AMD XC7A35T-1CSG324C

Overview

XC7A35T-1CSG324C from AMD (Xilinx) is a Kintex-7 family FPGA with 35,000 logic cells, 2.1 Mb of block RAM, and 220 DSP slices, packaged in a 324-pin CSGA (Chip Scale Grid Array) with 0.8 mm pitch. It operates at -1 speed grade and supports I/O voltages of 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V, enabling use in high-speed serial interface bridging applications.

For engineers reviewing the XC7A35T-1CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, transceiver count (0 GTs), I/O bank configuration, thermal performance in CSGA packaging, and compatibility with Vivado design tools for partial reconfiguration support.

Technical Context

The XC7A35T-1CSG324C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36 Kb block RAM (BRAM), and dedicated clock management tiles (CMT) including MMCM and PLL. It supports SelectIO standards up to LVDS DCI and includes integrated configuration interfaces (SPI, BPI, JTAG).

No built-in transceivers are present; high-speed serial connectivity requires external PHYs or multi-gigabit transceiver (MGT)-equipped companion devices. Configuration is performed via master SPI mode with dual-boot capability and bitstream encryption support.

Key Specifications

Pinout & Package

XC7A35T-1CSG324C uses a 324-ball CSGA package with 210 user I/O pins distributed across 12 I/O banks. Power and ground balls are arranged in a perimeter pattern with dedicated VCCAUX, VCCINT, and VCCO supplies per bank group.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC7A35T-1CSG324C, the XC7A50T-1CSG324C offers headroom for future feature expansion, while the XC7A35T-2CSG324C improves timing closure at the cost of increased static power - both retain identical pinout and configuration interface compatibility.

Availability

XC7A35T-1CSG324C is available at Aetrix Electronics and suitable for industrial motor control, video frame grabbing, communications protocol bridging, and test equipment logic analyzer applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XC7A35T-1CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, aerospace, and industrial markets.

The Kintex-7 family, including XC7A35T-1CSG324C, was designed for cost-optimized high-performance applications demanding balanced logic, memory, and DSP resources without transceivers.

FAQ

What is the maximum supported I/O standard voltage for XC7A35T-1CSG324C?

XC7A35T-1CSG324C supports I/O voltages of 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V across its 12 I/O banks. Each bank has independent VCCO supply, allowing mixed-voltage operation. The device does not support 5 V-tolerant inputs unless external protection circuitry is added, and all I/O standards must comply with the selected VCCO level per bank as defined in UG470.

Does XC7A35T-1CSG324C include built-in transceivers for high-speed serial communication?

No, XC7A35T-1CSG324C contains zero multi-gigabit transceivers (GTs). High-speed serial interfaces such as PCIe, SATA, or SGMII require external PHY devices or companion FPGAs with transceivers. Its I/O banks support LVDS and other differential standards up to 1.25 Gbps per lane using SelectIO, but full protocol stack implementation depends on external components and logic resource allocation within XC7A35T-1CSG324C.

What configuration modes are supported by XC7A35T-1CSG324C?

XC7A35T-1CSG324C supports Master SPI, Slave SPI, JTAG, and BPI configuration modes. Master SPI is most commonly used for single-flash boot with fast startup. Dual-boot capability allows two bitstreams stored in flash memory, enabling fail-safe recovery. Configuration is initiated via PROGRAM_B and monitored through INIT_B and DONE pins, with AES-256 bitstream encryption available for secure loading.

Can XC7A35T-1CSG324C perform partial reconfiguration in the field?

Yes, XC7A35T-1CSG324C supports partial reconfiguration (PR) using Vivado Design Suite. PR allows dynamic replacement of logic modules without resetting the entire device, enabling adaptive functionality in applications like software-defined radio or protocol stack updates. Implementation requires proper floorplanning, checkpointed design flows, and configuration memory partitioning - all validated in Xilinx UG909 and AR57123.

What thermal considerations apply to XC7A35T-1CSG324C in CSG324 packaging?

XC7A35T-1CSG324C in CSG324 packaging has a thermal resistance (θJA) of 25.6 °C/W under JEDEC-standard 2S2P board conditions. For reliable operation at full utilization, a 4-layer PCB with internal copper planes and thermal vias beneath the package is recommended. Junction temperature must remain below 100 °C; thermal simulation using Xilinx's XPE tool is advised to validate cooling strategy based on actual logic utilization and ambient conditions.