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AMD XC7A200T-1FBG676I
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- Part No.:
- XC7A200T-1FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7A200T-1FBG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,909
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Product details
Overview
XC7A200T-1FBG676I from AMD is a high-performance Artix-7 FPGA with 198,950 logic cells, 13.1 Gb/s transceiver capability, and -1 speed grade in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It serves as a programmable logic fabric for high-speed serial interface bridging in industrial vision systems.
For engineers reviewing the XC7A200T-1FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver line rate, thermal performance under industrial temperature range (–40°C to +100°C), and configuration interface compatibility (e.g., SelectMAP, JTAG).
Technical Context
The XC7A200T-1FBG676I implements a 28 nm HKMG process-based architecture with integrated Block RAM (2,860 kbits), DSP slices (740), and clock management tiles (CMT) supporting MMCM and PLL. It supports PCI Express Gen2 x4 endpoint functionality and includes hardened Gigabit Transceivers compliant with IEEE 802.3 and CPRI standards.
Configuration is performed via Master SPI or SelectMAP mode using external flash or processor-controlled interfaces. The device supports partial reconfiguration and bitstream encryption using AES-256 with HMAC authentication for secure deployment in edge infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for custom IP integration |
| User I/O Count | 400 - supports high-density parallel bus interfacing and multi-channel sensor aggregation |
| Transceiver Line Rate | 13.1 Gb/s - enables single-lane CPRI v6.1 or dual-lane 10GBASE-R Ethernet PHY implementation |
| Block RAM | 2,860 kbits - provides on-die memory for frame buffering, FIFOs, and lookup tables without external SRAM |
| DSP Slices | 740 - accelerates real-time filtering, FFT, and matrix operations in embedded vision pipelines |
| Operating Temperature | –40°C to +100°C - qualified for extended industrial environments including factory automation controllers |
| Speed Grade | -1 - specifies worst-case timing closure margin at maximum junction temperature and voltage |
Pinout & Package
XC7A200T-1FBG676I is housed in a 676-ball Fine-Pitch BGA (FBGA) package with 0.8 mm ball pitch, designed for high I/O density and thermal dissipation in compact PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (1.0V ±3%) powering CLBs, interconnect, and configuration logic |
| A14 | VCCAUX | 1.8V auxiliary supply for configuration, clocking, and transceiver reference circuitry |
| P15 | VCCO_0 | I/O bank 0 output supply (1.2–3.3V selectable) enabling mixed-voltage interface support |
| T12 | M0/M1/M2 | Configuration mode select pins determining boot source (SPI, BPI, or SelectMAP) |
| R10 | INIT_B | Open-drain status signal indicating configuration memory readiness and error detection |
| Y16 | CCLK | Configuration clock input driving master SPI or slave SelectMAP programming sequence |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation-critical for adaptive radar waveform updates without system reset |
| AES-256 Bitstream Encryption | Prevents unauthorized IP cloning by encrypting configuration data stored in external flash memory |
| Hardened PCIe Gen2 Endpoint | Reduces RTL integration effort and timing closure risk for host-attached acceleration cards |
| Integrated Clock Management (MMCM + PLL) | Generates multiple phase-aligned clocks from a single reference-eliminates need for external clock synthesizers |
| UltraScale-Compatible I/O Standards | Supports LVDS, SSTL, HSTL, and MIPI D-PHY signaling for direct camera and memory interface connectivity |
Applications
| Industrial Machine Vision | 5G Remote Radio Head (RRH) |
|---|---|
Use Scenario: Real-time image preprocessing and defect classification on production lines using multi-camera inputs. IC Role / Device Role / Timing Role: Programmable logic fabric executing pixel-level convolution kernels and high-throughput DMA transfers to DDR3 memory. Use Value: 740 DSP slices enable 128×128 kernel execution at >60 fps without offloading to CPU or GPU. | Use Scenario: Baseband processing and fronthaul interface bridging between FPGA-based digital units and analog radio modules. IC Role / Device Role / Timing Role: High-speed serial bridge converting eCPRI over 10GbE to JESD204B for ADC/DAC synchronization. Use Value: 13.1 Gb/s transceivers support dual JESD204B lanes at subclass 1 timing for deterministic latency in massive MIMO arrays. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Deterministic I/O scanning and motion control loop execution in safety-critical factory automation. IC Role / Device Role / Timing Role: Real-time logic engine implementing IEC 61131-3 instruction sets with sub-microsecond cycle time guarantees. Use Value: –40°C to +100°C operating range ensures reliable operation inside sealed control cabinets without forced cooling. | Use Scenario: High-resolution signal capture and spectral analysis in portable spectrum analyzers. IC Role / Device Role / Timing Role: Time-domain sampling controller synchronizing 16-bit ADCs and managing FFT computation pipelines. Use Value: 2,860 kbits of Block RAM allows storage of 2048-point complex FFT buffers entirely on-die, reducing external memory bandwidth bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Higher logic density (376K LC), UltraScale architecture, 16.3 Gb/s transceivers, larger 1156-ball package | Better suited for full 5G baseband stack offload; requires more PCB area and power delivery headroom | Select when >200K logic cells and Gen3 PCIe or 25G Ethernet are required |
| XC7K325T-2FFG676I | Kintex-7 family, same 676-ball FBGA, but higher speed grade (-2), 325K logic cells, no built-in PCIe hard IP | Preferred for compute-intensive DSP workloads where transceiver count is secondary to raw logic throughput | Choose when prioritizing logic capacity and deterministic timing over integrated protocol engines |
Compared with XC7A200T-1FBG676I, XCKU040-2FFVA1156I offers greater scalability for future-proofing but increases BOM cost and layout complexity, while XC7K325T-2FFG676I delivers higher logic density in identical footprint at expense of hardened PCIe and lower transceiver line rate.
Availability
XC7A200T-1FBG676I is available at Aetrix Electronics and suitable for industrial machine vision, 5G fronthaul gateways, and programmable automation controllers requiring stable component supply across multi-year production cycles.
Supply support for XC7A200T-1FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Artix-7 product line targets cost-sensitive, high-throughput applications in industrial, automotive, and communications infrastructure where low-power programmability and serial connectivity are essential.
FAQ
What is the maximum supported transceiver line rate for XC7A200T-1FBG676I?
The XC7A200T-1FBG676I supports a maximum transceiver line rate of 13.1 Gb/s per lane. This specification is validated per the AMD Artix-7 DC and Switching Characteristics datasheet (DS181). The rate enables compliance with CPRI v6.1, 10GBASE-R, and SATA Gen3 protocols when configured with appropriate reference clocks and termination.
Does XC7A200T-1FBG676I include hardened PCIe Gen2 endpoint logic?
Yes, XC7A200T-1FBG676I integrates a hardened PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification Revision 2.1. This eliminates the need for soft-core PCIe implementations, reduces resource utilization, and guarantees timing closure for endpoint applications such as FPGA-accelerated NICs or storage controllers.
What configuration modes does XC7A200T-1FBG676I support?
XC7A200T-1FBG676I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is commonly used with serial NOR flash, while SelectMAP enables processor-driven partial reconfiguration during runtime.
Is XC7A200T-1FBG676I qualified for industrial temperature operation?
Yes, XC7A200T-1FBG676I is rated for operation from –40°C to +100°C (junction temperature), meeting industrial-grade qualification per AMD's Artix-7 reliability testing standards. This makes it suitable for deployment in uncooled enclosures and harsh ambient environments typical of factory floor equipment.
How many Block RAM resources are available in XC7A200T-1FBG676I?
XC7A200T-1FBG676I provides 2,860 kbits of total Block RAM distributed across 360 BRAM primitives. Each BRAM can be configured as 36 Kb dual-port memory or split into two 18 Kb blocks, supporting independent read/write addressing for applications like video line buffers and protocol state machines.
XC7A200T-1FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7A200T-1FBG676I FAQ
1.How can I place an order for XC7A200T-1FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-1FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-1FBG676I reliable?
The price and inventory of XC7A200T-1FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-1FBG676I is usually 5 days.
3.What payment methods are accepted for XC7A200T-1FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-1FBG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-1FBG676I?
XC7A200T-1FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-1FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-1FBG676I?
For technical support, including XC7A200T-1FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-1FBG676I requirements.
6.How does Aetrix verify that XC7A200T-1FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7A200T-1FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-1FBG676I meets industry standards.
7.What is the process for return or replacement of XC7A200T-1FBG676I?
All XC7A200T-1FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-1FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-1FBG676I part is unused and in its original packaging.
Return procedure for XC7A200T-1FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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