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AMD XC7A200T-2FFG1156I
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- Part No.:
- XC7A200T-2FFG1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7A200T-2FFG1156I.pdf
- Description:
- IC FPGA 500 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,637
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Product details
Overview
XC7A200T-2FFG1156I from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA featuring 198,950 logic cells, 13.1 Mb of block RAM, 960 DSP slices, and support for DDR3 memory interfaces up to 800 MHz. It is used in high-speed industrial imaging systems requiring real-time pixel processing and deterministic latency.
For engineers reviewing the XC7A200T-2FFG1156I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), speed grade (-2), thermal performance (industrial temperature range –40°C to +100°C), and package footprint (1156-pin FCBGA).
Technical Context
The XC7A200T-2FFG1156I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated carry chains, and integrated clock management tiles (CMTs) containing PLLs and MMCMs. It supports transceiver speeds up to 6.6 Gb/s via SelectIO technology and includes hardened PCIe Gen2 x4 endpoint capability.
Configuration is performed via JTAG, SPIx4, or BPI parallel modes, with bitstream encryption and HMAC authentication available. The device integrates dual 12-bit 1 MSPS ADCs for on-chip monitoring of supply voltage and die temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 13.1 Mb - enables large on-die data buffering for video frame storage or FIFO implementation |
| DSP Slices | 960 - supports parallel multiply-accumulate operations for real-time filtering or FFT computation |
| User I/O Pins | 500 - provides high-density interface routing for sensor arrays, memory, and peripheral expansion |
| Speed Grade | -2 - guarantees timing closure at 1.0 ns TPD for critical paths in industrial-grade operation |
| Operating Temp | –40°C to +100°C - validated for deployment in uncooled factory automation enclosures |
| Transceiver Rate | 6.6 Gb/s - enables direct connection to CMOS image sensors or high-speed serial ADCs |
Pinout & Package
XC7A200T-2FFG1156I is housed in a 1156-ball Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 1.0 mm ball pitch and 35 mm × 35 mm body size. Thermal pad on underside requires controlled solder paste volume and reflow profile per Xilinx UG475.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0V to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8V to configuration logic, transceivers, and clock management circuits |
| VCCO | I/O bank power | Configurable per-bank (1.2V–3.3V); sets output voltage level and input threshold |
| M0–M2 | Mode configuration pins | Determine boot source (JTAG, SPI, BPI) and configuration mode at power-up |
| INIT_B | Configuration status | Open-drain active-low signal indicating bitstream loading progress and CRC pass/fail |
| CCLK | Configuration clock | Drives internal configuration shift register during master SPI/BPI programming |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 x4 Endpoint | Reduces integration effort for host CPU communication without external bridge IC or soft IP overhead |
| Dual 12-bit 1 MSPS ADCs | Enables real-time monitoring of VCCINT/VCCAUX and on-die temperature without external sensors |
| SelectIO Technology | Supports LVDS, SSTL, HSTL, and MIPI D-PHY standards across 500 I/Os with programmable slew rate and drive strength |
| Bitstream Encryption & HMAC | Protects intellectual property against cloning and unauthorized configuration replay attacks |
| MMCM + PLL Clock Management | Allows generation of multiple phase-aligned clocks (up to 12 outputs) with sub-100 fs jitter for synchronous sensor interfacing |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: Real-time preprocessing of 100+ MP/s CMOS image streams from line-scan cameras in PCB inspection systems. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level defect detection algorithms; MMCM generates precise pixel clock and line sync signals. Use Value: Achieves <10 µs latency from sensor input to decision output using deterministic logic paths and hardwired I/O timing. | Use Scenario: High-precision stimulus generation and response capture for mixed-signal IC validation at 200 MS/s. IC Role / Device Role / Timing Role: XC7A200T-2FFG1156I acts as pattern generator and digitizer controller; DSP slices perform real-time FFT analysis on captured waveforms. Use Value: Eliminates need for external waveform memory by leveraging 13.1 Mb block RAM for multi-cycle test vector storage. |
| Medical Imaging Interface | Defense Radar Signal Processing |
Use Scenario: Interfacing ultrasound transducer arrays with digital beamforming ASICs via LVDS links running at 1.25 Gb/s. IC Role / Device Role / Timing Role: Acts as serializer/deserializer bridge and time-synchronized data aggregator; transceivers handle embedded clock recovery. Use Value: Maintains sub-ns inter-channel skew across 32 LVDS lanes using dedicated deskew circuitry and dynamic phase alignment. | Use Scenario: Pulse-Doppler radar front-end processing in airborne EW systems requiring radiation-tolerant logic and deterministic timing. IC Role / Device Role / Timing Role: Implements pulse compression and CFAR detection in fabric; hardened PCIe connects to mission computer for target report streaming. Use Value: Delivers >95% hardware utilization efficiency for 1024-point FFTs using 960 DSP slices with no external memory bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Kintex UltraScale with 242K logic cells, 16.3 Mb BRAM, and 40 Gb/s transceivers; higher power and cost | Better suited for 4K video encoding or 100G Ethernet MAC offload; over-spec for most Artix-7 use cases | Select only if >200K LUTs or >10 Gb/s serial I/O are required; not pin-compatible with XC7A200T-2FFG1156I |
| XC7A15T-2FTG256I | Smaller Artix-7 variant with 15,850 logic cells, 1.8 Mb BRAM, and 100 user I/Os in 256-pin FTBGA | Targeted at cost-sensitive motor control or basic protocol bridging; insufficient for multi-sensor fusion | Choose when design scale fits within 16K LUTs and thermal budget restricts to 11×11 mm footprint |
Compared with XCKU040-2FFVA1156I, XC7A200T-2FFG1156I delivers optimal balance of logic density, I/O count, and power efficiency for industrial edge compute; versus XC7A15T-2FTG256I, it provides 12.5× more logic resources and 5× more I/Os while sharing the same 28 nm process and toolchain compatibility.
Availability
XC7A200T-2FFG1156I is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging interface designs requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-2FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and aerospace applications.
The Artix-7 family, including XC7A200T-2FFG1156I, was designed for cost-sensitive, high-performance applications demanding low power, small footprint, and industrial temperature operation - especially in machine vision, motor control, and communications infrastructure.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7A200T-2FFG1156I?
The XC7A200T-2FFG1156I supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its integrated MIG (Memory Interface Generator) IP core. This capability is verified in Xilinx UG586 and applies specifically to the -2 speed grade under industrial temperature conditions with proper board layout and termination.
Does XC7A200T-2FFG1156I include built-in analog-to-digital conversion capability?
Yes, XC7A200T-2FFG1156I integrates two independent 12-bit, 1 MSPS analog-to-digital converters (XADC) for monitoring on-chip supply voltages (VCCINT, VCCAUX) and die temperature. These ADCs are accessible via dedicated auxiliary analog inputs and do not require external components for basic system health monitoring.
Is XC7A200T-2FFG1156I pin-compatible with other Artix-7 devices in the same package?
No, XC7A200T-2FFG1156I is not pin-compatible with other Artix-7 FPGAs in the 1156-ball FFG package. Pin assignments are device-specific due to differing I/O bank structures, transceiver placement, and power delivery requirements - even within the same package variant and speed grade.
What configuration modes does XC7A200T-2FFG1156I support?
XC7A200T-2FFG1156I supports three primary configuration modes: JTAG (for debugging and programming), Master SPI (using on-board flash), and Slave Parallel (BPI) using external NOR flash. Mode selection is controlled by the M0–M2 pins at power-up, and all modes are fully documented in Xilinx UG470.
Can XC7A200T-2FFG1156I operate in radiation-prone environments such as aerospace avionics?
XC7A200T-2FFG1156I is not radiation-hardened and is not qualified for single-event upset (SEU) immunity in space or high-altitude flight. It is rated for industrial temperature operation (–40°C to +100°C) but lacks TID or SEE testing certification. For aerospace use, AMD offers the XQRKU060 or radiation-tolerant variants under separate qualification.
XC7A200T-2FFG1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC7A200T-2FFG1156I FAQ
1.How can I place an order for XC7A200T-2FFG1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-2FFG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-2FFG1156I reliable?
The price and inventory of XC7A200T-2FFG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-2FFG1156I is usually 5 days.
3.What payment methods are accepted for XC7A200T-2FFG1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-2FFG1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-2FFG1156I?
XC7A200T-2FFG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-2FFG1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-2FFG1156I?
For technical support, including XC7A200T-2FFG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-2FFG1156I requirements.
6.How does Aetrix verify that XC7A200T-2FFG1156I is sourced from the original manufacturer or authorized distributors?
All XC7A200T-2FFG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-2FFG1156I meets industry standards.
7.What is the process for return or replacement of XC7A200T-2FFG1156I?
All XC7A200T-2FFG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-2FFG1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-2FFG1156I part is unused and in its original packaging.
Return procedure for XC7A200T-2FFG1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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