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AMD XC7A200T-3FFG1156E
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- Part No.:
- XC7A200T-3FFG1156E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7A200T-3FFG1156E.pdf
- Description:
- IC FPGA 500 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,823
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Product details
Overview
XC7A200T-3FFG1156E from AMD (Xilinx) is a high-performance Artix-7 FPGA with 198,950 logic cells, 13.1 Gb/s transceiver capability, and 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging. It integrates 480 DSP slices, 13.2 Mb of block RAM, and supports PCIe Gen2 x8 endpoint/root complex operation in industrial control and video processing systems.
For engineers reviewing the XC7A200T-3FFG1156E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 3.3 V), -3 speed grade timing performance, transceiver lane count, and thermal design power (12.3 W typical at 85°C junction).
Technical Context
The XC7A200T-3FFG1156E implements a 28 nm HKMG process-based architecture with SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. Its transceivers operate at up to 13.1 Gb/s with built-in PRBS generators and checkers for link validation.
Configuration is supported via Master SPI, Slave Serial, or JTAG interfaces; bitstream encryption and HMAC authentication are integrated for secure configuration. The device includes clock management tiles with MMCM and PLL blocks enabling precise clock synthesis and phase alignment across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 13.2 Mb - supports large on-chip data buffering, FIFOs, and memory-mapped peripherals |
| DSP Slices | 480 - enables high-throughput fixed-point and floating-point arithmetic for signal processing |
| Transceiver Speed | 13.1 Gb/s - meets HDMI 2.0, DisplayPort 1.4, and PCIe Gen2 x8 serial interface requirements |
| I/O Standards | SSTL-18/25, HSTL-I/II, LVCMOS 1.2–3.3 V - allows direct interfacing with DDR3, FPGAs, and microcontrollers |
| Speed Grade | -3 - guarantees worst-case timing closure at highest operating frequency for critical paths |
| TDP | 12.3 W (85°C) - defines thermal solution sizing and PCB copper pour requirements |
Pinout & Package
XC7A200T-3FFG1156E uses a 1156-ball FC-FBGA package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid. Pin assignment follows Xilinx UG475 v1.14 (Artix-7 Packaging and Pinout) for FFG1156 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.0 V core supply input requiring low-noise regulation and local decoupling |
| A14 | VCCAUX | 1.8 V auxiliary supply for configuration, JTAG, and transceiver reference |
| M2 | VRP/VRN | Differential reference pair for I/O bank calibration and impedance matching |
| E12 | CLK_IN1_P/N | Dedicated differential clock input feeding MMCM/PLL for system clock domain generation |
| R1 | MGTREFCLK0P/N | Reference clock input for transceiver banks, critical for jitter tolerance compliance |
| H2 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset-critical for adaptive radio and real-time protocol stacks |
| Integrated PCI Express Block | Hard IP supporting Gen2 x8 endpoint/root complex with AXI4 streaming interface and DMA engine |
| Secure Configuration | HMAC-SHA256 authentication and AES-256 bitstream encryption prevent unauthorized firmware loading |
| UltraScale-Compatible Toolflow | Full Vivado 2023.1+ support with timing-driven place-and-route, power analysis, and debug IP integration |
| Thermal Monitoring Diode | On-die diode enables real-time junction temperature measurement via external ADC for thermal throttling |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time image preprocessing pipeline in high-speed inspection systems using CMOS sensors at 120 fps. IC Role / Device Role / Timing Role: FPGA acts as pixel-level accelerator handling Bayer demosaicing, histogram equalization, and ROI extraction before CPU handoff. Use Value: 480 DSP slices and 13.2 Mb BRAM enable sub-frame latency < 80 µs while sustaining 2.4 Gbps sensor throughput. | Use Scenario: DICOM-compliant video encoder for ultrasound and endoscopy systems with dual-channel HD capture. IC Role / Device Role / Timing Role: XC7A200T-3FFG1156E serves as video processing hub, synchronizing HDMI TX, MIPI CSI-2 RX, and JPEG2000 compression IP. Use Value: 13.1 Gb/s transceivers support simultaneous 4K@30 HDMI output and dual-lane MIPI CSI-2 input at 1.5 Gbps/lane. |
| Avionics Data Concentrator | Test & Measurement Signal Generator |
Use Scenario: ARINC 429/664 (AFDX) gateway consolidating sensor telemetry from flight control surfaces and environmental monitors. IC Role / Device Role / Timing Role: XC7A200T-3FFG1156E implements deterministic AFDX end-system MAC with time-triggered scheduling and CRC-32 validation. Use Value: -3 speed grade ensures 100% timing closure on 100 Mbps AFDX receive paths with < 25 ns jitter accumulation over 1000 km virtual links. | Use Scenario: Arbitrary waveform generator producing multi-tone RF stimuli for 5G NR base station receiver testing. IC Role / Device Role / Timing Role: FPGA hosts DDS cores, digital upconverters, and 16-bit DAC interface logic with precise sample-clock synchronization. Use Value: 198,950 logic cells accommodate 12 parallel DDS engines and 256-tap FIR filters running at 1.2 GSps effective sample rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K160T-2FFG676I | Kintex-7 family; higher logic density (162,240 LUTs), 2.5x more DSP slices (1,200), but larger 676-ball package and higher TDP (18.5 W) | Better suited for multi-channel radar beamforming where DSP throughput dominates I/O count | Select when >300 DSP slices and PCIe Gen3 x4 are required; avoid if board space or thermal budget is constrained |
| XCZU2EG-1SFVC784E | Zynq UltraScale+ MPSoC; integrates quad-core ARM Cortex-A53 + GPU + FPGA fabric (103K LUTs), but requires heterogeneous software stack | Preferred for embedded vision with Linux OS, OpenCV offload, and real-time FPGA co-processing | Choose when application demands both rich OS services and programmable logic; not drop-in compatible due to architectural divergence |
Compared with XC7A200T-3FFG1156E, XC7K160T-2FFG676I delivers higher compute density at cost of thermal headroom and board area, while XCZU2EG-1SFVC784E shifts design focus from pure logic acceleration to hybrid software-hardware partitioning-requiring toolchain and firmware re-architecture.
Availability
XC7A200T-3FFG1156E is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging interfaces requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-3FFG1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Artix-7 product line as part of its adaptive computing portfolio for cost-sensitive, high-performance applications.
The Artix-7 family targets high-throughput, low-latency embedded systems where power efficiency and I/O flexibility outweigh raw logic density-ideal for real-time video, industrial networking, and test equipment.
FAQ
What is the maximum supported transceiver data rate for XC7A200T-3FFG1156E?
The XC7A200T-3FFG1156E supports transceiver data rates up to 13.1 Gb/s per lane, validated per Xilinx DS181 v1.17. This enables native HDMI 2.0 and DisplayPort 1.4 compliance without external retimers. The XC7A200T-3FFG1156E transceiver banks require dedicated MGTREFCLK inputs and proper AC-coupled differential routing to achieve specified jitter tolerance.
Does XC7A200T-3FFG1156E support partial reconfiguration?
Yes, XC7A200T-3FFG1156E supports hardware-accelerated partial reconfiguration through Vivado's PRC flow. This allows dynamic module swapping in operational systems-such as updating communication protocol stacks in avionics gateways without resetting the entire XC7A200T-3FFG1156E configuration memory or disrupting active I/O channels.
What I/O standards are supported by XC7A200T-3FFG1156E?
XC7A200T-3FFG1156E supports SSTL-18/25, HSTL-I/II, LVCMOS 1.2 V to 3.3 V, LVDS, BLVDS, RSDS, and TMDS across its 400-user I/O pins. Each I/O bank operates independently at selectable VCCO voltages, enabling direct interfacing with DDR3 memory, microcontrollers, and high-speed video interfaces without level-shifting components.
Is XC7A200T-3FFG1156E qualified for automotive applications?
No, XC7A200T-3FFG1156E is not AEC-Q100 qualified and lacks automotive-grade screening or extended temperature range (-40°C to +125°C). It is rated for industrial temperature range (-40°C to +100°C) and intended for non-safety-critical industrial, medical, and test equipment-not automotive ADAS or powertrain systems.
What configuration modes does XC7A200T-3FFG1156E support?
XC7A200T-3FFG1156E supports Master SPI, Slave Serial, JTAG, and BPI (x16) configuration modes. Configuration bitstream can be loaded from SPI flash, microcontroller, or boundary-scan controller. The XC7A200T-3FFG1156E also supports fallback configuration and multi-boot with dual-image storage in external flash devices.
XC7A200T-3FFG1156E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC7A200T-3FFG1156E FAQ
1.How can I place an order for XC7A200T-3FFG1156E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-3FFG1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-3FFG1156E reliable?
The price and inventory of XC7A200T-3FFG1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-3FFG1156E is usually 5 days.
3.What payment methods are accepted for XC7A200T-3FFG1156E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-3FFG1156E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-3FFG1156E?
XC7A200T-3FFG1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-3FFG1156E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-3FFG1156E?
For technical support, including XC7A200T-3FFG1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-3FFG1156E requirements.
6.How does Aetrix verify that XC7A200T-3FFG1156E is sourced from the original manufacturer or authorized distributors?
All XC7A200T-3FFG1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-3FFG1156E meets industry standards.
7.What is the process for return or replacement of XC7A200T-3FFG1156E?
All XC7A200T-3FFG1156E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-3FFG1156E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-3FFG1156E part is unused and in its original packaging.
Return procedure for XC7A200T-3FFG1156E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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