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AMD XC7A200T-L1FBG484I
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- Part No.:
- XC7A200T-L1FBG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7A200T-L1FBG484I.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,989
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Product details
Overview
XC7A200T-L1FBG484I from AMD is a Kintex-7 FPGA with 198,950 logic cells, 13.1 Gb/s transceiver capability, and -1L speed grade in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package; used in high-throughput data acquisition systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XC7A200T-L1FBG484I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, CLB count, I/O bank voltage support, and thermal performance under sustained 2.5 Gb/s SerDes operation.
Technical Context
The XC7A200T-L1FBG484I implements a 28 nm HKMG process-based architecture with 12 integrated 6.6 Gb/s GTx transceivers, configurable I/O banks supporting 1.2 V to 3.3 V signaling, and dual-register 6-input LUTs per CLB. It supports PCI Express Gen2 x8 endpoint configuration and DDR3 memory interfaces up to 800 MHz.
Configuration occurs via Master SPI or JTAG, with bitstream encryption enabled through AES-256 and HMAC authentication. The device includes dedicated clock management tiles with MMCM and PLL blocks capable of sub-100 fs jitter synthesis for synchronous high-speed interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 CLBs - determines maximum combinational/sequential logic density for protocol stack implementation |
| GTx Transceivers | 12 × 6.6 Gb/s - enables 10GbE, CPRI, or JESD204B links without external retimers |
| I/O Pins | 285 user-configurable - supports mixed-voltage interface coexistence across 12 I/O banks |
| Memory Resources | 14,040 Kb Block RAM - sufficient for dual-port FIFOs buffering 12-bit 200 MSPS ADC streams |
| Speed Grade | -1L - guarantees timing closure at 667 MHz on DDR3 interfaces with 1.5 V VCCO |
| Package | 484-pin FBGA (F19 footprint) - requires 0.8 mm pitch PCB layout with thermal vias under die |
Pinout & Package
XC7A200T-L1FBG484I uses a 484-ball Fine-Pitch BGA (FBGA) package with 0.8 mm ball pitch, 23 × 23 array, and thermal pad exposed on underside. Package meets JEDEC MO-271AB standard and supports reflow per IPC/JEDEC J-STD-020D.3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.0 V core supply input - must be filtered within 1 cm of ball with ≥22 µF low-ESR ceramic |
| K19 | VCCAUX | 1.8 V auxiliary supply - powers configuration logic, PCIe block, and clock management |
| R15 | M0–M2 | Mode pins - set boot source (SPI/JTAG/BPI) during power-on reset sequence |
| A12 | CLK_IN1_P | Differential clock input - connects to external oscillator for MMCM reference (max 800 MHz) |
| T10 | IO_L1P_T0_34 | Bank 34 I/O - supports LVDS, SSTL15, or HSTL_I with programmable drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 x8 Endpoint | Eliminates need for external bridge IC in host-facing data concentrators |
| AXI4-Stream Interface Support | Enables direct connection to Xilinx IP cores for video processing pipelines without glue logic |
| UltraScale-compatible Configuration Interface | Allows reuse of existing programming infrastructure from newer FPGA families |
| Partial Reconfiguration Capability | Supports dynamic function swapping in radar beamforming applications without full system reset |
| SEU Mitigation with EDAC | Corrects single-bit errors and detects double-bit errors in configuration memory |
Applications
| Medical Imaging Data Hub | 5G Massive MIMO Radio Unit |
|---|---|
Use Scenario: Aggregating real-time echo data from 64-channel ultrasound probe front-ends. IC Role / Device Role / Timing Role: High-speed serializer/deserializer hub synchronizing ADC samples across channels using deterministic clock domain crossing. Use Value: Achieves <1.2 ns inter-channel skew at 125 MSPS sampling via dedicated clock routing and phase-matched I/O delays. | Use Scenario: Baseband processing unit handling 16×16 antenna element IQ data streams in sub-6 GHz 5G NR deployments. IC Role / Device Role / Timing Role: JESD204B subclass 1 receiver managing eight 12.288 Gbps lanes from RFICs with deterministic latency alignment. Use Value: Meets 3GPP TS 38.104 ±50 ns frame boundary tolerance using integrated SYSREF distribution network. |
| Industrial Machine Vision Controller | Avionics Sensor Fusion Module |
Use Scenario: Real-time inspection of PCB solder joints using four synchronized 100 MP/s CMOS image sensors. IC Role / Device Role / Timing Role: Pixel-level timestamping engine correlating sensor triggers with encoder position feedback. Use Value: Delivers sub-microsecond trigger-to-pixel alignment accuracy using internal 125 MHz clock domain and programmable I/O delay calibration. | Use Scenario: Integrating inertial measurement unit (IMU), GPS, and air data computer outputs in DO-254-compliant flight control systems. IC Role / Device Role / Timing Role: Time-synchronized data concentrator enforcing ARINC 429 and MIL-STD-1553 bus timing constraints. Use Value: Guarantees <200 ns jitter on 1 MHz ARINC sync pulses via dedicated clock buffer and zero-delay routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-2FBG676I | 298,150 CLBs, 24 GTx transceivers, -2 speed grade, 676-pin FBGA | Higher logic density and transceiver count; larger PCB footprint and higher power | Select when >200k CLBs or >12 transceivers required; requires board redesign |
| XCKU040-2FFVA1156I | Ultrath scale architecture, 242,000 logic cells, 20 GTY transceivers up to 32.75 Gb/s | Supports PAM4 and coherent optics; not drop-in compatible due to different I/O standards and configuration flow | Choose for next-gen 400G Ethernet or optical transport; migration path only |
Compared with XC7A200T-L1FBG484I, XC7K325T-2FBG676I offers higher capacity but increases thermal load and board area, while XCKU040-2FFVA1156I delivers advanced SerDes and memory bandwidth at the cost of toolchain compatibility and legacy IP reuse.
Availability
XC7A200T-L1FBG484I is available at Aetrix Electronics and suitable for medical imaging data hubs, 5G radio units, and industrial machine vision controllers requiring stable component supply across extended production lifecycles.
Supply support for XC7A200T-L1FBG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, and transceiver resources - especially in wired communications, test equipment, and real-time signal processing.
FAQ
What is the maximum supported DDR3 data rate for XC7A200T-L1FBG484I?
The XC7A200T-L1FBG484I supports DDR3 interfaces up to 800 MHz (1600 MT/s), validated with 1.5 V VCCO and 32-bit bus width. This rating applies to banks configured in SSTL15_I class and requires matched trace lengths within ±5 mm. The XC7A200T-L1FBG484I datasheet specifies tFAW ≤ 40 ns and tRRD ≤ 10 ns for reliable operation under worst-case temperature and voltage corners.
Does XC7A200T-L1FBG484I support partial reconfiguration?
Yes, XC7A200T-L1FBG484I supports partial reconfiguration through Vivado Design Suite v2018.3 and later. This capability allows dynamic module swapping in the PL region without resetting the entire device or disrupting active I/O operations. The XC7A200T-L1FBG484I implements frame-based bitstream loading with CRC-protected configuration frames enabling safe runtime updates in radar and software-defined radio applications.
What configuration modes are supported by XC7A200T-L1FBG484I?
XC7A200T-L1FBG484I supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. The XC7A200T-L1FBG484I also supports fallback configuration and multi-boot via external flash with dual-image storage, enabling field-upgradable firmware in mission-critical systems.
Is XC7A200T-L1FBG484I qualified for automotive applications?
No, XC7A200T-L1FBG484I is not AEC-Q100 qualified and is rated for industrial temperature range (–40°C to +100°C junction). It lacks automotive-specific reliability testing, fault injection coverage, and qualification documentation. For automotive use, AMD recommends the XA7A200T variant, which shares the same logic fabric but includes extended temperature validation and automotive-grade packaging.
What is the purpose of the VCCAUX_IO supply on XC7A200T-L1FBG484I?
VCCAUX_IO supplies 1.8 V to I/O banks 13–16 and the configuration interface, decoupled separately from VCCAUX. This separation ensures stable configuration and high-speed I/O operation under transient load conditions. On XC7A200T-L1FBG484I, VCCAUX_IO must be regulated within ±3% and bypassed with ≥10 µF ceramic capacitance near each bank's power entry point to maintain signal integrity on 1.8 V LVCMOS and LVDS interfaces.
XC7A200T-L1FBG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7A200T-L1FBG484I FAQ
1.How can I place an order for XC7A200T-L1FBG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-L1FBG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-L1FBG484I reliable?
The price and inventory of XC7A200T-L1FBG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-L1FBG484I is usually 5 days.
3.What payment methods are accepted for XC7A200T-L1FBG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-L1FBG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-L1FBG484I?
XC7A200T-L1FBG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-L1FBG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-L1FBG484I?
For technical support, including XC7A200T-L1FBG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-L1FBG484I requirements.
6.How does Aetrix verify that XC7A200T-L1FBG484I is sourced from the original manufacturer or authorized distributors?
All XC7A200T-L1FBG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-L1FBG484I meets industry standards.
7.What is the process for return or replacement of XC7A200T-L1FBG484I?
All XC7A200T-L1FBG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-L1FBG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-L1FBG484I part is unused and in its original packaging.
Return procedure for XC7A200T-L1FBG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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