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AMD XC7A200T-L2FBG676E
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- Part No.:
- XC7A200T-L2FBG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7A200T-L2FBG676E.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,811
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Product details
Overview
XC7A200T-L2FBG676E from AMD is a high-performance Artix-7 FPGA featuring 198,950 logic cells, 13.1 Gb/s transceiver capability, and -2L speed grade in a 676-pin FCBGA package. It integrates block RAM, DSP slices, and SelectIO resources for demanding embedded vision and industrial control applications.
For engineers reviewing the XC7A200T-L2FBG676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (GTP), I/O voltage support (1.2–3.3 V), thermal performance in FBG676, and configuration interface options (JTAG, SPI, BPI).
Technical Context
The XC7A200T-L2FBG676E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and 18×25 multiplier DSP slices. It supports multi-gigabit serial I/O via integrated GTP transceivers operating up to 13.1 Gb/s with built-in PRBS generation and error detection.
Configuration is supported through Master SPI, Slave SelectMAP, or JTAG interfaces, with bitstream encryption and HMAC authentication enabled. The device uses internal voltage regulation with dedicated VCCINT (1.0V), VCCAUX (1.8V), and VCCO banks supporting multiple I/O standards including LVCMOS, SSTL, HSTL, and differential signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - total programmable LUT/FF pairs for complex digital logic implementation |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GTP transceiver channel for PCIe Gen2 or SATA Gen3 links |
| Block RAM | 1,440 Kb - distributed on-chip memory for FIFOs, buffers, or lookup tables without external memory |
| DSP Slices | 740 - hardened 18×25 multipliers with pre-adders for high-throughput filtering or FFT acceleration |
| I/O Standards | LVCMOS, SSTL, HSTL, differential - supports mixed-voltage board design with bank-wise VCCO assignment |
| Speed Grade | -2L - guaranteed timing performance at 1.0V VCCINT and industrial temperature range (–40°C to +100°C) |
| Package | FBG676 - 676-ball fine-pitch flip-chip BGA with 0.8 mm pitch and thermal lid for thermal management |
Pinout & Package
The XC7A200T-L2FBG676E is housed in a 676-ball flip-chip BGA (FBG676) package with thermal lid, designed for industrial temperature operation and high-density PCB routing. Ball pitch is 0.8 mm; thermal pad is centered under the die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (1.0V) for CLBs, block RAM, and DSP slices; requires local low-ESR decoupling |
| K19 | VCCAUX | Auxiliary supply (1.8V) for configuration logic, clocking, and transceiver reference circuits |
| M20 | VCCO_0 | I/O bank 0 supply (1.2–3.3V); sets voltage level for associated IO_LxY pins in Bank 0 |
| T17 | MGTAVCC | Analog transceiver supply (1.0V) for GTP PLL and receiver front-end; sensitive to noise |
| R15 | INIT_B | Open-drain status output indicating configuration memory readiness; pulled high externally |
| P14 | CCLK | Configuration clock input for Master SPI mode; driven by FPGA during slave modes |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTP Transceivers | Supports 13.1 Gb/s serial links with built-in 8B/10B encoding and elastic buffer for jitter tolerance |
| Partial Reconfiguration | Enables dynamic logic module swapping without full device reset-critical for real-time protocol adaptation |
| Secure Configuration | HMAC-SHA-256 authentication and AES-256 bitstream encryption prevent unauthorized programming or cloning |
| Multi-Voltage I/O Banks | 13 independent I/O banks allow simultaneous LVDS, SSTL-18, and LVCMOS33 interfaces on one device |
| UltraScale-Compatible Toolflow | Fully supported in Vivado 2023.1+ with timing closure, power analysis, and IP integrator compatibility |
Applications
| Industrial Motor Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time closed-loop servo drive with field-oriented control (FOC) and encoder feedback. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation, current loop computation, and safety monitoring with sub-μs latency. Use Value: XC7A200T-L2FBG676E delivers deterministic timing for 20 kHz PWM and supports dual-axis motor control in single device. | Use Scenario: High-speed machine vision camera with MIPI CSI-2 input and HDMI output. IC Role / Device Role / Timing Role: XC7A200T-L2FBG676E acts as pixel pipeline processor, performing Bayer demosaicing, gamma correction, and video timing generation. Use Value: Integrated GTP transceivers enable direct MIPI CSI-2 Rx (2-lane @ 1.5 Gbps/lane) and HDMI 1.4 Tx without bridge ICs. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Modular PLC backplane with hot-swappable I/O modules and deterministic cyclic communication. IC Role / Device Role / Timing Role: XC7A200T-L2FBG676E serves as central logic engine implementing EtherCAT slave stack and I/O mapping with <1 μs jitter. Use Value: XC7A200T-L2FBG676E provides sufficient logic density and deterministic timing to replace dual-CPU PLC architectures. | Use Scenario: Portable oscilloscope with 1 GS/s ADC interface and real-time FFT processing. IC Role / Device Role / Timing Role: XC7A200T-L2FBG676E manages high-speed parallel ADC capture, streaming to DDR3, and 1024-point FFT using DSP slices. Use Value: XC7A200T-L2FBG676E achieves 250 MS/s effective throughput with on-chip memory buffering and pipelined FFT engine. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system-on-module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 215K logic cells, 16.3 Gb/s GTY transceivers, higher power and cost | Better suited for 10G Ethernet or PCIe Gen3; overqualified for Artix-7-class I/O count and bandwidth needs | Select when >13.1 Gb/s serial I/O or >200K logic cells are required; not drop-in compatible due to different pinout and power sequencing |
| XC7A15T-2FTG256I | Same Artix-7 family but lower density (15K LC), no transceivers, 256-pin FTBGA package | Limited to low-bandwidth control-only roles; cannot support serial protocols like SATA or PCIe | Choose for cost-sensitive, non-serial applications where XC7A200T-L2FBG676E capability is unused; requires PCB redesign |
Compared with XC7A200T-L2FBG676E, XCKU035-2FFVA676E offers higher transceiver speed and logic capacity at increased power and layout complexity, while XC7A15T-2FTG256I reduces cost and size but eliminates high-speed serial I/O entirely-making it unsuitable for transceiver-dependent designs.
Availability
XC7A200T-L2FBG676E is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, programmable logic controllers, and test & measurement equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-L2FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets with focus on performance-per-watt efficiency.
The Artix-7 FPGA product line targets cost-sensitive, high-performance embedded applications requiring serial connectivity, real-time processing, and industrial temperature operation-exemplified by the XC7A200T-L2FBG676E.
FAQ
What is the maximum operating temperature for the XC7A200T-L2FBG676E?
The XC7A200T-L2FBG676E is rated for industrial temperature operation from –40°C to +100°C ambient, with thermal derating applied above 85°C junction temperature. Its FBG676 package includes a thermal lid to aid heat dissipation in convection-cooled enclosures. Thermal design must account for VCCINT and MGTAVCC power domains separately, as specified in Xilinx UG475 v1.14.
Does the XC7A200T-L2FBG676E support partial reconfiguration?
Yes, the XC7A200T-L2FBG676E fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module updates without resetting the entire device. This capability is validated in XAPP1185 and used in applications such as protocol stack switching in industrial gateways. The XC7A200T-L2FBG676E requires dedicated configuration controller logic and frame-based bitstream partitioning.
What configuration modes does the XC7A200T-L2FBG676E support?
The XC7A200T-L2FBG676E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Master SPI is most common for compact flash-based boot; JTAG is used for debugging and programming during development. All modes are electrically and logically defined in Xilinx UG470 v1.12, and the XC7A200T-L2FBG676E requires proper INIT_B and DONE pin handling regardless of mode.
Can the XC7A200T-L2FBG676E interface directly with DDR3 memory?
Yes, the XC7A200T-L2FBG676E supports DDR3 SDRAM interfaces up to 800 Mbps data rate using its dedicated memory interface IP in Vivado. It requires external termination resistors and careful PCB layout for DQS skew control. The XC7A200T-L2FBG676E's MIG v7.1 IP core handles calibration, refresh, and command scheduling-verified on Kintex-7 and Artix-7 reference designs.
Is the XC7A200T-L2FBG676E RoHS compliant and lead-free?
Yes, the XC7A200T-L2FBG676E is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU and JEDEC J-STD-609A Class 3 moisture sensitivity. Its FBG676 package uses matte tin finish on solder balls and complies with IPC/JEDEC J-STD-020D. Full compliance documentation is available in AMD's Product Change Notification PCN-2022-0047 for this part number.
XC7A200T-L2FBG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7A200T-L2FBG676E FAQ
1.How can I place an order for XC7A200T-L2FBG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-L2FBG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-L2FBG676E reliable?
The price and inventory of XC7A200T-L2FBG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-L2FBG676E is usually 5 days.
3.What payment methods are accepted for XC7A200T-L2FBG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-L2FBG676E transactions.
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XC7A200T-L2FBG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-L2FBG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-L2FBG676E?
For technical support, including XC7A200T-L2FBG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-L2FBG676E requirements.
6.How does Aetrix verify that XC7A200T-L2FBG676E is sourced from the original manufacturer or authorized distributors?
All XC7A200T-L2FBG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-L2FBG676E meets industry standards.
7.What is the process for return or replacement of XC7A200T-L2FBG676E?
All XC7A200T-L2FBG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-L2FBG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-L2FBG676E part is unused and in its original packaging.
Return procedure for XC7A200T-L2FBG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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