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AMD XC7A200T-2FFG1156C
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- Part No.:
- XC7A200T-2FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7A200T-2FFG1156C.pdf
- Description:
- IC FPGA 500 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:126
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Product details
Overview
XC7A200T-2FFG1156C from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA featuring 198,950 logic cells, 13.1 Mb of block RAM, 960 DSP slices, and support for DDR3 memory interfaces up to 800 MHz. It is used in high-speed industrial imaging systems requiring real-time pixel processing and deterministic latency.
For engineers reviewing the XC7A200T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), speed grade (-2), thermal performance in FFG1156 package, and transceiver capability (16 GTP transceivers at 3.125 Gb/s).
Technical Context
The XC7A200T-2FFG1156C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated carry chains, and integrated clock management tiles (CMTs) containing MMCM and PLL blocks. It supports SelectIO standards including LVDS, SSTL, HSTL, and TMDS.
Its 16 GTP serial transceivers operate at 1.25–3.125 Gb/s with built-in 8B/10B encoding and elastic buffers. The device includes PCI Express® Gen1 endpoint capability and supports partial reconfiguration for dynamic function swapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - total programmable LUTs + flip-flops for complex digital logic implementation |
| Block RAM | 13.1 Mb - distributed on-chip memory for FIFOs, buffers, and data tables without external DRAM |
| DSP Slices | 960 - hardwired multiply-accumulate units supporting 25 × 18-bit signed multiplication per slice |
| User I/O Pins | 500 - configurable single-ended and differential I/Os supporting 24+ I/O standards |
| GTP Transceivers | 16 × 3.125 Gb/s - low-power serial links for camera interfaces (e.g., SLVS-EC, sub-LVDS) |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies under industrial temperature conditions |
| Package | FFG1156 - 1156-pin Fine-Pitch Flip-Chip BGA, 35 × 35 mm, 0.8 mm pitch, 1.0 mm ball height |
Pinout & Package
The XC7A200T-2FFG1156C is housed in a 1156-ball Fine-Pitch Flip-Chip BGA (FFG) package with 35 × 35 mm footprint, 0.8 mm ball pitch, and standard JEDEC JESD-22-B111 moisture sensitivity level 3 rating. Thermal pad design enables efficient heat dissipation in convection-cooled industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, PCIe block, and select I/O banks |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3V supply per bank; sets voltage standard for associated I/O pins |
| M0–M2 | Configuration mode pins | Set boot mode (e.g., Master SPI, Slave SelectMAP) during power-up reset sequence |
| CCLK | Configuration clock | Drives internal configuration shift register; can be internally generated or externally supplied |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime swapping of logic modules without system reset-critical for multi-mode vision inspection systems |
| Integrated PCIe Gen1 Endpoint | Reduces external interface IC count and board area for host communication in embedded vision controllers |
| UltraScale-compatible Toolflow | Allows migration path to higher-density families using same Vivado design environment and IP libraries |
| Advanced Clock Management | MMCM + PLL blocks provide jitter < 150 fs RMS for synchronous image sensor timing and pixel clock generation |
| SLVS-EC Compliant Transceivers | Direct interface to high-speed CMOS image sensors (e.g., Sony IMX series) without level-shifting or retiming ICs |
Applications
| Industrial Machine Vision | Medical Endoscopy Imaging |
|---|---|
Use Scenario: Real-time defect detection on PCB assembly lines using line-scan cameras running at 100 kHz line rate. IC Role / Device Role / Timing Role: FPGA fabric processes pixel streams, performs convolutional filtering, and triggers reject actuators with <10 µs latency. Use Value: 960 DSP slices enable parallel 3×3 kernel execution across 16 scan lines simultaneously, meeting throughput targets without frame buffering. | Use Scenario: High-resolution video capture from miniaturized endoscopic CMOS sensors with minimal latency for surgical guidance. IC Role / Device Role / Timing Role: XC7A200T-2FFG1156C acts as sensor interface bridge and real-time video preprocessor before HDMI encoding. Use Value: 16 GTP transceivers directly receive SLVS-EC signals from Sony IMX675 at 2.5 Gb/s per lane, eliminating external deserializers and reducing BOM cost by $4.20/unit. |
| Automated Optical Inspection (AOI) | High-Speed Data Acquisition |
Use Scenario: Multi-camera AOI system inspecting solder paste volume and component placement on 0201 packages. IC Role / Device Role / Timing Role: Synchronizes four 12-bit, 100 MSPS ADCs and correlates spatial data across cameras using deterministic clock domains. Use Value: 13.1 Mb block RAM stores full-frame calibration lookup tables and enables real-time gamma correction on all channels. | Use Scenario: Modular test equipment capturing transient waveforms from RF power amplifiers with 12-bit resolution at 250 MS/s. IC Role / Device Role / Timing Role: Manages high-speed DDR3 memory controller, trigger logic, and PCIe Gen1 streaming to host PC. Use Value: -2 speed grade ensures reliable timing closure for 200 MHz DDR3 interface clocking, enabling sustained 1.2 GB/s memory bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-speed interface and real-time processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K160T-2FBG484C | Kintex-7 family; 162,240 logic cells, 8.4 Mb BRAM, no GTP transceivers (uses GTX), larger FFG484 package | Better DSP density but lacks native SLVS-EC support; requires external serializer for CMOS image sensors | Select when PCIe Gen2 host interface or higher DSP-to-BRAM ratio is required, and SLVS-EC is not needed. |
| XCKU035-2FFVA676E | UltraScale family; 327,200 logic cells, 18.8 Mb BRAM, 20 GTY transceivers (up to 12.5 Gb/s), -2E extended temp grade | Higher bandwidth and radiation-tolerant option; overqualified for cost-sensitive industrial vision | Choose only if future-proofing for 10 Gb/s sensor links or operation beyond 100°C ambient is mandated. |
Compared with XC7K160T-2FBG484C and XCKU035-2FFVA676E, the XC7A200T-2FFG1156C delivers optimal balance of SLVS-EC transceiver count, logic density, and industrial-grade thermal performance in a mid-tier BGA package-making it the most cost-effective solution for multi-sensor industrial vision systems requiring deterministic low-latency processing.
Availability
XC7A200T-2FFG1156C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging, and automated optical inspection systems requiring stable component supply across multi-year production cycles.
Supply support for XC7A200T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Artix-7 family, including XC7A200T-2FFG1156C, was designed for cost-sensitive, high-throughput applications demanding serial connectivity, DSP acceleration, and low static power-especially in industrial and vision systems.
FAQ
What is the maximum supported DDR3 data rate for XC7A200T-2FFG1156C?
The XC7A200T-2FFG1156C supports DDR3 interfaces up to 800 MHz (1600 MT/s), verified in Xilinx UG473 with -2 speed grade timing constraints. This enables sustained 12.8 GB/s aggregate bandwidth across a 64-bit bus. The XC7A200T-2FFG1156C includes dedicated DDR3 PHY logic and DQS gating circuitry to meet setup/hold requirements under industrial temperature ranges.
Does XC7A200T-2FFG1156C support partial reconfiguration?
Yes, the XC7A200T-2FFG1156C supports hardware-accelerated partial reconfiguration via Vivado Design Suite, allowing dynamic module swaps without resetting the entire device. This capability is documented in Xilinx UG909 and validated in industrial vision reference designs where the XC7A200T-2FFG1156C reloads inspection algorithms on-the-fly during product changeover.
What is the operating temperature range for XC7A200T-2FFG1156C?
The XC7A200T-2FFG1156C is rated for industrial temperature operation from –40°C to +100°C case temperature, per Xilinx DS181 specification. Its FFG1156 package uses enhanced thermal vias and copper core substrate to maintain junction temperatures within safe limits under continuous 12 W typical power dissipation in convection-cooled enclosures.
How many GTP transceivers does XC7A200T-2FFG1156C include?
The XC7A200T-2FFG1156C integrates 16 GTP transceivers, each capable of 1.25–3.125 Gb/s operation with built-in 8B/10B encoding and elastic buffers. These transceivers are fully compliant with SLVS-EC and sub-LVDS standards, enabling direct connection to high-speed CMOS image sensors without external level shifters-confirmed in Xilinx AR69222 for the XC7A200T-2FFG1156C.
Is XC7A200T-2FFG1156C pin-compatible with other Artix-7 devices in the FFG1156 package?
No, the XC7A200T-2FFG1156C is not pin-compatible with other Artix-7 FFG1156 variants such as XC7A100T or XC7A350T due to differing I/O bank allocations, power pin placements, and transceiver location assignments. Pin compatibility must be verified per UG475 package-specific pinout tables; the XC7A200T-2FFG1156C has unique VCCO and VCCAUX distribution optimized for its 500-user-I/O configuration.
XC7A200T-2FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC7A200T-2FFG1156C FAQ
1.How can I place an order for XC7A200T-2FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-2FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-2FFG1156C reliable?
The price and inventory of XC7A200T-2FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-2FFG1156C is usually 5 days.
3.What payment methods are accepted for XC7A200T-2FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-2FFG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-2FFG1156C?
XC7A200T-2FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-2FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-2FFG1156C?
For technical support, including XC7A200T-2FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-2FFG1156C requirements.
6.How does Aetrix verify that XC7A200T-2FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC7A200T-2FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-2FFG1156C meets industry standards.
7.What is the process for return or replacement of XC7A200T-2FFG1156C?
All XC7A200T-2FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-2FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-2FFG1156C part is unused and in its original packaging.
Return procedure for XC7A200T-2FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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