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AMD XC7A200T-3FBG676E
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- Part No.:
- XC7A200T-3FBG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7A200T-3FBG676E.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,790
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Product details
Overview
XC7A200T-3FBG676E from AMD is a high-performance Artix-7 FPGA featuring 198,950 logic cells, 13.1 GMACs of DSP performance, and 14.4 Mb of block RAM, deployed in industrial control systems requiring deterministic real-time processing and multi-protocol I/O interfacing.
For engineers reviewing the XC7A200T-3FBG676E datasheet, pinout, applications, or equivalent options, key selection criteria include speed grade (-3), package footprint (676-pin FCBGA), I/O count (400 user I/Os), and transceiver support (16 GTP serial transceivers up to 6.6 Gb/s).
Technical Context
The XC7A200T-3FBG676E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and dedicated DSP48E1 slices supporting pipelined arithmetic and filtering operations. It integrates 16 GTP transceivers compliant with PCIe Gen2, SATA, and DisplayPort standards.
Configuration is supported via Master SPI, Slave SelectMAP, or JTAG interfaces; startup time is 4.5 ms with configuration clock up to 100 MHz. The device supports partial reconfiguration and AXI4-compliant interconnect for SoC integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for custom digital functions |
| DSP Slices | 740 - enables parallel multiply-accumulate operations at up to 450 MHz for signal processing |
| Block RAM | 14.4 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory |
| User I/Os | 400 - supports multi-standard interface bridging (LVDS, SSTL, HSTL) across diverse peripheral domains |
| GTP Transceivers | 16 × 6.6 Gb/s - delivers native SerDes for embedded vision, industrial Ethernet, and high-speed data acquisition |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical path logic |
| Package | 676-pin FCBGA (27×27 mm, 1.0 mm pitch) - enables high-density routing and thermal management in compact PCBs |
Pinout & Package
The XC7A200T-3FBG676E is housed in a 676-ball fine-pitch flip-chip ball grid array (FCBGA) package with 27×27 mm body size and 1.0 mm ball pitch. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, transceivers, and I/O banks |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2–3.3V) enabling mixed-voltage interface support |
| M0–M2 | Mode configuration pins | Determine boot source (SPI, BPI, or JTAG) and configuration mode at power-up |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness |
| CCLK | Configuration clock | Input clock for Master SPI configuration; max 100 MHz operation |
| GTPREFCLK | Transceiver reference clock | Differential input for GTP PLL; supports 10–625 MHz frequencies |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic updates without full device reset-critical for adaptive control and runtime protocol switching |
| AXI4 Interconnect Compliance | Allows seamless integration with ARM Cortex-A9 MPCore processors and third-party IP in Zynq-7000-like system architectures |
| UltraScale-Compatible Toolflow | Uses Vivado Design Suite 2022.2+ for synthesis, place-and-route, and bitstream generation with timing-aware optimization |
| Industrial Temperature Range | Operates reliably from –40°C to +100°C junction temperature-qualified for factory automation and outdoor edge nodes |
| Security Bitstream Encryption | Supports AES-256 bitstream encryption with HMAC authentication to prevent IP cloning and unauthorized configuration |
Applications
| Industrial Motor Control | Embedded Vision System |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of servo drives with synchronized current sensing and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop control algorithms with sub-μs latency; GTP transceivers interface with camera sensors over SLVS-EC. Use Value: 400 user I/Os enable simultaneous control of 6-axis motion and safety monitoring signals without external glue logic. | Use Scenario: Multi-camera image preprocessing pipeline in smart traffic cameras with onboard object detection. IC Role / Device Role / Timing Role: XC7A200T-3FBG676E performs Bayer demosaicing, histogram equalization, and ROI cropping before feeding CNN accelerator. Use Value: 740 DSP slices deliver 2.1 GOPS at 150 MHz for real-time pixel-level computation without DRAM bottleneck. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Modular PLC backplane with hot-swappable I/O modules and deterministic cyclic execution. IC Role / Device Role / Timing Role: Configurable logic implements IEC 61131-3 instruction set interpreter and EtherCAT slave controller with <1 μs jitter. Use Value: -3 speed grade ensures cycle times ≤ 100 ns for safety-critical ladder logic execution. | Use Scenario: High-resolution oscilloscope front-end with 12-bit ADC sampling at 1 GS/s and real-time FFT analysis. IC Role / Device Role / Timing Role: XC7A200T-3FBG676E manages ADC interface, trigger logic, and 1024-point streaming FFT using block RAM and DSP slices. Use Value: 14.4 Mb block RAM stores 4k samples per channel while maintaining zero-latency pipeline throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, 375K logic cells, 20 GTH transceivers (16.3 Gb/s), higher power and cost | Targets higher-bandwidth protocols (PCIe Gen4, 10G Ethernet) and larger algorithm footprints | Select when >250K logic cells or >12 Gb/s transceiver rate is required; not drop-in compatible |
| XC7A100T-3FGG484I | Same Artix-7 family, 101K logic cells, 280 DSP slices, 400 I/Os, 4 GTP transceivers, smaller 484-pin package | Suitable for cost-sensitive, lower-compute industrial gateways with reduced I/O density | Choose for space-constrained designs where 198K logic cells and 16 GTP lanes are unnecessary |
Compared with XC7A200T-3FBG676E, XCKU040-2FFVA1156E offers higher bandwidth but demands more board area and thermal design effort, while XC7A100T-3FGG484I reduces cost and footprint at the expense of DSP throughput and transceiver count-making it suitable only for scaled-down implementations.
Availability
XC7A200T-3FBG676E is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, and programmable logic controllers requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-3FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, PCs, gaming, and embedded systems through high-performance CPUs, GPUs, FPGAs, and adaptive SoCs.
The Artix-7 FPGA product line targets cost-optimized, power-efficient applications in industrial automation, video processing, and communications infrastructure-designed for deterministic real-time performance with integrated transceivers and hardened IP.
FAQ
What is the maximum operating frequency of the XC7A200T-3FBG676E core logic?
The XC7A200T-3FBG676E has a -3 speed grade, guaranteeing reliable operation of core logic up to 622 MHz for register-to-register paths under worst-case industrial conditions. This rating is validated by AMD's static timing analysis tools in Vivado and applies to CLB-based synchronous designs meeting setup/hold constraints.
Does the XC7A200T-3FBG676E support JTAG boundary-scan testing?
Yes, the XC7A200T-3FBG676E fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. TDI, TDO, TMS, TCK, and TRST pins are dedicated and electrically compliant with standard JTAG voltage levels and timing requirements.
Can the XC7A200T-3FBG676E be configured via PCIe enumeration?
No, the XC7A200T-3FBG676E does not support direct PCIe enumeration-based configuration. It requires external configuration via SPI flash, BPI flash, or JTAG. However, its 16 GTP transceivers can implement PCIe Gen2 endpoints after configuration using soft IP or hardened PCIe blocks in the design.
What is the recommended configuration memory size for the XC7A200T-3FBG676E?
A minimum of 64 Mbit (8 MB) SPI flash is recommended for single-bit stream configuration of the XC7A200T-3FBG676E. For dual-bitstream or encrypted bitstream storage, 128 Mbit (16 MB) or higher capacity is advised to accommodate overhead and future firmware updates.
Is the XC7A200T-3FBG676E qualified for automotive applications?
No, the XC7A200T-3FBG676E is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. For automotive use, AMD offers the XA7A200T variant with extended qualification, including HTOL and ESD testing per automotive reliability standards.
XC7A200T-3FBG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7A200T-3FBG676E FAQ
1.How can I place an order for XC7A200T-3FBG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-3FBG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-3FBG676E reliable?
The price and inventory of XC7A200T-3FBG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-3FBG676E is usually 5 days.
3.What payment methods are accepted for XC7A200T-3FBG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-3FBG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-3FBG676E?
XC7A200T-3FBG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-3FBG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-3FBG676E?
For technical support, including XC7A200T-3FBG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-3FBG676E requirements.
6.How does Aetrix verify that XC7A200T-3FBG676E is sourced from the original manufacturer or authorized distributors?
All XC7A200T-3FBG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-3FBG676E meets industry standards.
7.What is the process for return or replacement of XC7A200T-3FBG676E?
All XC7A200T-3FBG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-3FBG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-3FBG676E part is unused and in its original packaging.
Return procedure for XC7A200T-3FBG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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