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AMD XC7A200T-L2FFG1156E
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- Part No.:
- XC7A200T-L2FFG1156E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7A200T-L2FFG1156E.pdf
- Description:
- IC FPGA 500 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,143
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Product details
Overview
XC7A200T-L2FFG1156E from AMD is a high-performance Artix-7 FPGA with 198,950 logic cells, 13.1 Mb of block RAM, 960 DSP slices, and support for transceivers up to 6.6 Gb/s. It features a -2 speed grade, FFG1156 flip-chip fine-pitch BGA package with 1156 pins, and operates across industrial temperature range (-40°C to +100°C). It is used in high-bandwidth data acquisition systems requiring deterministic latency and parallel processing.
For engineers reviewing the XC7A200T-L2FFG1156E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver lane count (16 GT lanes), configuration interface options (SPIx4, JTAG, SelectMAP), and thermal design implications of the FFG1156 package.
Technical Context
The XC7A200T-L2FFG1156E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and 25 x 18-bit signed multipliers per DSP slice. Its transceiver subsystem includes dedicated clocking, PCS, and PMA layers supporting protocols including PCIe Gen2, SATA, and CPRI.
Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces, with bitstream encryption and HMAC authentication available. The device supports partial reconfiguration and AXI interconnect integration for heterogeneous system-on-module designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 198,950 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 13.1 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| DSP Slices | 960 - enables high-throughput fixed/floating-point computation for signal processing pipelines |
| GT Transceivers | 16 lanes @ 6.6 Gb/s - supports multi-lane serial protocols including PCIe Gen2 x8 and CPRI Option 3 |
| User I/O Pins | 500 - enables wide parallel bus interfacing or high-density peripheral connectivity |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under industrial conditions |
| Operating Temp | -40°C to +100°C - qualifies for deployment in uncooled industrial enclosures and outdoor base stations |
Pinout & Package
XC7A200T-L2FFG1156E is housed in a 35 mm × 35 mm, 1156-pin flip-chip fine-pitch BGA (FFG1156) package with 1.0 mm ball pitch and standard I/O pad arrangement per AMD UG475 v1.14.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCINT | Power supply reference / Core voltage rail | Multiple dedicated balls ensure low-impedance core power delivery and noise suppression for 1.0V operation |
| VCCAUX / VCCAUX_IO | Auxiliary & I/O bank supply rails | Separate 1.8V supplies per I/O bank enable mixed-voltage interface support (LVCMOS18/LVDS/HSTL) |
| M0–M2 | Configuration mode select | Determines boot source (SPI/JTAG/SelectMAP); must be hardwired before power-up |
| CCLK / INIT_B / DONE | Configuration clock / status signals | Control FPGA startup sequence and indicate bitstream loading completion |
| IO_LxxYy_# | User-configurable I/O banks | Each bank supports independent voltage and standard selection (e.g., LVDS, SSTL15) |
| GTGREFCLK0 / GTXRXP/N | Transceiver reference clock & serial lanes | Provides low-jitter clock input and differential high-speed serial I/O for GT transceivers |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping during runtime-critical for adaptive radio and protocol-agnostic comms systems |
| AXI Interconnect Integration | Allows seamless integration with ARM-based processors or soft-core microcontrollers via standardized AMBA interface |
| Bitstream Encryption & HMAC | Protects intellectual property against cloning and unauthorized firmware modification in field-deployed units |
| Multi-Standard I/O Banks | Per-bank voltage and standard configurability simplifies interface to legacy and modern peripherals without level shifters |
| Industrial Temperature Rating | Validated operation from –40°C to +100°C eliminates derating concerns in harsh-environment deployments |
Applications
| Radar Signal Processing | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: XC7A200T-L2FFG1156E serves as the real-time digital signal processor and interface hub between ADCs, DACs, and host controllers. Use Value: 960 DSP slices and deterministic 6.6 Gb/s GT links enable sub-microsecond latency loop closure for adaptive waveform generation. | Use Scenario: High-speed image capture and preprocessing in automated optical inspection (AOI) equipment. IC Role / Device Role / Timing Role: XC7A200T-L2FFG1156E manages parallel CMOS sensor interfaces, performs pixel-level filtering, and streams processed frames over PCIe. Use Value: 500 user I/Os support 16+ camera inputs simultaneously; block RAM enables line-buffered convolution without external memory. |
| 5G Remote Radio Units | Test & Measurement Equipment |
Use Scenario: Digital front-end (DFE) and fronthaul interface in compact 5G massive MIMO RRUs. IC Role / Device Role / Timing Role: XC7A200T-L2FFG1156E implements CFR, DPD, and CPRI/eCPRI mapping functions while managing SFP+ and JESD204B links. Use Value: 16 GT transceivers support dual 4.9152 Gb/s JESD204B lanes plus 10.3125 Gb/s CPRI, enabling full-bandwidth RF chain processing. | Use Scenario: Modular digitizer and arbitrary waveform generator modules in PXIe platforms. IC Role / Device Role / Timing Role: XC7A200T-L2FFG1156E synchronizes multi-channel ADC/DAC sampling, handles trigger routing, and executes real-time FFTs. Use Value: -2 speed grade ensures setup/hold timing margin for 250 MS/s sampling clocks; 13.1 Mb block RAM stores waveform templates and calibration data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, 215K logic cells, 15.3 Mb BRAM, 20 GTY transceivers @ 16.3 Gb/s | Higher bandwidth and lower latency; targets 5G NR baseband and AI inference acceleration | Choose when >10 Gb/s serial throughput or >200K logic cells are required; requires PCB redesign due to different package and power delivery |
| XC7K325T-2FFG901E | Kintex-7 family, 326K logic cells, 17.9 Mb BRAM, 20 GTP transceivers @ 6.6 Gb/s, larger FFG901 package | Higher logic density and memory; suited for complex SoC integration with multiple processor subsystems | Prefer for designs needing more DSP slices or larger on-chip memory; shares Artix-7 toolchain but differs in I/O banking and thermal profile |
Compared with XC7A200T-L2FFG1156E, XCKU040-2FFVA1156E delivers significantly higher serial bandwidth and logic capacity at increased cost and power, while XC7K325T-2FFG901E offers greater resource headroom within the same 28 nm node but with reduced I/O density and larger footprint.
Availability
XC7A200T-L2FFG1156E is available at Aetrix Electronics and suitable for radar signal processing, industrial machine vision, 5G remote radio units, and test & measurement equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7A200T-L2FFG1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies.
The Artix-7 family, including XC7A200T-L2FFG1156E, was designed for cost-sensitive, high-performance applications in industrial automation, wired communications, and video processing where power efficiency and I/O flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for XC7A200T-L2FFG1156E?
The XC7A200T-L2FFG1156E supports GT transceivers with a maximum data rate of 6.6 Gb/s per lane. This is confirmed in AMD UG476 v1.12 and applies to all 16 GT lanes on the device. The rate is achievable under industrial temperature conditions with proper board-level signal integrity design and reference clock jitter below 1 ps RMS.
Does XC7A200T-L2FFG1156E support partial reconfiguration?
Yes, XC7A200T-L2FFG1156E supports partial reconfiguration as documented in AMD UG909 v2023.1. This capability allows dynamic replacement of logic modules without resetting the entire device, enabling adaptive functionality in radar and communications systems where protocol or waveform changes occur in-field.
What configuration modes are supported by XC7A200T-L2FFG1156E?
XC7A200T-L2FFG1156E supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. SPIx4 is most common for compact, low-pin-count boot storage; JTAG is used for debugging and programming during development.
Is XC7A200T-L2FFG1156E qualified for industrial temperature operation?
Yes, XC7A200T-L2FFG1156E is rated for industrial temperature range (–40°C to +100°C), as specified in AMD DS181 v2.5. This qualification covers all logic, I/O, and transceiver functionality without derating, making it suitable for deployment in fanless enclosures and outdoor infrastructure.
How many user I/O pins does XC7A200T-L2FFG1156E provide?
XC7A200T-L2FFG1156E provides 500 user-configurable I/O pins, distributed across 14 I/O banks. Each bank supports independent voltage selection (1.2V–1.8V) and interface standards including LVCMOS, LVDS, and SSTL. Pin assignment is fully constrained in Vivado using the FFG1156 package definition.
XC7A200T-L2FFG1156E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 16825
- Number of Logic Elements/Cells:
- 215360
- Total RAM Bits:
- 13455360
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC7A200T-L2FFG1156E FAQ
1.How can I place an order for XC7A200T-L2FFG1156E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A200T-L2FFG1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A200T-L2FFG1156E reliable?
The price and inventory of XC7A200T-L2FFG1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A200T-L2FFG1156E is usually 5 days.
3.What payment methods are accepted for XC7A200T-L2FFG1156E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A200T-L2FFG1156E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A200T-L2FFG1156E?
XC7A200T-L2FFG1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A200T-L2FFG1156E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A200T-L2FFG1156E?
For technical support, including XC7A200T-L2FFG1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A200T-L2FFG1156E requirements.
6.How does Aetrix verify that XC7A200T-L2FFG1156E is sourced from the original manufacturer or authorized distributors?
All XC7A200T-L2FFG1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A200T-L2FFG1156E meets industry standards.
7.What is the process for return or replacement of XC7A200T-L2FFG1156E?
All XC7A200T-L2FFG1156E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A200T-L2FFG1156E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A200T-L2FFG1156E part is unused and in its original packaging.
Return procedure for XC7A200T-L2FFG1156E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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