AMD XC7A200T-2FBG484C

Overview

XC7A200T-2FBG484C from AMD is a high-performance Artix-7 FPGA with 195,456 logic cells, 13.1 Mb of block RAM, and 740 DSP slices, configured in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with -2 speed grade and commercial temperature range (0°C to 85°C). It serves as a reconfigurable system-on-chip for high-bandwidth data processing in industrial vision and PCIe-based embedded controllers.

For engineers reviewing the XC7A200T-2FBG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (300 user I/Os), transceiver capability (16 GTP serial transceivers up to 6.6 Gb/s), and supported configuration modes (SPIx4, BPI, JTAG).

Technical Context

The XC7A200T-2FBG484C implements a 28 nm HKMG process-based architecture with SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS signaling across 300 user-configurable I/O pins. Its programmable logic fabric includes CLBs with 6-input LUTs and dual flip-flops per slice, enabling high-density logic implementation and deterministic timing closure.

It integrates 16 GTP transceivers operating at 1.25–6.6 Gb/s, supporting protocols including PCIe Gen2 x4, SATA, and CPRI. Configuration is performed via Master SPI, Slave Parallel, or JTAG, with bitstream encryption and HMAC authentication available for secure boot.

Key Specifications

Pinout & Package

XC7A200T-2FBG484C is housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 0.8 mm ball pitch, and RoHS-compliant matte tin finish. The package supports thermal dissipation up to 5.5 W under typical operation and requires controlled-impedance PCB routing for high-speed I/O and transceiver lanes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC7A200T-2FBG484C, XCKU040-2FFVA1156E offers significantly higher transceiver speed and logic capacity but demands new PCB layout and power delivery design, while XC7K325T-2FFG676C provides greater logic density within the same 28 nm node and compatible Vivado flow, albeit with higher static power and larger package.

Availability

XC7A200T-2FBG484C is available at Aetrix Electronics and suitable for industrial machine vision, PCIe-based data acquisition, and medical imaging interface applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XC7A200T-2FBG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies, with leadership in FPGA, GPU, and CPU design.

The Artix-7 family, including XC7A200T-2FBG484C, was designed for cost-sensitive, high-performance embedded applications demanding low power, small form factor, and integrated transceivers - especially in industrial automation and communications infrastructure.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7A200T-2FBG484C?

The XC7A200T-2FBG484C supports DDR3 memory interfaces up to 800 Mbps data rate (400 MHz clock) in differential mode, validated with the -2 speed grade and standard 1.5 V DDR3 signaling. This capability is implemented using dedicated memory interface logic and I/O banks with programmable delay calibration. The XC7A200T-2FBG484C datasheet specifies timing parameters for 16-bit and 32-bit configurations with fly-by topology and on-die termination.

Does XC7A200T-2FBG484C include hard IP for PCI Express Gen2?

Yes, XC7A200T-2FBG484C integrates a hard PCIe Gen2 x4 endpoint/root port block compliant with PCI Express Base Specification Revision 2.1. This block includes link training, transaction layer, data link layer, and physical layer logic, eliminating the need for soft-core implementations. The XC7A200T-2FBG484C supports both endpoint and root complex configurations with MSI/MSI-X interrupt handling and BAR address decoding.

What configuration modes are supported by XC7A200T-2FBG484C?

XC7A200T-2FBG484C supports Master SPI, Slave Parallel, JTAG, and BPI configuration modes. Master SPI uses an internal oscillator to clock external flash memory, while Slave Parallel allows external microcontroller control. JTAG is used for boundary-scan testing and programming. The XC7A200T-2FBG484C configuration pins M0–M3 determine the active mode at power-up, with pull-up resistors setting default SPI mode.

Is partial reconfiguration supported on XC7A200T-2FBG484C?

Yes, XC7A200T-2FBG484C supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logical modules without resetting the entire device. This feature requires specific floorplanning, checkpointing, and bitstream generation workflows. The XC7A200T-2FBG484C implements dedicated configuration logic and frame-based access to enable safe, verified module swaps during runtime.

What is the thermal design power (TDP) of XC7A200T-2FBG484C under typical operation?

The XC7A200T-2FBG484C has a typical thermal design power of 5.5 W under balanced logic utilization, I/O activity, and transceiver usage at 25°C ambient. Power consumption varies with design density, clock frequency, and I/O standards; AMD's XPE tool provides accurate estimates based on actual netlist and constraints. The XC7A200T-2FBG484C package supports convection-cooled PCB layouts with 2 oz copper and thermal vias under the die.