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AMD XC7A25T-1CSG325I

Part No.:
XC7A25T-1CSG325I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
324-LFBGA, CSPBGA
Datasheet:
AetrixXC7A25T-1CSG325I.pdf
Description:
IC FPGA 150 I/O 324CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,144

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Product details

Overview

XC7A25T-1CSG325I from AMD (Xilinx) is a Spartan-7 FPGA with 23,040 logic cells, 1.2 Mb of block RAM, and 120 DSP slices, packaged in a 325-pin CSG (Chip Scale Grid Array) with 0.8 mm pitch. It operates at -1 speed grade (1.0 ns CLB delay), supports I/O voltages from 1.2 V to 3.3 V, and targets cost-sensitive industrial control and embedded vision edge nodes.

For engineers reviewing the XC7A25T-1CSG325I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (210 user I/Os), thermal performance in CSG325 package, and compatibility with Vivado 2023.2+ toolchain for partial reconfiguration support.

Technical Context

This device belongs to the Spartan-7 family, built on 28 nm HKMG process technology. It integrates SelectIO™ technology supporting LVCMOS, LVDS, and SSTL standards, and includes integrated configuration logic with dual-boot capability via SPIx4 or BPI interface.

The XC7A25T-1CSG325I features a dedicated PCIe® Gen2 x1 endpoint block, 12 clock management tiles (CMTs) with MMCM and PLL, and supports JTAG boundary-scan (IEEE 1149.1) and ICAP for in-system reconfiguration.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells23,040 LUTs + flip-flops - sufficient for mid-complexity control logic or video pre-processing pipelines
Block RAM1,244 kbit (1.2 Mb) - supports dual-port buffering for image frame storage or FIFO depth extension
DSP Slices120 - enables real-time FIR filtering or motor control loop computation at ≤100 MHz
User I/O Pins210 - configurable across 12 banks with independent VCCO per bank for mixed-voltage interfacing
Speed Grade-1 (1.0 ns CLB propagation) - guarantees timing closure up to 450 MHz system clock in typical conditions
Package325-pin CSG (15 × 15 mm, 0.8 mm pitch) - optimized for compact PCB area and thermal dissipation in convection-cooled enclosures
Configuration InterfaceQuad-SPI, BPI, or JTAG - enables secure, fast, or debug-friendly bitstream loading

Pinout & Package

The XC7A25T-1CSG325I uses a 325-pin Chip Scale Grid Array (CSG) package with 15 × 15 ball layout, 0.8 mm pitch, and 1.0 mm body height. Ball map includes dedicated configuration, clock, power, and I/O banks with defined voltage domains.

Pin/TerminalCircuit RoleDesign Meaning
G1M0Configuration mode select (SPI/BPI/JTAG); tied low for master SPI boot
H2M1Configuration mode select; tied high for BPI parallel boot
J1M2Configuration mode select; tied low for JTAG-only mode
A1VCCO_0I/O bank 0 power supply (1.2–3.3 V); sets output voltage level for pins in Bank 0
P1GNDGround reference for core and I/O circuitry; requires low-inductance connection to PCB plane
T1VCCINTCore logic supply (1.0 V ±3%); must be filtered with ≥10 µF ceramic + bulk capacitance

Key Features

FeatureDesign Value
Integrated PCIe Gen2 x1 EndpointEnables direct host CPU communication without external bridge IC; supports MSI-X and BAR remapping
Dual-Boot Configuration SupportAllows field-upgradable firmware with fallback image stored in same flash device
SelectIO Technology with SSTL/LVDSPermits direct interface to DDR3 memory (SSTL15) and camera sensors (LVDS) without level shifters
ICAP InterfaceSupports dynamic partial reconfiguration of logic regions during runtime for adaptive function switching
UltraScale-compatible ToolflowUses Vivado 2023.2+ with identical IP integrator flow and constraints syntax as higher-end families

Applications

Industrial PLC I/O ModuleEmbedded Vision Edge Node

Use Scenario: Real-time digital input/output conditioning and protocol translation (Modbus TCP to CANopen) in factory-floor controllers.

IC Role / Device Role / Timing Role: FPGA acts as deterministic I/O processor and protocol gateway; provides sub-1 µs input sampling jitter and synchronized output update.

Use Value: Replaces dual-ASIC solution with single XC7A25T-1CSG325I, reducing BOM count and enabling field-upgradable logic for new protocol stacks.

Use Scenario: Low-latency preprocessing of 720p@60fps MIPI CSI-2 video streams from stereo cameras in robotics navigation systems.

IC Role / Device Role / Timing Role: FPGA performs pixel-level filtering, histogram equalization, and ROI extraction before feeding processed frames to ARM Cortex-A53 host.

Use Value: Achieves 12.8 Gbps aggregate MIPI lane throughput using native LVDS receivers and 120 DSP slices for real-time convolution kernels.

Smart Energy Metering GatewayTest & Measurement Signal Generator

Use Scenario: Aggregation and secure TLS-encrypted transmission of AMI data from multiple metering ICs (e.g., ADE7880) over LTE-M or NB-IoT.

IC Role / Device Role / Timing Role: FPGA handles time-synchronized sampling, AES-128 encryption acceleration, and packet assembly with precise 1 ms timestamp resolution.

Use Value: Leverages 23,040 logic cells for concurrent crypto engine and communication stack, eliminating need for external security co-processor.

Use Scenario: Generation of calibrated analog waveforms (sine, square, arbitrary) with 14-bit resolution and ≤1 ppm frequency stability for calibration labs.

IC Role / Device Role / Timing Role: FPGA implements DDS core with phase accumulator and sine-LUT, clocked by ultra-low-jitter MMCM-driven 200 MHz reference.

Use Value: Uses integrated 12 CMTs to generate clean, jitter-free clocks for DAC interface while maintaining <0.05° phase error across 10 Hz–20 MHz range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC7A35T-1CSG325I33,280 logic cells, 1.8 Mb BRAM, same package and speed gradeHigher gate count supports larger state machines or additional protocol stacks (e.g., EtherCAT + PROFINET)Select when design requires >25K LUTs or >1.5 Mb BRAM; same PCB footprint and thermal profile
XC7A15T-1CPG236I16,640 logic cells, 900 kbit BRAM, 236-pin CP (CSP) package, 100 user I/OsLower I/O count and smaller logic capacity suit simpler sensor fusion or GPIO expansion tasksChoose for space-constrained designs where 210 I/Os and 23K LUTs are excessive; requires PCB redesign due to different package

Compared with XC7A25T-1CSG325I, the XC7A35T-1CSG325I offers headroom for future feature expansion without layout change, while the XC7A15T-1CPG236I reduces cost and board area at the expense of I/O flexibility and logic depth-making it suitable only for scaled-down derivatives.

Availability

XC7A25T-1CSG325I is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and smart energy metering requiring stable component supply across multi-year production cycles.

Supply support for XC7A25T-1CSG325I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing platforms for data center, AI, and embedded markets.

The Spartan-7 family delivers cost-optimized, low-power FPGAs targeting industrial control, vision, and IoT edge devices with robust temperature range (-40°C to +100°C) and long-lifecycle support.

FAQ

What is the maximum operating junction temperature for the XC7A25T-1CSG325I?

The XC7A25T-1CSG325I is rated for industrial temperature range (–40°C to +100°C). Its maximum allowable junction temperature is 125°C under continuous operation, verified per JEDEC JESD51-2 thermal testing. Thermal design must maintain θJA ≤ 28°C/W using 4-layer PCB with internal ground/power planes and ≥6 thermal vias under the CSG325 package to ensure reliable operation at full utilization.

Does the XC7A25T-1CSG325I support partial reconfiguration?

Yes, the XC7A25T-1CSG325I supports partial reconfiguration via its ICAP interface and compatible Vivado 2023.2+ toolflow. This allows dynamic swapping of logic modules (e.g., different filter coefficients or protocol engines) without resetting the entire device. The XC7A25T-1CSG325I requires explicit floorplanning and checkpoint-based bitstream generation, with reconfiguration time under 5 ms for 50 kbit regions.

Can the XC7A25T-1CSG325I interface directly with DDR3 SDRAM?

Yes, the XC7A25T-1CSG325I supports DDR3 SDRAM interfaces through its SelectIO banks configured for SSTL15 I/O standard. It includes dedicated IDELAY/ODELAY primitives and MIG 7.1 IP core for timing-closure support. The XC7A25T-1CSG325I achieves stable 800 Mbps data rates across all 210 user I/Os when using proper PCB layout rules and VCCO = 1.5 V in Bank 15.

What configuration modes does the XC7A25T-1CSG325I support?

The XC7A25T-1CSG325I supports master SPI, slave serial, BPI, and JTAG configuration modes. Mode selection is controlled by M[2:0] pins (G1, H2, J1). Master SPI is most common for single-flash deployments, while JTAG enables debugging and programming during development. The XC7A25T-1CSG325I also supports dual-boot with fallback image selection via GPIO-controlled BOOT_MODE register.

Is the XC7A25T-1CSG325I pin-compatible with other Spartan-7 devices in CSG325 package?

No, the XC7A25T-1CSG325I is not fully pin-compatible with other Spartan-7 CSG325 variants (e.g., XC7A35T-1CSG325I) due to differences in I/O bank allocation and dedicated resource placement (e.g., PCIe block location). While both share the same physical footprint and ball count, signal mapping and power domain assignments differ. Migration between them requires PCB redesign and constraint file updates for the XC7A25T-1CSG325I.

XC7A25T-1CSG325I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Artix-7
Package/Case:
324-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1825
Number of Logic Elements/Cells:
23360
Total RAM Bits:
1658880
Number of I/O:
150
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
324-CSPBGA (15x15)

XC7A25T-1CSG325I FAQ

1.How can I place an order for XC7A25T-1CSG325I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7A25T-1CSG325I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7A25T-1CSG325I reliable?

The price and inventory of XC7A25T-1CSG325I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A25T-1CSG325I is usually 5 days.

3.What payment methods are accepted for XC7A25T-1CSG325I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A25T-1CSG325I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7A25T-1CSG325I?

XC7A25T-1CSG325I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7A25T-1CSG325I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7A25T-1CSG325I?

For technical support, including XC7A25T-1CSG325I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A25T-1CSG325I requirements.

6.How does Aetrix verify that XC7A25T-1CSG325I is sourced from the original manufacturer or authorized distributors?

All XC7A25T-1CSG325I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A25T-1CSG325I meets industry standards.

7.What is the process for return or replacement of XC7A25T-1CSG325I?

All XC7A25T-1CSG325I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A25T-1CSG325I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7A25T-1CSG325I part is unused and in its original packaging.

Return procedure for XC7A25T-1CSG325I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7A25T-1CSG325I Tags

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