AMD XC7A200T-L1FB676I

Overview

XC7A200T-L1FB676I from AMD is a Kintex-7 FPGA featuring 198,950 logic cells, 13.1 Gb/s transceiver speed, and -1L speed grade in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package. It integrates 240 DSP slices, 1,164 Block RAMs (36 Kb each), and supports PCIe Gen2 x8 endpoint/root complex operation in high-reliability industrial control systems.

For engineers reviewing the XC7A200T-L1FB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance with PCIe Gen2, deterministic timing closure at -1L speed grade, and thermal performance in convection-cooled 676-pin FCBGA layouts.

Technical Context

The XC7A200T-L1FB676I implements a fully programmable fabric based on 6-input LUTs and distributed RAM, with dedicated clock routing networks supporting up to 32 global clock buffers. Its transceivers comply with ANSI TIA/EIA-644-A LVDS and support CDR lock ranges from 600 MHz to 6.6 Gb/s.

Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption enabled through AES-256 and HMAC-SHA-256 authentication. The device supports partial reconfiguration and includes integrated XADC for real-time analog monitoring of on-die temperature and supply voltages.

Key Specifications

Pinout & Package

XC7A200T-L1FB676I is housed in a 27×27 mm, 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm pitch, designed for thermal dissipation in industrial enclosures with forced-air cooling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC7A200T-L1FB676I, the XCKU040 offers higher throughput at increased power and layout complexity, while the XC7K325T-2FFG676I delivers greater logic capacity in the same footprint but requires full bitstream regeneration and timing revalidation.

Availability

XC7A200T-L1FB676I is available at Aetrix Electronics and suitable for radar signal processing, industrial machine vision, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC7A200T-L1FB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt efficiency.

The Kintex-7 FPGA product line targets high-performance, cost-sensitive applications including wired communications, video processing, and test equipment where balanced logic, I/O, and transceiver resources are essential.

FAQ

What is the maximum operating junction temperature for XC7A200T-L1FB676I?

The XC7A200T-L1FB676I has a maximum operating junction temperature of 100°C, validated under the -1L speed grade specification with 1.0 V core supply. This rating applies to continuous operation in industrial environments with adequate PCB copper pour and airflow ≥200 LFM. Thermal derating is required above this limit, and the on-die XADC continuously reports die temperature to enable proactive throttling in safety-critical XC7A200T-L1FB676I deployments.

Does XC7A200T-L1FB676I support partial reconfiguration?

Yes, XC7A200T-L1FB676I supports partial reconfiguration through Vivado Design Suite, enabling dynamic module swapping without full device reset. This capability is implemented in the FPGA fabric and verified for use cases such as adaptive radar waveform updates and real-time protocol stack switching. Configuration security features-including AES-256 encryption-remain active during partial bitstream loads in XC7A200T-L1FB676I systems.

What I/O standards are supported by XC7A200T-L1FB676I bank voltage configurations?

XC7A200T-L1FB676I supports LVCMOS (1.2 V to 3.3 V), LVDS, SSTL-15/18, and HSTL-I/II across its 14 I/O banks, with bank-specific VCCO voltages configurable per JEDEC standard. Each bank's I/O standard must match its assigned VCCO; for example, SSTL-18 requires 1.8 V VCCO, while LVDS operates with 2.5 V VCCO. These settings are defined in the XC7A200T-L1FB676I constraints file and enforced during place-and-route.

Can XC7A200T-L1FB676I be used as a PCIe Gen3 endpoint?

No, XC7A200T-L1FB676I transceivers are rated up to 13.1 Gb/s but do not meet PCIe Gen3 electrical compliance requirements. It supports PCIe Gen2 x8 endpoint and root complex operation with full MSI-X and AER capability. For PCIe Gen3, designers must select UltraScale or Versal devices. The XC7A200T-L1FB676I remains optimal for Gen2-based data acquisition and instrumentation where deterministic latency and lower power are prioritized over raw bandwidth.

Is XC7A200T-L1FB676I pin-compatible with other Kintex-7 FPGAs in the 676-pin FCBGA package?

No, XC7A200T-L1FB676I is not pin-compatible with other Kintex-7 devices in the 676-pin FCBGA package, including XC7K325T-2FFG676I. While both share the same package outline and ball count, their pin functions differ significantly-especially for transceiver banks, configuration signals, and MIO assignments. Board-level compatibility requires full schematic and layout validation; XC7A200T-L1FB676I must be treated as a unique pinout within the Kintex-7 family.