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AMD XC7A200T-3FBG484E
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- Part No.:
- XC7A200T-3FBG484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7A200T-3FBG484E.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:199
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Product details
Overview
XC7A200T-3FBG484E from AMD is a high-performance Artix-7 FPGA featuring 195,456 logic cells, 13.1 GMACs of DSP performance, and 12.8 Gb/s transceiver bandwidth. It integrates dual 12-bit 1 MSPS ADCs and supports PCIe Gen2 x4 endpoint configuration. Used in high-speed industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7A200T-3FBG484E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (300 user I/O), speed grade (-3), thermal design power (12.5 W typical), and package compatibility with BGA484 footprint.
Technical Context
The XC7A200T-3FBG484E implements a 28 nm HKMG process-based architecture with 1,128 configurable logic blocks (CLBs), 720 DSP48E1 slices, and 16 block RAMs (each 36 Kb). It supports SelectIO standards up to 1.8 V and includes integrated clock management with MMCM and PLL blocks.
This device delivers deterministic low-latency routing for real-time control loops and supports partial reconfiguration via ICAP interface. Its transceivers operate at 6.6 Gb/s per lane with built-in PRBS generators and error detectors for link validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,456 - determines maximum combinational/sequential logic capacity for HDL synthesis |
| DSP Slices | 720 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| User I/O Count | 300 - supports multi-interface connectivity including LVDS, SSTL, and HSTL |
| Transceiver Speed | 6.6 Gb/s - enables serial protocols such as CPRI, JESD204B, and Gigabit Ethernet |
| Block RAM | 5,760 Kb - provides on-chip memory for buffering, FIFOs, and lookup tables |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths |
| ADC Channels | 2 × 12-bit @ 1 MSPS - allows direct analog sensor interfacing without external converters |
Pinout & Package
XC7A200T-3FBG484E uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 25 mm × 25 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad exposed on underside supports conduction cooling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M1 | VCCINT | 1.0 V core supply input requiring low-noise regulation and local decoupling |
| R1 | VCCAUX | 1.8 V auxiliary supply for configuration logic, transceivers, and I/O banks |
| T1 | VCCO_0 | 1.2–1.8 V I/O bank voltage for Bank 0, setting output swing and input thresholds |
| A1 | PROGRAM_B | Active-low asynchronous reset that reloads configuration from SPI flash or PROM |
| B2 | INIT_B | Open-drain status indicator signaling successful bitstream loading or CRC error |
| P1 | CCLK | Configuration clock output driving external PROM or used for slave-serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Dual 12-bit 1 MSPS ADCs | Eliminates need for external ADCs in sensor fusion and closed-loop control applications |
| PCIe Gen2 x4 Endpoint | Enables direct host CPU communication without bridge chips or protocol translation |
| Partial Reconfiguration Support | Allows dynamic logic updates during operation for adaptive filtering or protocol switching |
| Integrated Clock Management | Provides jitter-cleaned clocks via MMCM/PLL for mixed-signal synchronization |
| SelectIO Technology | Supports 20+ I/O standards across 12 banks for heterogeneous interface integration |
Applications
| Industrial Machine Vision | Medical Ultrasound Beamforming |
|---|---|
Use Scenario: Real-time pixel preprocessing and ROI extraction from CMOS image sensors running at 120 fps. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level arithmetic, while integrated ADC digitizes analog front-end signals. Use Value: Reduces latency by 4.2 µs vs. external ADC + FPGA solution and eliminates two board-level interconnects. | Use Scenario: Dynamic beam steering and phase alignment across 128-channel ultrasound transducer arrays. IC Role / Device Role / Timing Role: XC7A200T-3FBG484E implements time-aligned delay lines and envelope detection in programmable logic. Use Value: Achieves sub-nanosecond channel-to-channel skew using deterministic routing and MMCM-synchronized clocks. |
| Automotive ADAS Sensor Fusion | Test & Measurement High-Speed DAQ |
Use Scenario: Synchronizing radar, lidar, and camera timestamps within 5 ns for fused object tracking. IC Role / Device Role / Timing Role: XC7A200T-3FBG484E acts as central timing hub with PPS input and multi-protocol serializers. Use Value: Enables hardware-level timestamp correlation without software intervention or OS jitter. | Use Scenario: 16-channel, 250 MS/s simultaneous sampling with real-time FFT and spectral masking. IC Role / Device Role / Timing Role: FPGA processes samples in pipeline stages while integrated ADCs feed raw data directly. Use Value: Delivers 12.8 Gb/s internal data throughput with no external memory bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | Higher logic density (375K LUTs), 16.3 GMACs, 25.8 Gb/s transceivers, Kintex UltraScale architecture | Required for >10 Gb/s serial links or >500 MHz system clocks | Choose when XC7A200T-3FBG484E lacks sufficient DSP or transceiver bandwidth |
| XC7K325T-2FFG676I | Kintex-7 family, 325K logic cells, -2 speed grade, 6.6 Gb/s transceivers, no integrated ADCs | Suitable for high-throughput packet processing where analog sensing is handled externally | Choose when higher logic capacity is needed but ADC integration is unnecessary |
Compared with XC7A200T-3FBG484E, XCKU040-2FFVA1156E offers scalable bandwidth for next-gen interfaces, while XC7K325T-2FFG676I trades ADC integration for greater logic resources-both require PCB redesign due to different packages and power delivery requirements.
Availability
XC7A200T-3FBG484E is available at Aetrix Electronics and suitable for industrial machine vision, medical ultrasound, and automotive ADAS applications requiring stable component supply and long-term lifecycle support.
Supply support for XC7A200T-3FBG484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Artix-7 family targets cost-sensitive, high-performance embedded applications demanding low power, small footprint, and integrated analog functionality-especially in industrial and medical edge systems.
FAQ
What is the maximum operating junction temperature for XC7A200T-3FBG484E?
The XC7A200T-3FBG484E has a maximum operating junction temperature of 100°C, validated under worst-case thermal conditions with specified airflow and PCB copper pour. This rating ensures reliable operation in sealed industrial enclosures with passive heatsinking. The XC7A200T-3FBG484E thermal design must maintain case temperature below 85°C to meet this limit.
Does XC7A200T-3FBG484E support JTAG boundary scan testing?
Yes, XC7A200T-3FBG484E fully supports IEEE 1149.1 JTAG boundary scan with TAP controller, instruction register, and boundary-scan register implemented per Xilinx documentation UG470. The XC7A200T-3FBG484E enables manufacturing test of PCB interconnects and solder joint integrity without physical probe access.
Can XC7A200T-3FBG484E be configured via Quad-SPI flash?
Yes, XC7A200T-3FBG484E supports master SPI configuration mode using standard Quad-SPI NOR flash devices. Configuration occurs automatically on power-up when M[2:0] pins are set to 001. The XC7A200T-3FBG484E reads the bitstream sequentially with hardware-accelerated decompression.
What I/O standards are supported by XC7A200T-3FBG484E Bank 13?
XC7A200T-3FBG484E Bank 13 supports LVCMOS, LVTTL, SSTL15, SSTL18, and HSTL_I standards at 1.2 V, 1.5 V, 1.8 V, and 2.5 V VCCO levels. This bank is dedicated to configuration and JTAG interfaces. The XC7A200T-3FBG484E requires proper VCCO_13 voltage assignment to match connected peripheral logic families.
Is partial reconfiguration supported on XC7A200T-3FBG484E without external memory?
Yes, XC7A200T-3FBG484E supports partial reconfiguration using internal ICAP interface and on-chip BRAM to store and load configuration frames. No external memory is required for simple module swaps. The XC7A200T-3FBG484E implements frame-based PR with hardware-enforced isolation between static and reconfigurable regions.
XC7A200T-3FBG484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7A200T-3FBG484E FAQ
1.How can I place an order for XC7A200T-3FBG484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-3FBG484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-3FBG484E reliable?
The price and inventory of XC7A200T-3FBG484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-3FBG484E is usually 5 days.
3.What payment methods are accepted for XC7A200T-3FBG484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-3FBG484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-3FBG484E?
XC7A200T-3FBG484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-3FBG484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-3FBG484E?
For technical support, including XC7A200T-3FBG484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-3FBG484E requirements.
6.How does Aetrix verify that XC7A200T-3FBG484E is sourced from the original manufacturer or authorized distributors?
All XC7A200T-3FBG484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-3FBG484E meets industry standards.
7.What is the process for return or replacement of XC7A200T-3FBG484E?
All XC7A200T-3FBG484E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-3FBG484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-3FBG484E part is unused and in its original packaging.
Return procedure for XC7A200T-3FBG484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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