AMD XC7A200T-1FBG484C

Overview

XC7A200T-1FBG484C from AMD is a Kintex-7 FPGA featuring 198,950 logic cells, 13.1 Gb/s transceiver capability, and 285 DSP slices, deployed in high-speed serial interface bridging and industrial vision processing systems.

For engineers reviewing the XC7A200T-1FBG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (16 GTs), and thermal design power (14.5 W at typical conditions).

Technical Context

The XC7A200T-1FBG484C implements a 28 nm HKMG process architecture with integrated Block RAM (2,860 × 36 Kb), UltraScale-compatible configuration interface, and SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards. It includes dual 10-bit ADCs for system monitoring and supports JTAG, ICAP, and PCIe Gen2 x8 configuration modes.

This device integrates 16 multi-gigabit transceivers operating up to 13.1 Gb/s with built-in PRBS generators/checkers, 8 clock management tiles (CMT) each containing a PLL and MMCM, and supports partial reconfiguration via ICAP for dynamic function swapping in real-time control applications.

Key Specifications

Pinout & Package

XC7A200T-1FBG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm pitch, 23 mm × 23 mm body size, and Pb-free / RoHS-compliant construction. Thermal pad exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.

Compared with XC7A200T-1FBG484C, XCKU040 offers higher bandwidth and scalability but requires new PCB layout and toolchain migration, while XC7K325T delivers greater logic capacity and extended temperature tolerance at the cost of higher power and package size.

Availability

XC7A200T-1FBG484C is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging interface designs requiring stable component supply across multi-year production cycles.

Supply support for XC7A200T-1FBG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client platforms.

The Kintex-7 FPGA product line targets high-performance, cost-sensitive applications including wired communications, video processing, and test equipment where balanced logic density, transceiver count, and power efficiency are critical.

FAQ

What is the maximum supported transceiver data rate for XC7A200T-1FBG484C?

The XC7A200T-1FBG484C supports transceiver data rates up to 13.1 Gb/s per lane. This specification is validated across all 16 GT transceivers under standard operating conditions (junction temperature ≤ 85°C, VCCAUX = 1.8 V ±3%). The device implements built-in PRBS generators and checkers for compliance testing at this rate.

Does XC7A200T-1FBG484C support partial reconfiguration?

Yes, XC7A200T-1FBG484C supports partial reconfiguration through its ICAP interface. This allows dynamic swapping of logic modules during operation without resetting the entire device. Implementation requires Vivado Design Suite 2018.3 or later and adherence to frame-based boundary constraints defined in UG909.

What I/O standards are supported by XC7A200T-1FBG484C?

XC7A200T-1FBG484C supports SSTL-18, SSTL-15, HSTL-I, HSTL-II, LVCMOS 1.2 V to 3.3 V, and differential standards including LVDS, BLVDS, and RSDS. Each I/O bank operates independently, enabling mixed-voltage interfaces such as DDR3 memory (1.5 V) alongside 3.3 V peripherals on the same device.

What is the thermal design power (TDP) of XC7A200T-1FBG484C?

The thermal design power of XC7A200T-1FBG484C is 14.5 W under typical operating conditions (25°C ambient, 50% logic utilization, active transceivers). This value guides heatsink sizing and airflow requirements. Actual power varies with configuration, clock frequency, and I/O activity, and can be estimated using Xilinx Power Estimator (XPE) v2022.2.

Is XC7A200T-1FBG484C compatible with Vivado Design Suite?

Yes, XC7A200T-1FBG484C is fully supported in Vivado Design Suite starting from version 2013.2. All synthesis, implementation, and bitstream generation flows-including timing closure, debug IP integration (ILA/VIO), and partial reconfiguration-are validated for this part in current releases (v2023.2 and later).