My Inquiry
My Account
AMD XC7A200T-2FBG676C
.JPG)
- Part No.:
- XC7A200T-2FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7A200T-2FBG676C.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,243
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7A200T-2FBG676C from AMD is a high-performance Artix-7 FPGA with 198,950 logic cells, 13.1 GMACs of DSP performance, and 14.4 Mb of block RAM, configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package for industrial temperature operation (0°C to 85°C). It serves as a reconfigurable system-on-chip in high-speed data acquisition and real-time video processing systems.
For engineers reviewing the XC7A200T-2FBG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver capability (16 GTP transceivers up to 3.75 Gbps), speed grade (-2), and thermal design margin for convection-cooled embedded control.
Technical Context
The XC7A200T-2FBG676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and 18-bit × 25-bit signed multipliers. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling such as LVDS and TMDS.
Its clocking subsystem includes up to 24 clock management tiles (CMTs), each containing a mixed-mode clock manager (MMCM) and phase-locked loop (PLL), enabling precise jitter filtering and frequency synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 740 - provides fixed-point arithmetic throughput for FIR filters, FFTs, and motor control algorithms |
| Block RAM | 14.4 Mb - enables on-chip buffering for video frame stores, packet queues, or lookup tables |
| User I/O Pins | 400 - supports wide parallel interfaces, multi-lane ADC/DAC connections, and PCIe Gen1 endpoint routing |
| GTP Transceivers | 16 × 3.75 Gbps - delivers serial connectivity for Camera Link, JESD204B, or CPRI physical layers |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under industrial conditions |
| Operating Temp | 0°C to +85°C - validated for use in fanless industrial enclosures and outdoor edge compute nodes |
Pinout & Package
XC7A200T-2FBG676C is housed in a 27 mm × 27 mm, 676-ball Fine-Pitch BGA (FBG) package with 1.0 mm ball pitch and standard I/O pad arrangement per Xilinx/AMD Artix-7 packaging specification UG475 v1.13.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration, clocking, and transceiver reference circuitry |
| VCCO | I/O bank power | Programmable 1.2–3.3V per bank; sets voltage standard for connected peripherals |
| CONFIG_IO | Configuration interface | Dedicated pins for JTAG, SPI, or BPI master mode boot; not usable as general-purpose I/O |
| MRCC / SRCC | Multi-Region Clock Input | Dedicated differential clock inputs feeding MMCM/PLL with sub-100 fs jitter tolerance |
| GTPE2 | GTP transceiver bank | Supports 16 transceivers with integrated CDR, TX/RX termination, and programmable equalization |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset-critical for adaptive radar waveform updates |
| AXI Interconnect Integration | Hardened AXI4-Stream and AXI4-Lite interfaces simplify integration with ARM Cortex-A9 processors in Zynq-7000 companion systems |
| UltraFast Design System | Reduces place-and-route runtime by ~35% versus Virtex-6 toolflow for equivalent logic density designs |
| ISE/Vivado Dual Tool Support | Allows legacy ISE 14.7 migration path while enabling Vivado 2022.2 advanced synthesis and timing analysis |
| Industrial Temperature Rating | Validated operation over full 0°C–85°C range without derating-eliminates need for thermal throttling logic |
Applications
| High-Speed Data Acquisition | Real-Time Video Processing |
|---|---|
Use Scenario: Simultaneous sampling of 32-channel 16-bit ADCs at 100 MSPS with on-FPGA decimation and histogram generation. IC Role / Device Role / Timing Role: Real-time digital signal processor and deterministic I/O controller with cycle-accurate timing for trigger synchronization. Use Value: Eliminates external FIFO and reduces latency to <200 ns from analog input to processed result buffer. | Use Scenario: 4K60 RGB capture via HDMI 2.0 receiver, chroma subsampling, motion-adaptive deinterlacing, and dual-display output. IC Role / Device Role / Timing Role: Pixel-rate video pipeline orchestrator with independent clock domain crossing and line-buffer management. Use Value: Achieves zero-frame-drop operation using 12.8 Mb of distributed block RAM for triple-line buffers. |
| Industrial Ethernet Node | Software-Defined Radio Front-End |
Use Scenario: Deterministic PROFINET IRT slave node with 2× 100BASE-TX PHY interfaces and time-synchronized I/O expansion. IC Role / Device Role / Timing Role: Real-time protocol accelerator with hardware timestamping and cyclic redundancy check offload. Use Value: Meets <1 μs jitter requirement for Class A IRT cycles using dedicated clock management tiles. | Use Scenario: Wideband IF digitization at 122.88 MSPS with 12-bit resolution, channelized filtering, and digital down-conversion. IC Role / Device Role / Timing Role: Multi-standard RF baseband processor supporting LTE, 5G NR, and IEEE 802.11ax waveforms. Use Value: Delivers 13.1 GMACs of sustained throughput for 128-tap polyphase filter banks with <0.1 dB passband ripple. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A15T-2FTG256C | Fewer logic cells (15,850), no GTP transceivers, 256-ball FTBGA package | Limited to low-bandwidth control and sensor fusion; unsuitable for multi-gigabit serial I/O | Select when cost-sensitive, space-constrained designs require only basic programmable logic without high-speed serial links |
| XC7K160T-2FFG676C | Kintex-7 family; 162,240 logic cells, 20 GTP transceivers (6.6 Gbps), higher static power | Better suited for PCIe Gen2 endpoints and 10G Ethernet MAC offload due to enhanced transceiver specs | Choose when migrating from Artix-7 to higher bandwidth or lower latency requirements, accepting larger footprint and thermal envelope |
Compared with XC7A15T-2FTG256C, the XC7A200T-2FBG676C enables full JESD204B subclass 1 link implementation; versus XC7K160T-2FFG676C, it offers 30% lower static power and smaller PCB area at the expense of transceiver speed ceiling.
Availability
XC7A200T-2FBG676C is available at Aetrix Electronics and suitable for high-speed data acquisition, real-time video processing, and industrial Ethernet node applications requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-2FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets through its acquired Xilinx technology portfolio.
The Artix-7 family, including XC7A200T-2FBG676C, was designed for cost-sensitive, power-efficient applications demanding high logic density and serial connectivity in industrial and vision systems.
FAQ
What is the maximum supported transceiver data rate for XC7A200T-2FBG676C?
The XC7A200T-2FBG676C integrates GTP transceivers rated for operation up to 3.75 Gbps per lane. This rate is guaranteed across the full industrial temperature range and supports protocols including CPRI, DisplayPort 1.1, and JESD204B subclass 0/1. The XC7A200T-2FBG676C does not support rates above 3.75 Gbps-even with voltage or temperature derating-as the transceiver PLL architecture limits VCO frequency range.
Does XC7A200T-2FBG676C support partial reconfiguration in production systems?
Yes, XC7A200T-2FBG676C fully supports partial reconfiguration using Vivado Design Suite 2022.2 and later. The feature allows dynamic module swapping without resetting the entire device, verified in field-deployed motor drive controllers where firmware updates occur during runtime. Configuration security and CRC checking remain active during partial bitstream loads for XC7A200T-2FBG676C.
What I/O standards are supported by XC7A200T-2FBG676C banks?
XC7A200T-2FBG676C supports LVCMOS (1.2V–3.3V), SSTL (Class I/II), HSTL (Class I/III), and differential standards including LVDS, BLVDS, RSDS, and TMDS. Each of its 18 I/O banks is independently configurable for voltage and standard. The XC7A200T-2FBG676C does not support MIPI D-PHY or PCIe root complex signaling natively.
Is XC7A200T-2FBG676C qualified for automotive applications?
No, XC7A200T-2FBG676C is specified only for industrial temperature range (0°C to +85°C) and lacks AEC-Q100 qualification, automotive-grade screening, or extended reliability testing. For automotive use, AMD recommends the XA7A200T variant, which shares the same logic fabric but includes automotive qualification, enhanced ESD protection, and extended temperature support (−40°C to +125°C).
How many clock management tiles (CMTs) are available in XC7A200T-2FBG676C?
The XC7A200T-2FBG676C contains 24 clock management tiles (CMTs), each integrating one MMCM and one PLL. These provide independent clock synthesis, phase shifting, and jitter filtering for up to 24 distinct clock domains. All CMTs are accessible and routable in the XC7A200T-2FBG676C without resource contention or licensing restrictions.
XC7A200T-2FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7A200T-2FBG676C FAQ
1.How can I place an order for XC7A200T-2FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-2FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-2FBG676C reliable?
The price and inventory of XC7A200T-2FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-2FBG676C is usually 5 days.
3.What payment methods are accepted for XC7A200T-2FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-2FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-2FBG676C?
XC7A200T-2FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-2FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-2FBG676C?
For technical support, including XC7A200T-2FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-2FBG676C requirements.
6.How does Aetrix verify that XC7A200T-2FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7A200T-2FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-2FBG676C meets industry standards.
7.What is the process for return or replacement of XC7A200T-2FBG676C?
All XC7A200T-2FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-2FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-2FBG676C part is unused and in its original packaging.
Return procedure for XC7A200T-2FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7A200T-2FBG676C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
