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AMD XC7A25T-2CSG325C
- Part No.:
- XC7A25T-2CSG325C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A25T-2CSG325C.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,351
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Product details
Overview
XC7A25T-2CSG325C from AMD (formerly Xilinx) is a Spartan-7 FPGA featuring 25,840 logic cells, 1,920 Kbits of block RAM, 120 DSP slices, and support for up to 210 user I/Os in a 325-pin CSG package. It operates at -2 speed grade with 1.0V core voltage and targets cost-sensitive industrial control and embedded vision applications.
For engineers reviewing the XC7A25T-2CSG325C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, DSP resource availability, single-ended LVCMOS33/LVDS I/O support, and industrial temperature range operation.
Technical Context
The XC7A25T-2CSG325C implements a 28 nm HKMG process-based architecture with integrated configuration logic, SelectIO™ technology supporting multiple I/O standards, and hardened PCIe® Gen2 endpoint capability. It includes dedicated clock management tiles with MMCM and PLL blocks for low-jitter clock synthesis and phase alignment.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device supports partial reconfiguration and has dedicated transceivers capable of 6.6 Gb/s per lane in the CSG325 package variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 25,840 - usable LUT-based fabric resources for combinational and sequential logic implementation |
| Block RAM | 1,920 Kbits - distributed memory capacity for FIFOs, buffers, or lookup tables |
| DSP Slices | 120 - fixed-point arithmetic units supporting multiply-accumulate operations at up to 450 MHz |
| User I/Os | 210 - configurable single-ended and differential I/Os with programmable drive strength and slew rate |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies under industrial temperature conditions |
| Core Voltage | 1.0 V ±3% - required supply for CLB and routing fabric, with tight regulation tolerance |
| Operating Temp | 0°C to +85°C - qualified for industrial ambient environments without derating |
Pinout & Package
XC7A25T-2CSG325C is housed in a 325-ball fine-pitch CSPBGA (CSG) package with 1.0 mm ball pitch, 15 × 15 mm body size, and thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V supply for FPGA fabric; requires local low-ESR decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration, clocking, and transceiver logic |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support |
| M0/M1/M2 | Mode configuration pins | Determine boot source (SPI, BPI, JTAG) and configuration mode at power-up |
| CCLK | Configuration clock | Output-only clock during master SPI configuration; driven by FPGA |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration status and error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 Endpoint | Integrated endpoint logic eliminating external bridge ICs and reducing latency in host-connected systems |
| SelectIO Technology | Support for LVDS, SSTL, HSTL, and LVCMOS standards across 16 I/O banks with independent VCCO per bank |
| MMCM + PLL Clock Management | Two MMCMs and one PLL per device enabling multi-phase clock generation and jitter reduction below 100 fs RMS |
| SEU Mitigation | Automatic scrubbing and parity checking of configuration memory to maintain functional integrity in radiation-prone environments |
| Partial Reconfiguration | Dynamic replacement of logic modules without full device reset, enabling runtime adaptation in real-time systems |
Applications
| Industrial PLC I/O Module | Embedded Vision Preprocessing Unit |
|---|---|
Use Scenario: Real-time digital input/output conditioning and protocol translation in modular automation controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for fieldbus interface (e.g., PROFIBUS, EtherCAT), timestamping, and safety monitoring. Use Value: 210 user I/Os enable direct connection to sensor/actuator banks; -2 speed grade ensures deterministic cycle times under 1 µs. | Use Scenario: Pixel-level filtering, color space conversion, and ROI extraction prior to CPU/GPU processing in smart cameras. IC Role / Device Role / Timing Role: Parallel pixel pipeline accelerator using DSP slices and block RAM for real-time image transformation. Use Value: 120 DSP slices deliver >2 GOPS throughput at 100 MHz; LVDS I/O supports direct CMOS image sensor interfacing. |
| Motor Control Encoder Interface | Test Equipment Digital Pattern Generator |
Use Scenario: High-resolution quadrature decoding and commutation timing generation for servo drives. IC Role / Device Role / Timing Role: Dedicated counter logic synchronized to encoder edges, with PWM output generation aligned to rotor position. Use Value: Single-ended LVCMOS33 I/O supports direct connection to incremental encoders; MMCM enables sub-degree phase resolution. | Use Scenario: Programmable stimulus generation for ASIC/FPGA validation and boundary-scan testing. IC Role / Device Role / Timing Role: High-speed pattern sequencer with precise edge placement controlled via internal clock networks. Use Value: 210 I/Os allow parallel 32-bit vector generation; -2 speed grade guarantees <1 ns timing uncertainty across all outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A35T-2CSG325C | 33,280 logic cells, 2,400 Kbits BRAM, 160 DSP slices - higher density and compute capacity | Better suited for multi-channel vision or dual-protocol industrial gateways requiring additional fabric headroom | Select when design requires >25K LUTs or >120 DSP slices without changing PCB layout |
| XC7A15T-2CSG325C | 16,640 logic cells, 1,200 Kbits BRAM, 70 DSP slices - reduced resource count and lower static power | Ideal for simpler control logic or single-interface edge nodes where cost and power efficiency are prioritized | Choose for lower BOM cost and thermal footprint in non-compute-intensive applications |
Compared with XC7A25T-2CSG325C, the XC7A35T-2CSG325C offers scalable logic and DSP headroom for future feature expansion, while the XC7A15T-2CSG325C reduces static power by ~35% and simplifies thermal design - both share identical CSG325 packaging and pinout.
Availability
XC7A25T-2CSG325C is available at Aetrix Electronics and suitable for industrial PLCs, embedded vision systems, motor control interfaces, and automated test equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC7A25T-2CSG325C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated computing.
The Spartan-7 family, including XC7A25T-2CSG325C, was designed for cost-optimized, high-reliability industrial and automotive applications requiring low power, small form factor, and extended temperature operation.
FAQ
What is the maximum supported I/O standard for XC7A25T-2CSG325C?
XC7A25T-2CSG325C supports LVDS, LVCMOS33, LVCMOS25, SSTL15, and HSTL_I across its 16 I/O banks. Each bank is independently powered, allowing mixed-voltage operation. Differential standards like LVDS require termination resistors placed externally per Xilinx UG470 guidelines.
Does XC7A25T-2CSG325C include built-in PCIe Gen2 support?
Yes, XC7A25T-2CSG325C integrates a hardened PCIe Gen2 x1 endpoint block compliant with PCI Express Base Specification v2.1. It supports link training, power management states (L0s/L1), and MSI/MSI-X interrupt delivery without external PHY or bridge components.
What configuration modes are supported by XC7A25T-2CSG325C?
XC7A25T-2CSG325C supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Bitstream encryption and HMAC authentication are available when using SPI flash with AES-256 keys.
Is XC7A25T-2CSG325C qualified for industrial temperature operation?
Yes, the 'C' suffix in XC7A25T-2CSG325C denotes industrial temperature grade (0°C to +85°C). It is fully characterized and tested across this range for timing, voltage, and functionality - no derating required for operation within these limits.
How many clock management resources does XC7A25T-2CSG325C provide?
XC7A25T-2CSG325C includes two Mixed-Mode Clock Managers (MMCMs) and one Phase-Locked Loop (PLL). These support frequency synthesis, phase shifting, duty-cycle correction, and jitter filtering - enabling precise clock domain crossing and multi-rate system synchronization.
XC7A25T-2CSG325C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1825
- Number of Logic Elements/Cells:
- 23360
- Total RAM Bits:
- 1658880
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A25T-2CSG325C FAQ
1.How can I place an order for XC7A25T-2CSG325C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A25T-2CSG325C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A25T-2CSG325C reliable?
The price and inventory of XC7A25T-2CSG325C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A25T-2CSG325C is usually 5 days.
3.What payment methods are accepted for XC7A25T-2CSG325C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A25T-2CSG325C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A25T-2CSG325C?
XC7A25T-2CSG325C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A25T-2CSG325C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A25T-2CSG325C?
For technical support, including XC7A25T-2CSG325C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A25T-2CSG325C requirements.
6.How does Aetrix verify that XC7A25T-2CSG325C is sourced from the original manufacturer or authorized distributors?
All XC7A25T-2CSG325C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A25T-2CSG325C meets industry standards.
7.What is the process for return or replacement of XC7A25T-2CSG325C?
All XC7A25T-2CSG325C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A25T-2CSG325C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A25T-2CSG325C part is unused and in its original packaging.
Return procedure for XC7A25T-2CSG325C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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