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AMD XC7A200T-L2FBG484E
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- Part No.:
- XC7A200T-L2FBG484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7A200T-L2FBG484E.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,083
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Product details
Overview
XC7A200T-L2FBG484E from AMD is a high-performance Artix-7 FPGA with 195,456 logic cells, 13.1 Mb of block RAM, and support for 24 transceivers operating up to 6.6 Gb/s. It features a -2L speed grade, LVDS I/O, and is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch. This device is used in high-speed industrial imaging systems requiring deterministic latency and multi-channel data aggregation.
For engineers reviewing the XC7A200T-L2FBG484E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, block RAM depth, I/O voltage flexibility (1.2 V to 3.3 V), and thermal performance under sustained 24-channel parallel data capture.
Technical Context
The XC7A200T-L2FBG484E implements a 28 nm HPL low-power process architecture with configurable logic blocks (CLBs), DSP slices, and dedicated clock management tiles (CMTs) including MMCM and PLL blocks. It supports SelectIO standards including SSTL, HSTL, LVCMOS, and LVDS across 300 user I/O pins.
Its transceiver subsystem includes GTY transceivers with built-in 8B/10B encoding, PRBS generation/checking, and programmable equalization-enabling compliance with CPRI, JESD204B, and PCIe Gen2 protocols in baseband processing applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 195,456 - provides gate count equivalent to ~1.2M ASIC gates for complex control + datapath logic |
| Block RAM | 13.1 Mb - supports dual-port buffering for 4K×4K image frame storage or real-time FIFOs |
| Transceivers | 24 × GTY - enables 24-lane JESD204B subclass 1 links at 6.6 Gb/s per lane |
| I/O Pins | 300 user-configurable - supports mixed-voltage banks (1.2 V to 3.3 V) for sensor interface coexistence |
| Speed Grade | -2L - guarantees timing closure at 667 MHz DDR3 interface clock with 1.0 V core supply |
| Package | 484-pin FBGA (19×19 mm, 0.8 mm pitch) - compatible with standard reflow profiles and IPC-7351B land pattern |
Pinout & Package
XC7A200T-L2FBG484E is housed in a 484-ball Fine-Pitch BGA (FBG) package with 19×19 array, 0.8 mm ball pitch, and 1.27 mm overall height. Thermal pad on underside enables conduction cooling in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for CLBs, DSP, and routing fabric; requires low-noise regulation |
| VCCAUX | Auxiliary power | 1.8 V supply for configuration logic, transceivers, and clock management tiles |
| VCCO_0 | I/O bank voltage | Configurable 1.2–3.3 V per bank; sets signaling standard (e.g., 1.8 V for LVDS) |
| MGTAVCC | Transceiver analog supply | 1.0 V analog rail for GTY transceiver PLLs and serializers; isolated from digital domains |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale-compatible architecture | Enables migration path to UltraScale+ devices without RTL redesign for timing-critical IP |
| Integrated PCI Express® Gen2 endpoint | Reduces external bridge IC count in embedded host-interface designs; supports x1/x2/x4 lanes |
| AXI4-Stream compliant interfaces | Allows plug-and-play integration with Xilinx/AMD IP cores for video, DMA, and packet processing |
| Partial reconfiguration support | Permits dynamic function swapping (e.g., switching between radar and comms waveform engines) without full FPGA reboot |
| TEMAC integrated Ethernet MAC | Offloads TCP/IP stack processing from host CPU; supports 1 GbE with IEEE 1588 timestamping |
Applications
| Industrial Machine Vision | Multi-Antenna Radar Processing |
|---|---|
Use Scenario: Simultaneous acquisition from 12 CMOS image sensors with pixel-level synchronization. IC Role / Device Role / Timing Role: FPGA acts as parallel-to-serial aggregator and real-time defect classifier using embedded DSP slices. Use Value: Achieves sub-100 ns inter-sensor skew control via dedicated I/O delay chains and deterministic routing. | Use Scenario: Beamforming and pulse-Doppler processing across 8 RF receive channels in phased-array radar. IC Role / Device Role / Timing Role: XC7A200T-L2FBG484E performs channel calibration, FFT, and CFAR detection in hardware pipeline. Use Value: Delivers 2.1 GOPS peak compute density using 700+ DSP48E1 slices, enabling real-time target tracking at 1 kHz update rate. |
| Medical Ultrasound Backend | High-Speed Data Acquisition |
Use Scenario: Digital beamformer interfacing with 64-channel ADC front-end and HDMI output subsystem. IC Role / Device Role / Timing Role: Configurable logic implements time-gain compensation, envelope detection, and scan conversion. Use Value: Block RAM depth supports 16-line scan-line buffering at 40 MHz pixel clock, eliminating external frame memory. | Use Scenario: 16-channel, 125 MS/s digitizer capturing transient events in power electronics monitoring. IC Role / Device Role / Timing Role: XC7A200T-L2FBG484E manages simultaneous DDR3 memory writes and PCIe Gen2 streaming to host PC. Use Value: Dual 64-bit DDR3 controllers sustain 10.6 GB/s aggregate bandwidth, preventing sample loss during burst capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A15T-2FTG256I | Fewer logic cells (124,800), no GTY transceivers, only GTX transceivers up to 3.75 Gb/s | Suitable for lower-bandwidth JESD204A or parallel LVDS sensor interfaces, not CPRI or JESD204B subclass 1 | Select when system requires <12 transceiver lanes and ≤3.75 Gb/s per lane; reduces cost and power by 35% |
| XCKU035-2FFVA676E | UltraScale architecture, 215,300 logic cells, 24 GTY transceivers up to 12.5 Gb/s, higher static power | Supports PCIe Gen3, 10G Ethernet, and higher-order modulation schemes in 5G infrastructure | Choose for future-proofing beyond 6.6 Gb/s or when migrating to UltraScale toolchain and IP ecosystem |
Compared with XC7A15T-2FTG256I, the XC7A200T-L2FBG484E delivers 57% more logic capacity and full JESD204B subclass 1 compliance; versus XCKU035-2FFVA676E, it offers identical transceiver count but at lower power and cost, while sacrificing Gen3+ protocol support and advanced clocking features.
Availability
XC7A200T-L2FBG484E is available at Aetrix Electronics and suitable for industrial machine vision, radar signal processing, and medical ultrasound backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-L2FBG484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets with leadership in FPGA, GPU, and CPU technologies.
The Artix-7 family targets cost-sensitive, high-performance embedded applications where power efficiency, small footprint, and transceiver capability are critical-especially in industrial, aerospace, and medical equipment.
FAQ
What is the maximum supported transceiver data rate for XC7A200T-L2FBG484E?
The XC7A200T-L2FBG484E supports GTY transceivers rated up to 6.6 Gb/s per lane. This rate is guaranteed under -2L speed grade conditions with proper board design, reference clock jitter <1.0 ps RMS, and temperature within 0°C to 85°C ambient. The XC7A200T-L2FBG484E achieves this performance using adaptive equalization and built-in PRBS checking for link validation.
Does XC7A200T-L2FBG484E support partial reconfiguration?
Yes, the XC7A200T-L2FBG484E supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic swapping of functional modules-such as switching between different radar waveform engines-without resetting the entire device. The XC7A200T-L2FBG484E implements this using frame-based bitstream loading into designated reconfigurable partitions.
What I/O standards are supported by XC7A200T-L2FBG484E?
The XC7A200T-L2FBG484E supports 21 I/O standards including LVDS, SSTL-18, HSTL-I, LVCMOS12/15/18/25/33, and differential standards like BLVDS and RSDS. Each of its 12 I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V. This flexibility enables direct interfacing with diverse sensors and memory devices without level-shifting components.
Is XC7A200T-L2FBG484E qualified for extended temperature operation?
No, the XC7A200T-L2FBG484E is specified for commercial and industrial temperature ranges only: 0°C to 85°C (ambient). It is not screened or characterized for extended temperature operation (-40°C to +100°C or beyond). For such environments, engineers should consider the XC7A200T-2FFG484I variant, which carries the 'I' suffix denoting industrial-grade qualification.
What configuration modes does XC7A200T-L2FBG484E support?
The XC7A200T-L2FBG484E supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Configuration bitstreams can be loaded from external SPI flash, microcontroller, or boundary-scan controller. The XC7A200T-L2FBG484E also supports fallback and multi-boot configurations using dual SPI flash devices for field-upgradable firmware.
XC7A200T-L2FBG484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7A200T-L2FBG484E FAQ
1.How can I place an order for XC7A200T-L2FBG484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-L2FBG484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-L2FBG484E reliable?
The price and inventory of XC7A200T-L2FBG484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-L2FBG484E is usually 5 days.
3.What payment methods are accepted for XC7A200T-L2FBG484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-L2FBG484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-L2FBG484E?
XC7A200T-L2FBG484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-L2FBG484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-L2FBG484E?
For technical support, including XC7A200T-L2FBG484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-L2FBG484E requirements.
6.How does Aetrix verify that XC7A200T-L2FBG484E is sourced from the original manufacturer or authorized distributors?
All XC7A200T-L2FBG484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-L2FBG484E meets industry standards.
7.What is the process for return or replacement of XC7A200T-L2FBG484E?
All XC7A200T-L2FBG484E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-L2FBG484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-L2FBG484E part is unused and in its original packaging.
Return procedure for XC7A200T-L2FBG484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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