AMD XC7A200T-1FFG1156I

Overview

XC7A200T-1FFG1156I from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA featuring 195,456 logic cells, 13.1 Mb of block RAM, 960 DSP slices, and support for transceivers up to 6.6 Gb/s. It is packaged in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) with I/O voltage support ranging from 1.2 V to 3.3 V, commonly used in high-speed industrial imaging and programmable logic acceleration.

For engineers reviewing the XC7A200T-1FFG1156I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), speed grade (-1), temperature grade (Industrial, –40°C to +100°C), transceiver capability, and configuration interface options (e.g., SelectMAP, JTAG, SPI).

Technical Context

The XC7A200T-1FFG1156I implements a 28 nm HKMG process-based architecture with integrated clock management (CMT) blocks containing MMCM and PLL circuits, enabling precise clock synthesis and phase alignment across multiple domains. It supports partial reconfiguration and includes hardened PCI Express® Gen2 endpoints.

Configuration is performed via Master SPI, Slave SelectMAP, or JTAG interfaces, with bitstream encryption and HMAC authentication available for secure boot. The device supports DDR3/DDR3L memory interfaces up to 800 MHz (1600 Mbps) with dedicated memory controller logic.

Key Specifications

Pinout & Package

XC7A200T-1FFG1156I is housed in a 1156-ball Flip-Chip Fine-Pitch BGA (FFG) package with 31 × 31 ball array, 0.8 mm pitch, and thermal lid. The package supports thermal dissipation up to 12 W typical under active operation and requires controlled impedance PCB routing for high-speed I/O and transceivers.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC7A200T-1FFG1156I, the XC7K160T-1FFG676I offers reduced footprint and cost at the expense of logic and I/O scalability, while the XC7A350T-1FFG1156I delivers direct pin-compatible headroom for future design growth without layout revision.

Availability

XC7A200T-1FFG1156I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and test & measurement equipment requiring stable component supply and long-term lifecycle assurance.

Supply support for XC7A200T-1FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Artix-7 family targets cost-sensitive, high-performance applications demanding low power and small form factor, especially in industrial, video, and communications infrastructure.

FAQ

What is the maximum supported DDR3 memory speed for XC7A200T-1FFG1156I?

The XC7A200T-1FFG1156I supports DDR3 and DDR3L memory interfaces up to 800 MHz clock frequency (1600 Mbps data rate). This capability is implemented through dedicated memory controller logic and calibrated I/O banks, enabling reliable high-speed memory access without external PHY components. The XC7A200T-1FFG1156I's memory controller includes built-in write leveling and read leveling for robust timing closure.

Does XC7A200T-1FFG1156I support partial reconfiguration?

Yes, the XC7A200T-1FFG1156I fully supports partial reconfiguration, allowing dynamic replacement of logic modules while the rest of the design remains operational. This feature is enabled by the underlying 7-series architecture and verified in Vivado Design Suite v2020.2+. The XC7A200T-1FFG1156I uses frame-based bitstream updates and hierarchical design partitioning to ensure safe, deterministic reconfiguration sequences.

What configuration modes are supported by XC7A200T-1FFG1156I?

The XC7A200T-1FFG1156I supports multiple configuration modes including Master SPI, Slave SelectMAP, JTAG, and BPI. Mode selection is determined by the M0–M2 pins at power-up. The XC7A200T-1FFG1156I also supports fallback configuration and multi-boot via external flash addressing, enabling field-upgradable and fail-safe deployment strategies.

Is XC7A200T-1FFG1156I qualified for industrial temperature operation?

Yes, the XC7A200T-1FFG1156I carries the "I" suffix denoting Industrial temperature grade, rated for continuous operation from –40°C to +100°C case temperature. This qualification includes testing across voltage corners and process variations, and applies to all I/O standards and transceiver operation within specified limits. The XC7A200T-1FFG1156I's thermal design supports this range using standard PCB copper pour and thermal vias.

Does XC7A200T-1FFG1156I include hardened PCIe Gen2 endpoints?

Yes, the XC7A200T-1FFG1156I integrates hardened PCIe Gen2 endpoint blocks compliant with the PCI Express Base Specification Revision 2.1. These blocks provide native link training, transaction layer handling, and MSI/MSI-X interrupt support without consuming programmable logic resources. The XC7A200T-1FFG1156I supports x1, x2, and x4 lane configurations with automatic equalization and low-latency data path routing.