AMD XC7A200T-1FBG484I

Overview

XC7A200T-1FBG484I from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA featuring 195,456 logic cells, 13.1 Mb of block RAM, 960 DSP slices, and support for transceivers up to 6.6 Gb/s. It is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch and operates at -40°C to +100°C junction temperature. It is used in high-speed industrial imaging systems requiring deterministic latency and real-time pixel processing.

For engineers reviewing the XC7A200T-1FBG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (300 user-configurable), transceiver lane count (16), LVDS support, configuration interface options (SPI/BPI), and thermal performance under sustained 1.0W dynamic power.

Technical Context

The XC7A200T-1FBG484I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated carry chains, and integrated clock management tiles (CMTs) containing MMCM and PLL blocks. It supports SelectIO standards including LVCMOS, LVDS, TMDS, and RSDS across 300 user I/O pins.

Configuration is performed via Master SPI or Slave Parallel modes using external flash or processor-controlled interfaces. The device includes internal configuration memory, ICAP port for partial reconfiguration, and built-in JTAG boundary-scan support per IEEE 1149.1.

Key Specifications

Pinout & Package

XC7A200T-1FBG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch, 23 × 23 mm body size, and RoHS-compliant lead-free finish. Thermal characteristics include θ_JA = 15.2°C/W and θ_JB = 3.5°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC7A200T-1FBG484I, the XCKU035-1FFVA676I delivers higher throughput but increases BOM cost and thermal complexity, while the XC7A100T-1CSG324I reduces board area and power at the expense of real-time processing depth and I/O scalability.

Availability

XC7A200T-1FBG484I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging equipment, and avionics data concentrators requiring stable component supply across long production lifecycles.

Supply support for XC7A200T-1FBG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio for data center, AI, and embedded markets.

The Artix-7 family was designed for cost-sensitive, high-performance applications demanding low power and small form factor, especially in industrial automation, video processing, and communications infrastructure.

FAQ

What is the maximum supported transceiver data rate for XC7A200T-1FBG484I?

The XC7A200T-1FBG484I supports transceiver line rates up to 6.6 Gb/s per lane. This specification is validated across all 16 transceiver quads in the device and applies to protocols including CPRI, JESD204B, and DisplayPort 1.2. The XC7A200T-1FBG484I achieves this rate with built-in equalization and clock-data recovery circuitry, and does not require external retimers for compliant operation within specified voltage and temperature ranges.

Does XC7A200T-1FBG484I support partial reconfiguration?

Yes, XC7A200T-1FBG484I supports partial reconfiguration via its ICAP (Internal Configuration Access Port). This capability allows dynamic logic module swapping during operation without resetting the entire device. The XC7A200T-1FBG484I implements this using frame-based bitstream loading and hardware-enforced isolation between static and reconfigurable regions, enabling field-upgradable functionality in deployed systems.

What configuration modes are supported by XC7A200T-1FBG484I?

XC7A200T-1FBG484I supports four primary configuration modes: Master SPI, Slave Parallel, JTAG, and BPI (x16/x32). Mode selection is controlled by M0–M2 pins at power-up. The XC7A200T-1FBG484I also supports fallback configuration and dual-boot from two separate flash devices, enhancing reliability in mission-critical applications.

What is the operating temperature range for XC7A200T-1FBG484I?

The XC7A200T-1FBG484I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating is verified per JEDEC JESD22-A104 and applies to continuous operation under specified voltage and thermal conditions. The XC7A200T-1FBG484I maintains full timing compliance and functional integrity across this range without derating.

How many DSP slices does XC7A200T-1FBG484I contain?

XC7A200T-1FBG484I contains 960 dedicated DSP48E1 slices. Each slice supports 25 × 18-bit signed multiplication, pre-addition, accumulation, and pattern detection. These resources are fully utilized in the XC7A200T-1FBG484I's architecture for high-throughput arithmetic in applications such as FIR filtering, FFT computation, and motor vector control.