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AMD XC7A200T-2FBG676I
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- Part No.:
- XC7A200T-2FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7A200T-2FBG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:442
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Product details
Overview
XC7A200T-2FBG676I from AMD is a high-performance Artix-7 FPGA featuring 195,456 logic cells, 13.1 Gb/s transceiver capability, and -2 speed grade operation in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package. It serves as a programmable logic fabric for high-bandwidth data processing in industrial imaging systems.
For engineers reviewing the XC7A200T-2FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver line rate, thermal performance under industrial temperature range (-40°C to +100°C), and configuration interface support (SPIx4, SelectMAP).
Technical Context
The XC7A200T-2FBG676I implements a 28 nm HKMG process-based architecture with integrated Block RAM (4,880 kbits), DSP48E1 slices (740), and clock management tiles (CMT) supporting phase-matched dual-clock domains. Its transceivers comply with PCIe Gen2, SATA, and CPRI standards.
Configuration is supported via Master SPI, Slave Serial, or JTAG interfaces, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI4-Stream interconnect for heterogeneous system integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,456 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| User I/O Pins | 400 - supports high-density parallel interface routing including DDR3 memory controllers |
| Transceiver Line Rate | 13.1 Gb/s - enables single-lane CPRI v6 or dual-lane PCIe Gen2 x2 links |
| Block RAM | 4,880 kbits - provides on-chip memory for FIFOs, frame buffers, or coefficient storage |
| DSP Slices | 740 - delivers 222 GMAC/s at 300 MHz for real-time filtering or FFT acceleration |
| Operating Temperature | -40°C to +100°C - qualified for extended industrial environments without derating |
| Speed Grade | -2 - guarantees timing closure at higher clock frequencies than -1 grade under same conditions |
Pinout & Package
XC7A200T-2FBG676I is housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 25 × 25 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI, BPI, JTAG) during power-up reset sequence |
| CCLK | Configuration Clock | Drives internal configuration shift register; supports up to 50 MHz in Master SPI mode |
| DIN | Serial Data Input | Receives configuration bitstream from external SPI flash memory |
| INIT_B | Initialization Status | Open-drain active-low signal indicating successful CRC check or configuration error |
| PROGRAM_B | Configuration Reset | Active-low asynchronous trigger to restart configuration process |
| GND / VCCINT / VCCAUX / VCCO | Power Terminals | Separate supply domains enable mixed-voltage I/O banks (1.2V–3.3V) and low-noise core logic |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for adaptive radio or multi-mode sensor processing |
| AXI4-Stream Interface | Standardized high-throughput streaming protocol for connecting IP cores like video encoders or packet engines |
| HMAC Authentication | Verifies configuration bitstream integrity using SHA-256 hash to prevent unauthorized firmware loading |
| PCIe Gen2 Endpoint | Integrated hard IP supporting x1/x2/x4 lane widths with LTSSM state machine and TLP parsing |
| DDR3 Memory Controller | Hardened controller supporting 800 Mbps data rates across up to 16-bit wide interfaces with calibration logic |
Applications
| Industrial Machine Vision | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pixel preprocessing and ROI extraction in high-speed camera systems. IC Role / Device Role / Timing Role: Programmable logic fabric executing custom image pipelines with sub-microsecond latency. Use Value: 400 user I/Os enable direct CMOS sensor interfacing; 13.1 Gb/s transceivers support CoaXPress 2.0 link aggregation. | Use Scenario: Digital beamforming and echo processing in ultrasound systems. IC Role / Device Role / Timing Role: High-throughput DSP accelerator coordinating ADC sampling, FIR filtering, and data compression. Use Value: 740 DSP48E1 slices deliver deterministic 222 GMAC/s for real-time RF signal conditioning. |
| 5G Small Cell Baseband | Test & Measurement Equipment |
Use Scenario: Layer 1 PHY processing in fronthaul-constrained pico-cell deployments. IC Role / Device Role / Timing Role: Configurable baseband processor handling CPRI v6 transport, channel coding, and MIMO precoding. Use Value: Transceivers meet CPRI v6 24.33 Gbps line rate requirement with deterministic jitter < 0.3 ps RMS. | Use Scenario: High-resolution waveform generation and analysis in modular PXI platforms. IC Role / Device Role / Timing Role: Timing-critical pattern generator and acquisition engine synchronized to external 10 MHz reference. Use Value: CMT supports sub-picosecond phase alignment between multiple clock domains for coherent multi-channel capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Higher logic density (376K LC), 25.8 Gb/s transceivers, Kintex UltraScale architecture | Better suited for full 5G NR baseband with LDPC decoding; requires larger PCB area and higher power budget | Select when >200K logic cells and >20 Gb/s serial bandwidth are required; not pin-compatible with XC7A200T-2FBG676I |
| XC7K325T-2FFG676I | Same 28 nm process, 326K logic cells, identical 676-pin FCBGA package footprint | Offers greater resource headroom for complex SoC integration but consumes ~25% more static power | Drop-in replacement only if board layout reserves thermal margin for 12W typical power; pinout matches but voltage rail sequencing differs |
Compared with XC7A200T-2FBG676I, XCKU040-2FFVA1156I delivers higher bandwidth at increased cost and complexity, while XC7K325T-2FFG676I offers compatible packaging with greater logic capacity but stricter thermal design requirements.
Availability
XC7A200T-2FBG676I is available at Aetrix Electronics and suitable for industrial imaging, medical diagnostics, and 5G infrastructure requiring stable component supply across multi-year production cycles.
Supply support for XC7A200T-2FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, adaptive SoC, and FPGA solutions for data center, communications, and embedded markets.
The Artix-7 family targets cost-sensitive, power-efficient applications demanding high I/O bandwidth and transceiver performance-including industrial automation, test equipment, and wireless infrastructure.
FAQ
What is the maximum supported DDR3 data rate for XC7A200T-2FBG676I?
The XC7A200T-2FBG676I integrates a hardened DDR3 memory controller supporting up to 800 Mbps per pin (400 MHz clock), compliant with JEDEC DDR3L-1600 specifications. This allows 16-bit wide interfaces with 6.4 GB/s aggregate bandwidth. The controller includes write-leveling, read-leveling, and gate training for reliable operation across voltage and temperature variations. XC7A200T-2FBG676I does not support DDR4 or LPDDR3 protocols.
Does XC7A200T-2FBG676I support partial reconfiguration?
Yes, XC7A200T-2FBG676I fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic swapping of logic modules without resetting the entire device. This capability is implemented using frame-based bitstream updates and requires dedicated ICAP (Internal Configuration Access Port) access. XC7A200T-2FBG676I uses the same PR methodology as other Artix-7 devices, with documented constraints on reconfigurable partition boundaries and timing isolation.
What configuration modes are supported by XC7A200T-2FBG676I?
XC7A200T-2FBG676I supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. Master SPI is most common for single-flash boot; SelectMAP enables high-speed parallel loading from microcontrollers. JTAG is used for debugging and boundary-scan testing. XC7A200T-2FBG676I does not support BPI or NAND flash boot modes.
Is XC7A200T-2FBG676I qualified for automotive applications?
No, XC7A200T-2FBG676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure reporting mechanisms, and extended lifetime validation. For automotive use, AMD recommends the XA Artix-7 family (e.g., XA7A200T), which shares the same architecture but includes automotive-grade screening, enhanced ESD protection, and PPAP documentation. XC7A200T-2FBG676I remains suitable for industrial and telecom equipment.
What is the purpose of the INIT_B pin on XC7A200T-2FBG676I?
The INIT_B pin on XC7A200T-2FBG676I is an open-drain, active-low output that signals configuration status: it goes high after power stabilization and remains high until configuration begins, then pulls low during bitstream loading, and returns high upon successful CRC verification. If CRC fails or configuration is aborted, INIT_B stays low. XC7A200T-2FBG676I uses INIT_B in conjunction with PROGRAM_B to implement robust configuration recovery sequences in field-deployed systems.
XC7A200T-2FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7A200T-2FBG676I FAQ
1.How can I place an order for XC7A200T-2FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-2FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-2FBG676I reliable?
The price and inventory of XC7A200T-2FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-2FBG676I is usually 5 days.
3.What payment methods are accepted for XC7A200T-2FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-2FBG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-2FBG676I?
XC7A200T-2FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-2FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-2FBG676I?
For technical support, including XC7A200T-2FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-2FBG676I requirements.
6.How does Aetrix verify that XC7A200T-2FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7A200T-2FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-2FBG676I meets industry standards.
7.What is the process for return or replacement of XC7A200T-2FBG676I?
All XC7A200T-2FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-2FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-2FBG676I part is unused and in its original packaging.
Return procedure for XC7A200T-2FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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