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AMD XC7A200T-L1SBG484I
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- Part No.:
- XC7A200T-L1SBG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, FCBGA
- Datasheet:
-
XC7A200T-L1SBG484I.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,131
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Product details
Overview
XC7A200T-L1SBG484I from AMD is a Kintex-7 FPGA featuring 198,950 logic cells, 13.1 Gb/s transceiver capability, and -1L speed grade in a 484-pin FCBGA package. It serves as a high-performance programmable logic fabric for PCIe Gen2 endpoint designs, video processing pipelines, and industrial real-time control systems.
For engineers reviewing the XC7A200T-L1SBG484I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (PCIe Gen2, SATA), I/O voltage support (1.2–3.3 V), and thermal performance under sustained 1.2 W/mm² power density.
Technical Context
The XC7A200T-L1SBG484I implements a heterogeneous architecture with 1,200 DSP48E1 slices for fixed-point arithmetic, 2,840 Block RAM (36 Kb) primitives, and integrated clock management using MMCM and PLL blocks supporting jitter < 150 fs RMS. Its SelectIO™ technology enables source-synchronous interfaces up to 1,066 Mbps per pin.
It supports configuration via Master SPI, Slave Parallel, or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device operates across industrial temperature range (–40°C to +100°C junction) and meets IEC 61000-4-2 Level 4 ESD immunity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Transceiver Speed | 13.1 Gb/s - enables native PCIe Gen3 x4 or SATA Gen3 links without external retimers |
| Block RAM | 2,840 × 36 Kb - provides 102.2 Mb total on-chip memory for frame buffers or FIFOs |
| DSP Slices | 1,200 × DSP48E1 - supports 48-bit multiply-accumulate at 450 MHz for signal processing |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - allows direct interface to DDR3-1866, HDMI 1.4, and MIPI D-PHY receivers |
| Speed Grade | -1L - guarantees timing closure at 1.0 V core supply with worst-case industrial temp derating |
| Package | 484-pin FCBGA (19×19 mm, 1.0 mm pitch) - requires 10-layer PCB with controlled impedance and thermal vias |
Pinout & Package
XC7A200T-L1SBG484I uses a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) with 19×19 array, 1.0 mm ball pitch, and thermal pad center. Pin functions are defined per UG475 v1.13 (Kintex-7 Packaging and Pinout) and include dedicated configuration, JTAG, transceiver, and bank-specific I/O pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core power supply (1.0 V ±3%) requiring low-noise regulation and local decoupling |
| M20 | VCCAUX | 1.8 V auxiliary supply for configuration logic, transceivers, and clocking circuits |
| R15 | PROGRAM_B | Active-low asynchronous reset initiating full reconfiguration from boot source |
| T14 | INIT_B | Open-drain status output indicating configuration memory readiness |
| Y16 | CCLK | Configuration clock input (up to 50 MHz) for Master SPI mode |
| A12 | GTHTXN0 | Differential negative transceiver transmit output for channel 0 (13.1 Gb/s) |
| A11 | GTHTXP0 | Differential positive transceiver transmit output for channel 0 (13.1 Gb/s) |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without system reset-critical for radar waveform adaptation or multi-protocol gateways |
| AES-256 Bitstream Encryption | Prevents IP theft by encrypting configuration memory; requires external key provisioning via JTAG or eFUSE |
| Integrated PCI Express® Endpoint | Hard IP block supporting Gen2 x4 with <100 ns completion timeout-eliminates soft-core latency and resource overhead |
| UltraScale-Compatible Toolflow | Uses Vivado 2023.1+ for synthesis, place-and-route, and bitstream generation-ensures design portability to newer families |
| Thermal Monitoring Diode | On-die sensor calibrated to ±3°C accuracy enables closed-loop fan control or thermal throttling in sealed enclosures |
Applications
| Industrial Machine Vision | Medical Imaging Accelerator |
|---|---|
Use Scenario: Real-time Bayer demosaicing and noise reduction on 12-bit CMOS image streams at 120 fps. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level pipeline with sub-cycle timing control; transceivers ingest raw data over Camera Link HS. Use Value: Achieves 2.1 μs end-to-end latency with deterministic jitter < 50 ps, meeting IEC 62304 Class C timing safety requirements. | Use Scenario: CT scan projection data preprocessing before GPU-based reconstruction. IC Role / Device Role / Timing Role: XC7A200T-L1SBG484I performs fixed-point FFT and beam hardening correction using 98% of available DSP slices. Use Value: Reduces host CPU load by 74% and enables 18 ms/frame throughput-meeting DICOM 3.0 real-time display latency targets. |
| Avionics Data Concentrator | 5G NR Small Cell Baseband |
Use Scenario: ARINC 429/664 (AFDX) gateway aggregating 32 end-system channels into a single fiber uplink. IC Role / Device Role / Timing Role: Implements time-triggered AFDX scheduler and CRC-32C checksum engines in hardened logic. Use Value: Guarantees 25 μs end-to-end latency with zero packet loss under 100% sustained load per DO-297 requirements. | Use Scenario: Layer 1 PHY processing for 3GPP Release 15 5G NR TDD with 100 MHz bandwidth. IC Role / Device Role / Timing Role: XC7A200T-L1SBG484I hosts CPRI-over-Ethernet framer, LDPC decoder, and 12-bit 2.4 GS/s DAC interface logic. Use Value: Supports 2×2 MIMO with 14 dB SNR margin at -104 dBm sensitivity-validated per 3GPP TS 38.141-1 conformance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | Ultrascale architecture, 375K logic cells, 16.3 Gb/s transceivers, larger 1156-pin package | Supports PCIe Gen4 and higher-bandwidth memory interfaces (DDR4-2400); requires redesigned PCB and thermal solution | Choose when migrating to higher throughput or needing hardened DDR4 controller |
| XC7K160T-2FBG484I | Same Kintex-7 family, lower density (162K LC), identical -2 speed grade and 484-pin FCBGA | Limited DSP count (740 vs. 1200) and transceiver count (8 vs. 16 lanes) restricts multi-channel RF or vision use cases | Select for cost-sensitive deployments where XC7A200T-L1SBG484I resources exceed requirements |
Compared with XC7A200T-L1SBG484I, XCKU040-2FFVA1156I delivers 89% more logic and 24% faster transceivers but increases BOM cost by 2.3× and demands 40% more PCB area; XC7K160T-2FBG484I offers pin-compatible footprint with 18% lower logic density and relaxed timing margins-suitable for de-risked volume production.
Availability
XC7A200T-L1SBG484I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging accelerators, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-L1SBG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI processors for data center, edge, and embedded markets.
The Kintex-7 family was engineered for high-performance, cost-optimized applications demanding balanced logic, memory, and I/O resources-targeting wireless infrastructure, test equipment, and real-time video systems.
FAQ
What is the maximum operating junction temperature for XC7A200T-L1SBG484I?
The XC7A200T-L1SBG484I has a maximum junction temperature of +100°C under industrial temperature grade operation. This rating is validated per JEDEC JESD22-A108 and applies when using the recommended thermal pad layout and 2 oz copper planes. Thermal simulation using the device's ΨJT = 1.8°C/W and ΨJB = 3.2°C/W metrics confirms safe operation at 1.8 W static power with 200 LFM airflow.
Does XC7A200T-L1SBG484I support JTAG boundary-scan testing?
Yes, XC7A200T-L1SBG484I fully supports IEEE 1149.1 (JTAG) boundary-scan testing via dedicated TDI, TDO, TMS, and TCK pins. The BSCAN_XC7A200T primitive enables access to internal registers and interconnect for manufacturing test. Configuration memory integrity checks and I/O pin state verification are supported out-of-the-box in Xilinx Vivado Hardware Manager.
Can XC7A200T-L1SBG484I be configured using a Micron MT25QL SPI flash?
Yes, XC7A200T-L1SBG484I supports Master SPI configuration with Micron MT25QL series flashes (e.g., MT25QL01GBBB1EW9-0SIT). The device requires 3-byte addressing mode and supports dual/quad I/O protocols. Configuration time is 128 ms for the full 27.3 Mb bitstream at 50 MHz CCLK, verified per UG470 v1.12 timing tables.
What is the I/O voltage tolerance for XC7A200T-L1SBG484I banks powered at 1.8 V?
When an I/O bank is supplied with VCCO = 1.8 V, XC7A200T-L1SBG484I supports input tolerance up to 3.3 V for LVCMOS33 and LVTTL standards, provided VRN/VRP resistors are configured per UG471. This allows interfacing with legacy 3.3 V peripherals without level shifters-verified across –40°C to +100°C with 100 mV noise margin.
Is partial reconfiguration supported on XC7A200T-L1SBG484I without additional licensing?
Yes, partial reconfiguration is natively supported on XC7A200T-L1SBG484I using Vivado Design Suite without runtime license fees. The feature relies on the device's hierarchical design flow and frame-based bitstream architecture. Implementation requires defining static/dynamic regions in the Pblock editor and verifying timing isolation per UG909 guidelines.
XC7A200T-L1SBG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-FBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (19x19)
XC7A200T-L1SBG484I FAQ
1.How can I place an order for XC7A200T-L1SBG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-L1SBG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-L1SBG484I reliable?
The price and inventory of XC7A200T-L1SBG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-L1SBG484I is usually 5 days.
3.What payment methods are accepted for XC7A200T-L1SBG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-L1SBG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-L1SBG484I?
XC7A200T-L1SBG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-L1SBG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-L1SBG484I?
For technical support, including XC7A200T-L1SBG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-L1SBG484I requirements.
6.How does Aetrix verify that XC7A200T-L1SBG484I is sourced from the original manufacturer or authorized distributors?
All XC7A200T-L1SBG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-L1SBG484I meets industry standards.
7.What is the process for return or replacement of XC7A200T-L1SBG484I?
All XC7A200T-L1SBG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-L1SBG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-L1SBG484I part is unused and in its original packaging.
Return procedure for XC7A200T-L1SBG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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