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AMD XC7A200T-1FBG676C
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- Part No.:
- XC7A200T-1FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7A200T-1FBG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:313
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Product details
Overview
XC7A200T-1FBG676C from AMD is a Kintex-7 FPGA with 198,950 logic cells, 13.1 Gb/s transceiver capability, and 240 DSP slices, deployed in high-speed serial interface bridging and industrial vision processing systems.
For engineers reviewing the XC7A200T-1FBG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (16 GTs), and thermal design power (14.5 W at typical operation).
Technical Context
The XC7A200T-1FBG676C implements a 28 nm HKMG process-based architecture with integrated SelectIO technology supporting single-ended and differential standards including LVDS, SSTL, and HSTL. It includes 16 multi-gigabit transceivers compliant with PCIe Gen2, SATA, and CPRI protocols.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI-Stream interfaces for real-time data path adaptation in embedded vision and test equipment applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for custom IP integration |
| Transceivers | 16 GT lanes - enables dual-lane PCIe Gen2 x2 or four-lane SATA 3.0 links without external retimers |
| DSP Slices | 240 - supports parallel FIR filtering, FFT computation, or matrix multiplication at up to 450 MHz |
| I/O Banks | 12 - allows independent voltage domain assignment per bank for mixed-voltage system interfacing |
| Block RAM | 13,095 kbit - provides on-chip memory for frame buffering, lookup tables, or FIFO depth extension |
| TDP | 14.5 W - defines heatsink sizing and airflow requirements for convection-cooled industrial enclosures |
Pinout & Package
XC7A200T-1FBG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 31 × 31 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in sustained compute workloads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Provides low-impedance return path for all I/O and core domains; 128 dedicated balls allocated |
| VCCINT | Core supply | 1.0 V ±3% supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, clock management, and transceiver analog circuitry |
| MGTAVCC | Transceiver analog supply | 1.0 V supply for GTY/GTP transceiver PLLs and serializers; sensitive to ripple & noise |
| IO_Lx_y | Configurable I/O | Supports 1.2–3.3 V single-ended and differential standards; bank-specific voltage control |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Enables dynamic logic module swapping during operation-critical for adaptive radar waveform updates or protocol stack switching |
| AXI-Stream Interface | Native support for high-throughput, low-latency data streaming between IP blocks without address decoding overhead |
| Bitstream Encryption | HMAC-SHA256 authentication prevents unauthorized configuration loading and intellectual property theft |
| SelectIO Technology | Single I/O pin supports LVDS, TMDS, or RSDS with programmable slew rate and drive strength per pin |
Applications
| Industrial Machine Vision | PCIe-Based Data Acquisition |
|---|---|
Use Scenario: Real-time image preprocessing on factory-floor cameras with sub-millisecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, edge detection, and ROI extraction before sending compressed frames over GigE Vision. Use Value: 240 DSP slices enable parallel Sobel operators; 16 GT lanes support dual 10GBase-T PHY interfaces with deterministic timing. | Use Scenario: High-channel-count oscilloscope front-end digitizing at 1 GS/s with deep memory buffering. IC Role / Device Role / Timing Role: XC7A200T-1FBG676C aggregates ADC samples, applies real-time FFT, and streams results via PCIe Gen2 x4 to host CPU. Use Value: 13.1 Gb/s transceivers sustain full x4 bandwidth; block RAM provides 128 Msample buffer without external DRAM. |
| Wireless Baseband Processing | Test & Measurement Equipment |
Use Scenario: Small-cell LTE eNodeB baseband unit implementing channel coding, modulation, and MIMO precoding. IC Role / Device Role / Timing Role: Configurable logic implements Turbo decoder pipelines and OFDM symbol generation with precise symbol-timing alignment. Use Value: 198,950 logic cells accommodate dual-stream LTE-A Cat6 PHY; transceivers interface directly to RFIC JESD204B links. | Use Scenario: Modular PXI Express instrument controller managing multiple synchronized signal generators and analyzers. IC Role / Device Role / Timing Role: XC7A200T-1FBG676C serves as timing master and data router across backplane slots using deterministic AXI-Stream and PCIe root complex functions. Use Value: 12 I/O banks allow simultaneous LVDS, HSTL, and SSTL signaling; partial reconfiguration enables instrument personality switching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 331K logic cells, higher transceiver speed (16.3 Gb/s), no native PCI Express hard IP | Requires soft PCIe endpoint implementation; better suited for 100G Ethernet or coherent optical transport | Choose when migrating to higher bandwidth or requiring hardened 100G MAC/PCS layers |
| XC7K325T-2FFG676I | Kintex-7 family, same 28 nm node, but 326K logic cells and 20 GT lanes; -2 speed grade increases static power by ~18% | Higher gate count supports larger protocol stacks; wider I/O count accommodates more parallel sensors | Prefer for designs needing >200K logic cells while retaining identical toolchain and pin-compatible board layout |
Compared with XC7A200T-1FBG676C, XCKU040-2FFVA1156I delivers greater throughput at higher power and complexity, while XC7K325T-2FFG676I offers scalable logic density within the same Kintex-7 footprint and design flow-enabling incremental performance upgrades without toolchain migration.
Availability
XC7A200T-1FBG676C is available at Aetrix Electronics and suitable for industrial machine vision, PCIe-based data acquisition, and wireless baseband processing requiring stable component supply across multi-year production cycles.
Supply support for XC7A200T-1FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications through its FPGA, adaptive SoC, and GPU technologies.
The Kintex-7 family, including XC7A200T-1FBG676C, was engineered for cost-optimized high-performance applications demanding balanced logic density, transceiver bandwidth, and power efficiency in industrial and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC7A200T-1FBG676C?
XC7A200T-1FBG676C supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, enabling mixed-voltage interfaces such as 1.8 V DDR3 memory alongside 3.3 V industrial sensors-all within a single XC7A200T-1FBG676C device.
Does XC7A200T-1FBG676C include hardened PCIe Gen2 endpoints?
No, XC7A200T-1FBG676C does not integrate hardened PCIe Gen2 endpoint logic. It relies on Xilinx's LogiCORE IP PCIe Endpoint Block Plus for Gen2 x1/x2/x4 configurations. The 16 GT transceivers provide physical-layer connectivity, but link-layer and transaction-layer functions require soft IP implementation in the XC7A200T-1FBG676C fabric.
What configuration modes are supported by XC7A200T-1FBG676C?
XC7A200T-1FBG676C supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Master SPI is most common for standalone boot; JTAG is used for debugging and programming during development. All modes are implemented in hardware and do not require external microcontroller intervention for basic configuration of XC7A200T-1FBG676C.
Is XC7A200T-1FBG676C qualified for extended temperature operation?
No, XC7A200T-1FBG676C is rated for commercial temperature range only (0 °C to +85 °C ambient). The "C" suffix explicitly denotes commercial grade. For industrial (-40 °C to +100 °C) operation, the equivalent part is XC7A200T-1FBG676I, which undergoes additional screening and characterization per Xilinx/AMD industrial qualification standards.
How many GT transceivers does XC7A200T-1FBG676C include, and what protocols do they support?
XC7A200T-1FBG676C integrates 16 GT (Gigabit Transceiver) lanes. These support line rates from 600 Mb/s to 13.1 Gb/s and are protocol-agnostic-enabling implementation of PCIe Gen2, SATA 3.0, CPRI, SRIO, and custom serial protocols via soft IP in the XC7A200T-1FBG676C fabric.
XC7A200T-1FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7A200T-1FBG676C FAQ
1.How can I place an order for XC7A200T-1FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-1FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-1FBG676C reliable?
The price and inventory of XC7A200T-1FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-1FBG676C is usually 5 days.
3.What payment methods are accepted for XC7A200T-1FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-1FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-1FBG676C?
XC7A200T-1FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-1FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-1FBG676C?
For technical support, including XC7A200T-1FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-1FBG676C requirements.
6.How does Aetrix verify that XC7A200T-1FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7A200T-1FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-1FBG676C meets industry standards.
7.What is the process for return or replacement of XC7A200T-1FBG676C?
All XC7A200T-1FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-1FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-1FBG676C part is unused and in its original packaging.
Return procedure for XC7A200T-1FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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