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AMD XC7A35T-2CSG325C
- Part No.:
- XC7A35T-2CSG325C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A35T-2CSG325C.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:184
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Product details
Overview
XC7A35T-2CSG325C from AMD is a 35K logic cell Artix-7 FPGA with 200 I/O pins, -2 speed grade, and 1.0V core voltage, packaged in a 325-pin CSG (Chip Scale Grid Array) package. It integrates Block RAM, DSP slices, and SelectIO resources for high-performance embedded control and interface bridging in space-constrained industrial systems.
For engineers reviewing the XC7A35T-2CSG325C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, thermal profile under 1.0V operation, and compatibility with Vivado 2023.2+ toolchain for partial reconfiguration support.
Technical Context
The XC7A35T-2CSG325C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 18 Kb block RAMs, and 25×18-bit multiplier-accumulator DSP slices. It supports LVDS, SSTL, HSTL, and TMDS I/O standards across its 200 user-configurable pins.
It includes integrated configuration logic supporting Master SPI, Slave Serial, and JTAG modes, and features dedicated clock management tiles with PLLs and MMCMs capable of generating up to 12 output clocks per tile with sub-150 ps jitter performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 33,280 LUTs + flip-flops - sufficient for medium-complexity real-time control and protocol translation logic. |
| I/O Pins | 200 user-configurable - enables dense peripheral interfacing without external glue logic. |
| Speed Grade | -2 - guarantees timing closure up to 622 MHz on critical paths with standard static timing analysis. |
| Core Voltage | 1.0 V ±3% - reduces dynamic power by ~30% vs. 1.2 V FPGAs at comparable density. |
| Block RAM | 1,800 Kb total - supports dual-port FIFOs, frame buffers, or lookup tables up to 18 Kb per block. |
| DSP Slices | 90 - delivers 180 GMAC/s peak throughput for filtering, FFT, or motor control algorithms. |
Pinout & Package
XC7A35T-2CSG325C is housed in a 12×12 mm, 325-ball CSG (Chip Scale Grid Array) package with 0.8 mm pitch and Pb-free RoHS-compliant finish. Thermal pad on underside requires solder paste stencil design per Xilinx UG475 v1.13 Section 3.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Must be regulated to 1.0 V ±3%; decoupling requires ≥10 × 0.1 µF ceramic capacitors near ball array. |
| VCCAUX | Auxiliary supply | Supplies configuration logic and transceivers; 1.8 V nominal, tolerant to 1.71–1.89 V. |
| M0–M2 | Configuration mode select | Set boot mode (SPI/JTAG/Slave Serial); pulled low via 10 kΩ resistors for default Master SPI. |
| CCLK | Configuration clock | Driven by FPGA during Master SPI mode; max frequency 50 MHz for reliable bitstream loading. |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or error state. |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime logic module swapping without full system reset-critical for adaptive communication protocols. |
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1 lane at 5 GT/s-eliminates need for external bridge IC in host-interface applications. |
| UltraScale-compatible Toolflow | Full synthesis, implementation, and debug support in Vivado 2023.2+-ensures design portability to higher-density families. |
| Low-Power Transceiver I/O | Supports 1.25–3.125 Gbps serial links with built-in equalization-reduces board-level signal integrity effort. |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Closed-loop servo drive with multi-axis synchronization and real-time current loop processing. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation, encoder interpolation, and field-oriented control (FOC) algorithm at ≤1 µs latency. Use Value: 90 DSP slices enable simultaneous 3-axis FOC with 20 kHz update rate; 200 I/O pins route encoder, analog feedback, and safety signals without expansion. | Use Scenario: Modular PXI-style instrument controller handling mixed-signal stimulus/response sequencing. IC Role / Device Role / Timing Role: Configurable I/O bank interfaces to DACs, ADCs, relays, and digital pattern generators with precise timing alignment. Use Value: SelectIO supports 1.8 V LVCMOS, 1.5 V SSTL, and differential LVDS on same bank-enables single-FPGA test head design. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Ultrasound beamformer front-end aggregating 64-channel echo data before GPU transfer. IC Role / Device Role / Timing Role: Time-aligned parallel capture of ADC streams using IDELAYE2 and ISERDESE2 primitives. Use Value: 1,800 Kb Block RAM buffers 128-sample depth per channel; -2 speed grade ensures deterministic 10 ns inter-channel skew. | Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B bus aggregation in line-replaceable units (LRUs). IC Role / Device Role / Timing Role: Protocol engine implementing dual-redundant AFDX end-system with deterministic latency < 50 µs. Use Value: Integrated PCIe Gen2 endpoint connects directly to host processor; 33,280 logic cells implement three independent protocol stacks concurrently. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A50T-2CSG325C | 52,000 logic cells, identical package and I/O count-higher density with no PCB change required. | Supports larger protocol stacks or additional co-processing functions within same footprint. | Select when >33K LUTs needed but thermal budget and board area must remain unchanged. |
| XCKU3P-2FFVA676E | Kintex UltraScale+ device with 352K logic cells, 20×28 Gb/s transceivers, and 0.85 V core-requires new PCB layout and power delivery redesign. | Targets high-throughput serial protocols (PCIe Gen4, 10G Ethernet) beyond Artix-7 capability. | Choose only when migrating to higher bandwidth or lower power-per-GMAC; not a drop-in replacement. |
Compared with XC7A35T-2CSG325C, XC7A50T-2CSG325C offers immediate density uplift within identical mechanical and thermal constraints, while XCKU3P-2FFVA676E demands full system redesign but delivers 10× logic capacity and hardened 28 Gb/s transceivers for next-generation backplane interfaces.
Availability
XC7A35T-2CSG325C is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, medical imaging interface, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC7A35T-2CSG325C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Artix-7 family targets cost-sensitive, power-constrained applications requiring high I/O bandwidth and deterministic real-time performance-designed specifically for industrial automation, test & measurement, and aerospace subsystems.
FAQ
What is the maximum operating junction temperature for XC7A35T-2CSG325C?
The XC7A35T-2CSG325C has a maximum operating junction temperature of 100°C, validated per Xilinx DS181 v1.15. This rating applies under continuous operation with proper PCB thermal vias and 2 oz copper planes. Derating is required above 85°C ambient; thermal simulation using Xilinx Power Estimator (XPE) v2023.2 is recommended before final layout.
Does XC7A35T-2CSG325C support JTAG boundary scan testing?
Yes, XC7A35T-2CSG325C fully supports IEEE 1149.1 JTAG boundary scan through dedicated TDI, TDO, TMS, and TCK pins. The internal BSCAN_XA7A35T primitive enables full chain visibility and pin-level fault detection. Configuration via JTAG is supported in both programming and debug modes using Vivado Hardware Manager.
Can XC7A35T-2CSG325C implement a PCIe Gen2 endpoint without external components?
Yes, XC7A35T-2CSG325C contains a hard PCIe Gen2 x1 endpoint block compliant with PCI Express Base Specification 2.1. It requires only passive AC-coupling capacitors and reference clock conditioning-no external PHY or bridge IC is needed. The block supports MSI, BAR remapping, and DMA transfers up to 500 MB/s sustained throughput.
What configuration modes does XC7A35T-2CSG325C support?
XC7A35T-2CSG325C supports Master SPI, Slave Serial, JTAG, and BPI parallel modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is the default; Slave Serial enables configuration from microcontroller GPIOs. All modes retain full bitstream encryption and HMAC authentication support when enabled in Vivado.
Is XC7A35T-2CSG325C qualified for automotive applications?
No, XC7A35T-2CSG325C is not AEC-Q100 qualified and is rated for industrial temperature range (–40°C to +100°C junction). While it operates reliably in automotive-adjacent environments like under-hood test gear, it lacks automotive-specific qualification, failure-in-time (FIT) reporting, or PPAP documentation required for Tier 1 vehicle integration.
XC7A35T-2CSG325C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2600
- Number of Logic Elements/Cells:
- 33280
- Total RAM Bits:
- 1843200
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A35T-2CSG325C FAQ
1.How can I place an order for XC7A35T-2CSG325C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A35T-2CSG325C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A35T-2CSG325C reliable?
The price and inventory of XC7A35T-2CSG325C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A35T-2CSG325C is usually 5 days.
3.What payment methods are accepted for XC7A35T-2CSG325C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A35T-2CSG325C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A35T-2CSG325C?
XC7A35T-2CSG325C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A35T-2CSG325C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A35T-2CSG325C?
For technical support, including XC7A35T-2CSG325C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A35T-2CSG325C requirements.
6.How does Aetrix verify that XC7A35T-2CSG325C is sourced from the original manufacturer or authorized distributors?
All XC7A35T-2CSG325C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A35T-2CSG325C meets industry standards.
7.What is the process for return or replacement of XC7A35T-2CSG325C?
All XC7A35T-2CSG325C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A35T-2CSG325C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A35T-2CSG325C part is unused and in its original packaging.
Return procedure for XC7A35T-2CSG325C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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