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AMD XC7A200T-1FB676I

Part No.:
XC7A200T-1FB676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC7A200T-1FB676I.pdf
Description:
IC FPGA 400 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,941

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Product details

Overview

XC7A200T-1FB676I from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA with 198,950 logic cells, 13.1 Mb of block RAM, and 740 DSP slices, packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch. It operates at -1 speed grade (1.0 ns CLB delay), supports I/O voltages from 1.2 V to 3.3 V, and targets high-bandwidth, cost-sensitive embedded vision and industrial control applications.

For engineers reviewing the XC7A200T-1FB676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, transceiver count (16 GTP serial transceivers), I/O bank configuration (24 banks), thermal performance (industrial temperature range –40°C to +100°C), and JTAG/debug interface support.

Technical Context

The XC7A200T-1FB676I implements a fully programmable fabric based on 6-input LUTs and distributed RAM, with integrated clock management including MMCM and PLL blocks for jitter reduction and frequency synthesis. It includes SelectIO technology supporting LVDS, SSTL, HSTL, and MIPI D-PHY standards across configurable I/O banks.

Its 16 GTP transceivers operate up to 3.75 Gb/s and support protocols including PCIe Gen1/Gen2, SATA, and CPRI. Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption and HMAC authentication available for secure boot.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells198,950 - determines maximum combinational and sequential logic density for custom digital functions
Block RAM13.1 Mb - enables large on-chip data buffering, FIFOs, and lookup tables without external memory
DSP Slices740 - supports parallel multiply-accumulate operations for real-time filtering and FFT processing
GTP Transceivers16 × 3.75 Gb/s - provides native SerDes for high-speed serial interfaces like PCIe and SATA
I/O Banks24 - allows independent voltage and standard assignment per bank for mixed-signal interfacing
Operating Temp–40°C to +100°C - qualified for industrial environments without derating
Speed Grade-1 - guarantees timing closure at 1.0 ns CLB propagation delay under worst-case conditions

Pinout & Package

XC7A200T-1FB676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch, 27 × 27 array, and thermal lid. The package supports reflow soldering per IPC/JEDEC J-STD-020 and includes dedicated power, ground, configuration, and multi-standard I/O balls.

Pin/TerminalCircuit RoleDesign Meaning
VCCINT / VCCAUX / VCCOCore, auxiliary, and I/O supply railsThree independent power domains enable low-power core operation while supporting mixed-voltage I/O interfaces
M0–M2Configuration mode selectDetermines boot source (SPI/BPI/JTAG) and configuration width during power-up
CCLK / INIT_B / PROGRAM_BConfiguration clock and controlControls synchronous configuration flow and device reset/reinitialization sequence
IO_Lx_yConfigurable I/O bank pinsEach supports selectable I/O standards (LVDS, SSTL, etc.) and internal termination
GTX_CLK / GTX_TX / GTX_RXGTP transceiver differential pairsProvide full-duplex high-speed serial links with built-in clock recovery and equalization

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic logic module swapping without full device reboot-critical for adaptive radar and protocol gateways
Integrated PCI Express EndpointHard IP block supporting Gen1/Gen2 x1/x2/x4 configurations reduces FPGA resource usage and verification effort
AXI Interconnect InfrastructureProvides standardized, scalable on-chip communication between processors, peripherals, and accelerators
Secure Boot with AES/HMACProtects bitstream integrity and confidentiality against cloning and tampering in field-deployed systems
UltraScale-Compatible ToolflowAllows migration path to higher-density families using same Vivado design environment and IP library

Applications

Industrial Machine VisionAutomated Test Equipment (ATE)

Use Scenario: Real-time image preprocessing and feature extraction on high-resolution camera inputs in factory-floor inspection systems.

IC Role / Device Role / Timing Role: Configurable logic fabric executes pixel-level algorithms; GTP transceivers stream raw sensor data from CMOS image sensors.

Use Value: Eliminates need for external frame grabbers and DSP chips by integrating processing, I/O, and memory control in one device.

Use Scenario: High-precision signal generation, capture, and analysis across multiple DUT channels with synchronized timing.

IC Role / Device Role / Timing Role: Acts as pattern generator, digitizer controller, and timing engine-coordinating DAC/ADC sampling clocks and trigger distribution.

Use Value: Achieves sub-nanosecond inter-channel skew control and deterministic latency via dedicated clock networks and deterministic routing.

Medical Imaging InterfaceDefense Radar Signal Processing

Use Scenario: Aggregation and protocol translation of ultrasound, MRI, and CT sensor data streams into DICOM-compliant network packets.

IC Role / Device Role / Timing Role: Bridges legacy analog/digital sensor interfaces to Gigabit Ethernet and PCIe host systems using AXI-based DMA engines.

Use Value: Reduces system BOM by consolidating interface bridging, packet assembly, and error correction logic into a single XC7A200T-1FB676I.

Use Scenario: Pulse-Doppler processing and beamforming in compact, conduction-cooled radar modules operating in harsh environments.

IC Role / Device Role / Timing Role: Implements real-time FFT, CFAR detection, and adaptive filtering pipelines with deterministic latency and thermal resilience.

Use Value: Delivers 740 DSP slices and 13.1 Mb block RAM to sustain sustained 2.4 GFLOPS throughput within industrial temperature limits.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC7K160T-1FB676IHigher logic density (162,240 LUTs), Kintex-7 family, 2.5x more DSP slices (1,440), no GTP (uses GTX)Better suited for compute-intensive radar or video encoding where DSP and memory bandwidth dominateSelect when >300 DSP slices or PCIe Gen3 support is required; requires board redesign due to different transceiver architecture
XC7A100T-1CSG324ILower logic count (101,440 LUTs), smaller 324-pin CSBG package, same -1 speed grade and GTP count (16)Ideal for space-constrained designs where full XC7A200T capacity is unusedChoose for cost-optimized, lower-I/O-count applications; pin-compatible only within Artix-7 FBGA footprint variants-not drop-in with XC7A200T-1FB676I

Compared with XC7A200T-1FB676I, the XC7K160T-1FB676I offers higher computational throughput but increased power and cost, while the XC7A100T-1CSG324I reduces footprint and bill-of-materials at the expense of logic and memory resources-making each suitable for distinct performance/cost/space trade-offs.

Availability

XC7A200T-1FB676I is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term lifecycle assurance.

Supply support for XC7A200T-1FB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Artix-7 family, including XC7A200T-1FB676I, was designed for cost-sensitive, high-performance embedded applications demanding serial connectivity, DSP capability, and industrial temperature operation.

FAQ

What is the maximum supported I/O standard voltage for XC7A200T-1FB676I?

The XC7A200T-1FB676I supports I/O bank voltages from 1.2 V to 3.3 V, with each of its 24 I/O banks independently configurable. This allows simultaneous interfacing with DDR3 (1.5 V), LVDS (2.5 V), and 3.3 V peripherals without level-shifting circuitry. The XC7A200T-1FB676I datasheet specifies VCCO tolerance of ±3% and supports internal termination for SSTL and HSTL standards.

Does XC7A200T-1FB676I include hardened PCIe endpoints?

Yes, XC7A200T-1FB676I integrates a hardened PCI Express endpoint block supporting Gen1 and Gen2 protocols at x1, x2, and x4 widths. This hard IP reduces logic utilization and timing closure effort compared to soft-core implementations. The XC7A200T-1FB676I does not support PCIe Gen3, which requires GTX transceivers found in Kintex-7 or Virtex-7 devices.

What configuration modes are supported by XC7A200T-1FB676I?

XC7A200T-1FB676I supports master SPI, slave SPI, master BPI, slave BPI, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Quad-SPI mode enables fast, secure bitstream loading from serial flash, while JTAG supports boundary-scan testing and in-system programming. The XC7A200T-1FB676I also supports fallback configuration and multi-boot for field-upgradable designs.

Is XC7A200T-1FB676I qualified for automotive applications?

No, XC7A200T-1FB676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure rate reporting, and extended temperature screening. For automotive use, AMD offers the XA Artix-7 family (e.g., XA7A200T), which shares the same architecture but includes automotive qualification and enhanced ESD/latch-up immunity.

How many GTP transceivers does XC7A200T-1FB676I have, and what is their maximum data rate?

XC7A200T-1FB676I contains 16 GTP transceivers, each capable of operation up to 3.75 Gb/s. These transceivers support common protocols including PCIe Gen1/Gen2, SATA, CPRI, and Aurora. They include built-in clock data recovery (CDR), TX pre-emphasis, and RX equalization. The XC7A200T-1FB676I does not include GTX or GTH transceivers, which are found in higher-tier FPGA families.

XC7A200T-1FB676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Artix-7
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
16825
Number of Logic Elements/Cells:
215360
Total RAM Bits:
13455360
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC7A200T-1FB676I FAQ

1.How can I place an order for XC7A200T-1FB676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7A200T-1FB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7A200T-1FB676I reliable?

The price and inventory of XC7A200T-1FB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-1FB676I is usually 5 days.

3.What payment methods are accepted for XC7A200T-1FB676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-1FB676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7A200T-1FB676I?

XC7A200T-1FB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7A200T-1FB676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7A200T-1FB676I?

For technical support, including XC7A200T-1FB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-1FB676I requirements.

6.How does Aetrix verify that XC7A200T-1FB676I is sourced from the original manufacturer or authorized distributors?

All XC7A200T-1FB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-1FB676I meets industry standards.

7.What is the process for return or replacement of XC7A200T-1FB676I?

All XC7A200T-1FB676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-1FB676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7A200T-1FB676I part is unused and in its original packaging.

Return procedure for XC7A200T-1FB676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7A200T-1FB676I Tags

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