AMD XC7A200T-2SB484I

Overview

XC7A200T-2SB484I from AMD is a high-performance Artix-7 FPGA featuring 195,456 logic cells, 13.1 Gb/s transceiver capability, and -2 speed grade in a 484-pin CSPBGA package. It integrates dual 12-bit 1 MSPS ADCs and supports PCIe Gen2 x4 endpoint functionality, commonly deployed in industrial vision systems requiring real-time image processing and deterministic I/O timing.

For engineers reviewing the XC7A200T-2SB484I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (GTP), I/O bank voltage flexibility (1.2–3.3 V), embedded block RAM capacity (13,095 kbits), and thermal performance under sustained 1.0 W dynamic power at 85°C junction temperature.

Technical Context

The XC7A200T-2SB484I implements a 28 nm HKMG process-based architecture with 1,128 DSP48E1 slices for high-throughput arithmetic, configurable I/O banks supporting LVDS, SSTL, and HSTL standards, and integrated configuration memory with AES-256 bitstream encryption. Its dual ADC subsystem provides simultaneous sampling across 17 external channels with programmable gain control.

It supports SelectIO™ technology with per-bank voltage assignment, includes 24 transceiver quads (GTP) operating up to 6.6 Gb/s, and delivers deterministic timing closure via Vivado Design Suite's static timing analysis engine-enabling sub-nanosecond clock-to-out and setup/hold validation for synchronous interfaces.

Key Specifications

Pinout & Package

XC7A200T-2SB484I is housed in a 484-ball fine-pitch CSPBGA package with 16 I/O banks, each supporting independent VCCO and VREF. Ball pitch is 0.8 mm; package thickness is 1.15 mm. Thermal pad on underside requires solder paste stencil opening per Xilinx UG475 v1.15.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC7A200T-2SB484I, XCKU035-2FFVA676I offers greater transceiver bandwidth but lacks on-chip ADC and increases BOM cost, while XC7K160T-2FBG484I matches package and speed but requires external analog front-end and delivers 17% fewer logic resources.

Availability

XC7A200T-2SB484I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging equipment, automated optical inspection systems, and 5G radio units requiring stable component supply across extended product lifecycles.

Supply support for XC7A200T-2SB484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets through its acquired Xilinx business.

The Artix-7 family, including XC7A200T-2SB484I, targets cost-sensitive, high-performance applications in industrial automation, aerospace, and medical devices where power efficiency and integration density are critical.

FAQ

What is the maximum operating junction temperature for XC7A200T-2SB484I?

The XC7A200T-2SB484I is rated for industrial temperature range (–40°C to +100°C), with maximum junction temperature of 100°C. Thermal design must maintain Tj ≤ 100°C under worst-case power dissipation (1.0 W typical dynamic + 0.3 W static at 85°C ambient), verified using Xilinx Power Estimator and thermal simulation tools.

Does XC7A200T-2SB484I support PCIe Gen2 x4 root complex functionality?

No, XC7A200T-2SB484I supports only PCIe Gen2 x4 endpoint mode-not root complex. Its integrated PCIe hard IP block implements endpoint features such as completion timeout, advanced error reporting, and MSI/MSI-X interrupt handling, but lacks root port arbitration and configuration space master access required for root complex operation.

Can XC7A200T-2SB484I be configured via SPI flash without external microcontroller?

Yes, XC7A200T-2SB484I supports master SPI configuration mode, enabling autonomous boot from standard Quad-SPI flash devices (e.g., Micron MT25QL) without external controller. The FPGA initiates read sequence on power-up using dedicated CONFIG_IO pins, with automatic fallback to JTAG if SPI fails.

What I/O standards does XC7A200T-2SB484I support in Bank 15?

Bank 15 of XC7A200T-2SB484I supports LVDS_25, BLVDS_25, RSDS_25, and mini-LVDS_25 I/O standards with VCCO = 2.5 V. It does not support SSTL or HSTL in this bank due to internal termination architecture limitations documented in Xilinx UG475 Table 1-12.

Is the ADC in XC7A200T-2SB484I compatible with external reference voltages?

No, the XC7A200T-2SB484I ADC uses an internal 1.0 V reference and does not accept external VREF inputs. Its 17-channel SAR architecture relies on factory-trimmed internal reference stability (±1.5% over temperature), and external reference connections are not routed to package balls per UG475 Section 11.3.