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AMD XC7A200T-2FB676I
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- Part No.:
- XC7A200T-2FB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7A200T-2FB676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,629
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Product details
Overview
XC7A200T-2FB676I from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA featuring 198,950 logic cells, 13.1 Mb of block RAM, 1,248 DSP slices, and support for up to 400 I/O pins in the FBGA676 package. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and targets high-bandwidth data processing in industrial imaging and wired communications.
For engineers reviewing the XC7A200T-2FB676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, thermal performance in sealed enclosures, and compatibility with Vivado 2023.2+ toolchain and Artix-7 configuration interfaces.
Technical Context
The XC7A200T-2FB676I implements a 28 nm HKMG process-based architecture with SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS signaling up to 1.25 Gbps. Its configuration interface includes dual-boot SPI x4 and JTAG, with bitstream encryption via AES-256 and HMAC authentication.
It integrates hardened PCIe Gen2 x4 endpoint blocks, 16 transceivers capable of 6.6 Gbps operation, and clock management tiles with MMCM and PLL for jitter < 150 ps RMS. The device requires dedicated configuration power supplies (VCCINT = 1.0V, VCCAUX = 1.8V, VCCO = 1.2–3.3V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for custom datapaths |
| Block RAM | 13.1 Mb - supports large on-chip buffering for video frame stores or packet FIFOs |
| DSP Slices | 1,248 - enables parallel FIR filtering, FFT, or matrix multiplication at >200 GMAC/s |
| Transceiver Speed | 6.6 Gbps - meets CPRI v6.1, JESD204B subclass 1, and GigE PHY requirements |
| I/O Count | 400 - enables high-pin-count interface consolidation (e.g., parallel CMOS image sensor + DDR3 + control bus) |
| Speed Grade | -2 - guarantees timing closure at 525 MHz system clock with 12 ns input setup margin |
| Operating Temp | -40°C to +100°C - qualified for fanless industrial control cabinets and outdoor base stations |
Pinout & Package
XC7A200T-2FB676I is housed in a 27×27 mm, 1.0 mm pitch, 676-ball Fine-Pitch Ball Grid Array (FBGA) package with metal heat spreader. The ball map follows Xilinx standard Artix-7 FBGA676 pinout, with dedicated configuration, clock, and power delivery balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master SPI mode; must be clean, low-jitter |
| DIN | Serial Configuration Data Input | Accepts bitstream from external SPI flash; supports dual-boot address switching |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration memory readiness or error |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Set boot source (SPI, BPI, JTAG) and configuration width (x1/x2/x4) at power-up |
| VCCINT | Core Power Supply | 1.0V ±3% supply for logic fabric and CLBs; requires low-noise, high-PSRR regulation |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x4 Endpoint | Hard IP block eliminates soft-core latency and resource overhead for host interface bridging |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning in deployed systems |
| MMCM + PLL Clock Management | Enables sub-150 ps RMS jitter synthesis for SerDes and ADC sampling clocks |
| SelectIO Technology | Supports mixed-voltage I/O banks (1.2V–3.3V) with programmable slew rate and drive strength |
| UltraFast Design System | Reduces place-and-route runtime by 40% vs. Spartan-6 for equivalent logic density designs |
Applications
| Industrial Machine Vision | Wireless Remote Radio Unit (RRU) |
|---|---|
Use Scenario: Real-time preprocessing of 12-bit, 60 fps CMOS image streams from multi-camera inspection systems. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, histogram equalization, and ROI extraction before sending compressed frames over PCIe to host CPU. Use Value: 198K logic cells and 13.1 Mb BRAM enable full-frame buffering and pipelined processing without external DRAM. | Use Scenario: Baseband processing and CPRI interface aggregation in LTE/5G macrocell RRUs. IC Role / Device Role / Timing Role: XC7A200T-2FB676I implements digital up/down conversion, CFR, and CPRI v6.1 framer/mapper with deterministic latency. Use Value: 6.6 Gbps transceivers and 1,248 DSP slices meet 2×20 MHz LTE carrier + 1×100 MHz NR carrier processing load. |
| Programmable Logic Controller (PLC) Gateway | Test & Measurement Equipment |
Use Scenario: Protocol translation between EtherCAT fieldbus and Modbus TCP over industrial Ethernet. IC Role / Device Role / Timing Role: Soft-core microblaze plus custom HDL logic handles real-time cyclic communication, safety monitoring, and diagnostics. Use Value: -2 speed grade and industrial temp rating ensure deterministic 100 µs cycle times in uncooled control cabinets. | Use Scenario: High-resolution digital oscilloscope front-end with 1 GS/s sampling and deep memory capture. IC Role / Device Role / Timing Role: XC7A200T-2FB676I manages ADC interface, trigger logic, waveform math, and PCIe 2.0 data streaming to host PC. Use Value: 400 I/O pins allow simultaneous connection to 8-channel ADCs, memory controllers, and high-speed serial links. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A15T-2FTG256I | Fewer logic cells (15,850), no transceivers, 170 I/O, smaller 16×16 mm FTBGA256 package | Suitable only for low-complexity control logic or simple protocol bridges; cannot replace XC7A200T-2FB676I in SerDes or high-throughput data paths | Select when cost and board space constrain requirements below 20K LUTs and no high-speed serial I/O is needed |
| XCKU035-2FFVA676I | Kintex UltraScale architecture, 215K logic cells, 16.2 Mb BRAM, 20× 12.5 Gbps GTY transceivers, higher power and cost | Targets higher bandwidth (e.g., 10G Ethernet, 4K video encoding) where XC7A200T-2FB676I lacks throughput or memory bandwidth | Choose for next-generation upgrades requiring >10 Gbps serial links or >200 GMAC/s compute density |
Compared with XC7A15T-2FTG256I and XCKU035-2FFVA676I, the XC7A200T-2FB676I delivers optimal balance of transceiver count, DSP density, and industrial temperature reliability for mid-range wired infrastructure-without the cost or power penalty of UltraScale devices or the capability gap of Artix-7 entry variants.
Availability
XC7A200T-2FB676I is available at Aetrix Electronics and suitable for industrial automation, wired communications infrastructure, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-2FB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Artix-7 family, including XC7A200T-2FB676I, was designed for cost-sensitive, high-performance applications demanding serial connectivity, DSP capability, and industrial-grade reliability without the complexity of higher-tier families.
FAQ
What is the maximum supported transceiver data rate for XC7A200T-2FB676I?
The XC7A200T-2FB676I supports transceiver data rates up to 6.6 Gbps per lane, validated per Xilinx DS181 specification. This enables compliance with CPRI v6.1, JESD204B subclass 1, and Gigabit Ethernet physical layer standards. Operation above 6.6 Gbps is not guaranteed and violates the published speed grade limits for this device.
Does XC7A200T-2FB676I support PCIe Gen2 x4 endpoint functionality?
Yes, XC7A200T-2FB676I includes a hardened PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification Revision 2.1. It supports link training, power management states (L0/L0s/L1), and AXI4-Stream interface to user logic. No external PHY is required, and the block consumes zero programmable logic resources.
What configuration modes are supported by XC7A200T-2FB676I?
XC7A200T-2FB676I supports master SPI (x1/x2/x4), slave SPI, JTAG, and BPI parallel configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Dual-boot capability allows two independent bitstreams stored in SPI flash, selectable via PROGRAM_B assertion sequence.
What are the power supply requirements for XC7A200T-2FB676I?
XC7A200T-2FB676I requires three regulated supplies: VCCINT = 1.0V ±3%, VCCAUX = 1.8V ±3%, and VCCO = 1.2V–3.3V (per I/O bank). Each supply must meet ripple limits (<30 mV pk-pk for VCCINT) and sequencing requirements (VCCAUX must be stable before VCCINT ramps). Decoupling follows Xilinx UG470 guidelines.
Is XC7A200T-2FB676I qualified for industrial temperature operation?
Yes, the "I" suffix in XC7A200T-2FB676I denotes industrial temperature grade, qualified from -40°C to +100°C case temperature per Xilinx DS181. Thermal design must maintain junction temperature ≤125°C under worst-case power dissipation, verified using Xilinx XPE power estimator and thermal simulation.
XC7A200T-2FB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7A200T-2FB676I FAQ
1.How can I place an order for XC7A200T-2FB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-2FB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-2FB676I reliable?
The price and inventory of XC7A200T-2FB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-2FB676I is usually 5 days.
3.What payment methods are accepted for XC7A200T-2FB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-2FB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-2FB676I?
XC7A200T-2FB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-2FB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-2FB676I?
For technical support, including XC7A200T-2FB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-2FB676I requirements.
6.How does Aetrix verify that XC7A200T-2FB676I is sourced from the original manufacturer or authorized distributors?
All XC7A200T-2FB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-2FB676I meets industry standards.
7.What is the process for return or replacement of XC7A200T-2FB676I?
All XC7A200T-2FB676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-2FB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-2FB676I part is unused and in its original packaging.
Return procedure for XC7A200T-2FB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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