AMD XC7A200T-1FFG1156C

Overview

XC7A200T-1FFG1156C from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA featuring 198,950 logic cells, 13.1 Mb of block RAM, 960 DSP slices, and support for DDR3 memory interfaces up to 800 MHz. It operates at -1 speed grade with 1.0V core voltage and is packaged in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) for high-density board designs in industrial control and video processing systems.

For engineers reviewing the XC7A200T-1FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver capability (16 GTP transceivers up to 3.75 Gb/s), thermal performance (junction temperature range: 0°C to 85°C), and configuration interface options (SPI, SelectMAP, JTAG).

Technical Context

The XC7A200T-1FFG1156C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and integrated clock management tiles (CMTs) containing PLLs and MMCMs. It supports partial reconfiguration and built-in self-test (BIST) for embedded memory.

Configuration is performed via Master SPI, Slave SelectMAP, or JTAG modes, with bitstream encryption and HMAC authentication available. The device includes 500 user-dedicated I/O pins compliant with LVCMOS, LVDS, TMDS, and MIPI D-PHY standards across 24 I/O banks.

Key Specifications

Pinout & Package

XC7A200T-1FFG1156C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic and interface acceleration applications.

Compared with XC7A200T-1FFG1156C, the XC7K160T-1FFG676C offers greater computational density but trades off transceiver speed and power efficiency, while the XC7A100T-1CSG324C reduces I/O and memory capacity to meet compact board layouts-neither is pin-compatible, requiring PCB redesign.

Availability

XC7A200T-1FFG1156C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging backend processing, video broadcast encoding, and test & measurement equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC7A200T-1FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio for data center, AI, and embedded markets.

The Artix-7 family targets cost-optimized, high-performance applications in industrial automation, video, and communications where power efficiency and transceiver integration are critical design requirements.

FAQ

What is the maximum supported DDR3 memory interface speed for the XC7A200T-1FFG1156C?

The XC7A200T-1FFG1156C supports DDR3/DDR3L memory interfaces up to 800 MHz (1600 MT/s) using its hardened memory controller and PHY. This includes full support for write leveling, read leveling, and gate training calibration sequences defined in JEDEC standards. The XC7A200T-1FFG1156C achieves this performance across all 24 I/O banks with proper termination and layout adherence to Xilinx UG473 guidelines.

Does the XC7A200T-1FFG1156C support partial reconfiguration?

Yes, the XC7A200T-1FFG1156C fully supports partial reconfiguration through Vivado Design Suite tools. This capability enables dynamic replacement of logic modules without resetting the entire device, preserving state in unmodified regions. The XC7A200T-1FFG1156C uses frame-based configuration memory addressing and hierarchical design partitioning to ensure safe, verified bitstream swaps during runtime.

What configuration modes are supported by the XC7A200T-1FFG1156C?

The XC7A200T-1FFG1156C supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is commonly used for single-flash boot; Slave SelectMAP enables high-speed parallel loading from microcontrollers. The XC7A200T-1FFG1156C also supports fallback configuration and multi-boot via external flash addressing.

How many GTP transceivers does the XC7A200T-1FFG1156C include, and what protocols do they support?

The XC7A200T-1FFG1156C integrates 16 GTP transceivers, each capable of 600 Mb/s to 3.75 Gb/s operation. These transceivers natively support PCIe Gen1/Gen2, SATA I/II/III, and DisplayPort 1.2a. They are not compatible with PCIe Gen3 or 10GbE KR standards. The XC7A200T-1FFG1156C transceiver architecture includes TX/RX polarity control, programmable equalization, and built-in PRBS generators for link validation.

What is the thermal design power (TDP) range for the XC7A200T-1FFG1156C under typical operating conditions?

The XC7A200T-1FFG1156C has no fixed TDP value; power consumption varies significantly with design utilization, I/O activity, and clock frequency. Xilinx UG474 specifies typical active power between 4.2 W (minimal logic, idle transceivers) and 12.8 W (full utilization, all transceivers active at 3.75 Gb/s). Thermal design must accommodate 0°C to +85°C junction temperature, requiring appropriate heatsinking for sustained 12+ W operation. The XC7A200T-1FFG1156C includes on-die temperature sensors accessible via XADC.