AMD XC7A25T-2CPG238C

Overview

XC7A25T-2CPG238C from AMD is a Kintex-7 FPGA with 24,050 logic cells, 1,392 KB of block RAM, 120 DSP slices, and 186 I/O pins in a 238-pin CP (Chip Scale Package) with 0.5 mm pitch. It operates at -2 speed grade and supports 1.0V core voltage for high-performance embedded vision and industrial control applications.

For engineers reviewing the XC7A25T-2CPG238C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, DSP resource availability, thermal performance in compact CPG packages, and compatibility with Vivado 2023.2+ toolchain for partial reconfiguration support.

Technical Context

The XC7A25T-2CPG238C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated carry chains, and integrated clock management tiles (CMTs) containing PLLs and MMCMs. It supports DDR3 memory interfaces up to 800 MHz and includes SelectIO™ technology for single-ended and differential signaling standards including LVDS, SSTL, and HSTL.

This device belongs to the Kintex-7 family's low-power, cost-optimized T-grade variant and features hardened PCIe® Gen2 x2 endpoint capability, 10/100/1000 Ethernet MAC support via LogiCORE IP, and AXI4-compliant interconnect infrastructure for SoC-style integration.

Key Specifications

Pinout & Package

The XC7A25T-2CPG238C uses a 238-ball fine-pitch chip-scale package (CPG238) with 0.5 mm ball pitch and 10 × 10 mm body size. Ball map follows Xilinx/AMD Kintex-7 standard CPG layout with dedicated configuration, JTAG, and multiple bank-specific VCCO/VREF groups.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC7A35T-2CPG236C and XCKU3P-2FFVA324E, the XC7A25T-2CPG238C delivers optimal balance of logic resources, I/O count, and thermal profile for cost-sensitive industrial edge devices where 28 nm process efficiency and CPG package compactness are prioritized over raw scalability.

Availability

XC7A25T-2CPG238C is available at Aetrix Electronics and suitable for industrial machine vision, programmable logic controllers, and medical imaging interface applications requiring stable component supply across extended product lifecycles.

Supply support for XC7A25T-2CPG238C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client platforms through its acquired Xilinx portfolio.

The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, memory, and I/O resources - particularly in industrial automation, aerospace avionics, and medical equipment where reliability and long-term support are critical.

FAQ

What is the maximum operating junction temperature for the XC7A25T-2CPG238C?

The XC7A25T-2CPG238C has a maximum operating junction temperature of 100°C, validated under industrial temperature grade (–40°C to +100°C ambient) with appropriate PCB thermal design. This rating ensures reliable operation in enclosed enclosures with passive cooling, and thermal derating is not required until ambient exceeds 85°C with standard 4-layer board layout. The XC7A25T-2CPG238C thermal characteristics are documented in AMD's DS182 datasheet revision 2.7.

Does the XC7A25T-2CPG238C support JTAG boundary-scan testing?

Yes, the XC7A25T-2CPG238C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TDI, TDO, TMS, and TCK pins. Its BSCAN_XILINX primitive enables full chain visibility for PCB assembly verification and in-system diagnostics. The XC7A25T-2CPG238C also supports IDCODE and USERCODE instructions for automated programming station identification and version tracking.

Can the XC7A25T-2CPG238C be configured via SPI flash memory?

Yes, the XC7A25T-2CPG238C supports master SPI configuration mode using industry-standard quad-SPI flash devices (e.g., Micron MT25QL series). Configuration occurs automatically after power-up when M0–M2 pins are set to 001, and the XC7A25T-2CPG238C drives the SPI bus directly without external controller intervention.

What is the minimum supported I/O standard voltage for XC7A25T-2CPG238C banks?

The XC7A25T-2CPG238C supports I/O standards down to 1.2 V (LVCMOS12, SSTL12) in dedicated banks with appropriate VCCO supply and termination settings. Bank 34 supports 1.2 V operation for DDR3 address/command signals, and all I/O banks require matching VREF for differential standards like LVDS. The XC7A25T-2CPG238C does not support sub-1.2 V I/O standards such as LVCMOS10.

Is partial reconfiguration supported on the XC7A25T-2CPG238C?

Yes, partial reconfiguration is fully supported on the XC7A25T-2CPG238C using Vivado Design Suite 2021.2 and later. This capability allows dynamic swapping of logic modules (e.g., changing filter coefficients or protocol engines) without resetting the entire device. The XC7A25T-2CPG238C requires proper P-block constraints and checkpointed implementation flows, and all reconfigurable partitions must reside within the same clock region.