller, and timing engine-coordinating DAC/ADC sampling clocks and trigger distribution. Use Value: Achieves sub-nanosecond inter-channel skew control and deterministic latency via dedicated clock networks and deterministic routing. |
| Medical Imaging Interface | Defense Radar Signal Processing |
Use Scenario: Aggregation and protocol translation of ultrasound, MRI, and CT sensor data streams into DICOM-compliant network packets. IC Role / Device Role / Timing Role: Bridges legacy analog/digital sensor interfaces to Gigabit Ethernet and PCIe host systems using AXI-based DMA engines. Use Value: Reduces system BOM by consolidating interface bridging, packet assembly, and error correction logic into a single XC7A200T-1FB676I. | Use Scenario: Pulse-Doppler processing and beamforming in compact, conduction-cooled radar modules operating in harsh environments. IC Role / Device Role / Timing Role: Implements real-time FFT, CFAR detection, and adaptive filtering pipelines with deterministic latency and thermal resilience. Use Value: Delivers 740 DSP slices and 13.1 Mb block RAM to sustain sustained 2.4 GFLOPS throughput within industrial temperature limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K160T-1FB676I | Higher logic density (162,240 LUTs), Kintex-7 family, 2.5x more DSP slices (1,440), no GTP (uses GTX) | Better suited for compute-intensive radar or video encoding where DSP and memory bandwidth dominate | Select when >300 DSP slices or PCIe Gen3 support is required; requires board redesign due to different transceiver architecture |
| XC7A100T-1CSG324I | Lower logic count (101,440 LUTs), smaller 324-pin CSBG package, same -1 speed grade and GTP count (16) | Ideal for space-constrained designs where full XC7A200T capacity is unused | Choose for cost-optimized, lower-I/O-count applications; pin-compatible only within Artix-7 FBGA footprint variants-not drop-in with XC7A200T-1FB676I |
Compared with XC7A200T-1FB676I, the XC7K160T-1FB676I offers higher computational throughput but increased power and cost, while the XC7A100T-1CSG324I reduces footprint and bill-of-materials at the expense of logic and memory resources-making each suitable for distinct performance/cost/space trade-offs.
Availability
XC7A200T-1FB676I is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term lifecycle assurance.
Supply support for XC7A200T-1FB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Artix-7 family, including XC7A200T-1FB676I, was designed for cost-sensitive, high-performance embedded applications demanding serial connectivity, DSP capability, and industrial temperature operation.
FAQ
What is the maximum supported I/O standard voltage for XC7A200T-1FB676I?
The XC7A200T-1FB676I supports I/O bank voltages from 1.2 V to 3.3 V, with each of its 24 I/O banks independently configurable. This allows simultaneous interfacing with DDR3 (1.5 V), LVDS (2.5 V), and 3.3 V peripherals without level-shifting circuitry. The XC7A200T-1FB676I datasheet specifies VCCO tolerance of ±3% and supports internal termination for SSTL and HSTL standards.
Does XC7A200T-1FB676I include hardened PCIe endpoints?
Yes, XC7A200T-1FB676I integrates a hardened PCI Express endpoint block supporting Gen1 and Gen2 protocols at x1, x2, and x4 widths. This hard IP reduces logic utilization and timing closure effort compared to soft-core implementations. The XC7A200T-1FB676I does not support PCIe Gen3, which requires GTX transceivers found in Kintex-7 or Virtex-7 devices.
What configuration modes are supported by XC7A200T-1FB676I?
XC7A200T-1FB676I supports master SPI, slave SPI, master BPI, slave BPI, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Quad-SPI mode enables fast, secure bitstream loading from serial flash, while JTAG supports boundary-scan testing and in-system programming. The XC7A200T-1FB676I also supports fallback configuration and multi-boot for field-upgradable designs.
Is XC7A200T-1FB676I qualified for automotive applications?
No, XC7A200T-1FB676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure rate reporting, and extended temperature screening. For automotive use, AMD offers the XA Artix-7 family (e.g., XA7A200T), which shares the same architecture but includes automotive qualification and enhanced ESD/latch-up immunity.
How many GTP transceivers does XC7A200T-1FB676I have, and what is their maximum data rate?
XC7A200T-1FB676I contains 16 GTP transceivers, each capable of operation up to 3.75 Gb/s. These transceivers support common protocols including PCIe Gen1/Gen2, SATA, CPRI, and Aurora. They include built-in clock data recovery (CDR), TX pre-emphasis, and RX equalization. The XC7A200T-1FB676I does not include GTX or GTH transceivers, which are found in higher-tier FPGA families.
XC7A200T-1FB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7A200T-1FB676I FAQ
1.How can I place an order for XC7A200T-1FB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-1FB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-1FB676I reliable?
The price and inventory of XC7A200T-1FB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-1FB676I is usually 5 days.
3.What payment methods are accepted for XC7A200T-1FB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-1FB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-1FB676I?
XC7A200T-1FB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-1FB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-1FB676I?
For technical support, including XC7A200T-1FB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-1FB676I requirements.
6.How does Aetrix verify that XC7A200T-1FB676I is sourced from the original manufacturer or authorized distributors?
All XC7A200T-1FB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-1FB676I meets industry standards.
7.What is the process for return or replacement of XC7A200T-1FB676I?
All XC7A200T-1FB676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-1FB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-1FB676I part is unused and in its original packaging.
Return procedure for XC7A200T-1FB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7A200T-1FB676I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
