AMD XC7A50T-1CSG325C
- Part No.:
- XC7A50T-1CSG325C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A50T-1CSG325C.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,038
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7A50T-1CSG325C from AMD (formerly Xilinx) is a Kintex-7 family FPGA with 49,600 logic cells, 285 I/O pins in a 324-pin CSG325 package, and -1 speed grade. It integrates 240 DSP slices, 2.55 Mb of block RAM, and supports transceivers up to 6.6 Gb/s - deployed in industrial vision systems for real-time image preprocessing.
For engineers reviewing the XC7A50T-1CSG325C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver lane count, block RAM depth, and thermal performance in compact PCB layouts.
Technical Context
The XC7A50T-1CSG325C implements a 28 nm HKMG process FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and dual-port block RAM with byte-write enable. It supports SelectIO standards including LVCMOS, LVDS, and SSTL across its 285 user I/Os.
Its configuration interface includes JTAG and master/slave SPI modes; configuration memory is loaded via external flash or processor-controlled PCIe/EMAC interfaces. The device lacks integrated ARM cores and requires external microcontroller or host for boot management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - total available LUT-based programmable resources for combinational and sequential logic implementation |
| I/O Pins | 285 - user-configurable bidirectional pins supporting multiple voltage standards and slew rates |
| Block RAM | 2.55 Mb - distributed as 18 Kb BRAM primitives usable as dual-port memory or FIFO buffers |
| DSP Slices | 240 - fixed-point multiply-accumulate units with 25×18-bit pre-adders and pipeline registers |
| Transceiver Speed | 6.6 Gb/s - maximum line rate per GTPE2 transceiver channel, supporting PCIe Gen2 and SATA protocols |
| Speed Grade | -1 - timing specification calibrated for 1.0 V core supply and commercial temperature range (0°C to 85°C) |
Pinout & Package
XC7A50T-1CSG325C uses a 324-pin CSPBGA (CSG325) package with 1.0 mm ball pitch, 15×15 array, and thermal pad. Package dimensions are 15 mm × 15 mm × 1.19 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, clocking, and transceivers; shared with I/O banks |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3 V supply for Bank 0 I/Os; sets voltage standard for connected peripherals |
| M0–M2 | Mode configuration pins | Set boot mode (JTAG, Master SPI, Slave SelectMAP) at power-up; pulled high/low externally |
| CCLK | Configuration clock | Output-only clock during SPI master configuration; drives external flash read timing |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset - critical for runtime protocol adaptation in comms gateways |
| AXI Interconnect Integration | Native support for AXI3/AXI4 protocols simplifies integration with ARM-based processors and DMA controllers |
| UltraScale-Compatible Toolflow | Uses Vivado Design Suite v2018.2+ for synthesis, place-and-route, and bitstream generation - no legacy ISE dependency |
| Thermal Management | Thermal pad and defined junction-to-board resistance (32°C/W) enable conduction cooling in sealed enclosures |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: Real-time pixel-level filtering and feature extraction on 1080p@60fps camera streams. IC Role / Device Role / Timing Role: FPGA fabric executes custom convolution pipelines; transceivers interface with CMOS image sensors via SLVS-EC. Use Value: Latency under 12 µs per frame enables closed-loop motion control in robotic pick-and-place systems. | Use Scenario: High-speed digital pattern generation and response capture for IC functional validation. IC Role / Device Role / Timing Role: Configurable I/O banks drive DUT signals at 200 MHz; block RAM stores test vectors and expected responses. Use Value: 285 I/Os allow parallel testing of 16-bit wide devices without multiplexing or time-division overhead. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of ultrasound beamformer data from 128-channel ADC arrays. IC Role / Device Role / Timing Role: DSP slices perform real-time beam summation; PCIe Gen2 x4 interface transfers processed frames to host CPU. Use Value: 240 DSP slices sustain 1.2 GOPS sustained compute for B-mode image reconstruction at 30 fps. | Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals into a single Ethernet backbone. IC Role / Device Role / Timing Role: Dedicated protocol engines implement bus arbitration and message framing; transceivers handle 100BASE-TX PHY interface. Use Value: Deterministic latency ≤ 800 ns per packet ensures compliance with DO-254 Level A timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-1CSG325C | 74,000 logic cells, same package and speed grade; higher DSP slice count (360) and BRAM (3.2 Mb) | Better suited for multi-channel radar FFT processing where resource headroom exceeds XC7A50T-1CSG325C capacity | Select when design requires >50% additional logic or DSP resources without changing PCB layout |
| XC7A35T-1CSG325C | 33,280 logic cells, identical package and speed grade; reduced I/O count (210) and BRAM (1.8 Mb) | Targeted at cost-sensitive embedded control with minimal transceiver use and lower bandwidth requirements | Choose for space-constrained motor control modules where XC7A50T-1CSG325C resources are over-provisioned |
Compared with XC7A50T-1CSG325C, XC7A75T-1CSG325C delivers higher compute density for algorithm-heavy workloads, while XC7A35T-1CSG325C reduces BOM cost and power by 28% in deterministic control applications - both retain identical thermal profile and board footprint.
Availability
XC7A50T-1CSG325C is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC7A50T-1CSG325C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand FPGA and ACAP portfolio for datacenter, AI, and edge applications.
The Kintex-7 family targets high-performance, cost-optimized applications demanding balanced logic, memory, and I/O resources - designed for industrial automation, medical imaging, and communications infrastructure.
FAQ
What is the operating temperature range for XC7A50T-1CSG325C?
The XC7A50T-1CSG325C is rated for commercial temperature operation from 0°C to +85°C ambient. Its thermal pad and specified junction-to-board resistance (32°C/W) support reliable operation in fanless enclosures up to 75°C board temperature when properly heatsinked. The -1 speed grade is validated only within this range; extended temperature variants require different part numbers.
Does XC7A50T-1CSG325C support PCIe Gen3?
No, XC7A50T-1CSG325C supports PCIe Gen2 (5.0 GT/s) via its GTPE2 transceivers, with maximum line rate of 6.6 Gb/s. PCIe Gen3 (8.0 GT/s) requires UltraScale+ or Versal families. Designs requiring Gen3 must migrate to XCZUx or XCKUx devices - XC7A50T-1CSG325C's transceiver architecture does not meet Gen3 jitter or equalization specifications.
Can XC7A50T-1CSG325C be configured via JTAG only?
Yes, XC7A50T-1CSG325C supports JTAG configuration for debugging and programming, but it cannot boot from JTAG alone. Primary configuration requires external SPI flash or processor-driven slave selectMAP. JTAG is used for boundary-scan testing, partial reconfiguration, and debug access - not for standalone power-on initialization of XC7A50T-1CSG325C.
What I/O standards are supported on XC7A50T-1CSG325C banks?
XC7A50T-1CSG325C supports LVCMOS (1.2V–3.3V), LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and TMDS across its 14 I/O banks. Each bank's VCCO sets the output voltage level, and differential standards require proper termination. Unused I/Os default to Hi-Z; no internal pull-ups unless explicitly enabled per bank in the XC7A50T-1CSG325C configuration.
Is partial reconfiguration supported on XC7A50T-1CSG325C?
Yes, XC7A50T-1CSG325C fully supports partial reconfiguration using Vivado's PR flow. Dynamic module swapping is enabled through dedicated configuration logic and frame-based bitstream updates. This capability is verified in Xilinx UG909 and applied in real-time protocol adaptation - e.g., switching between CAN FD and Ethernet MAC engines without resetting the entire XC7A50T-1CSG325C fabric.
XC7A50T-1CSG325C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A50T-1CSG325C FAQ
1.How can I place an order for XC7A50T-1CSG325C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-1CSG325C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-1CSG325C reliable?
The price and inventory of XC7A50T-1CSG325C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-1CSG325C is usually 5 days.
3.What payment methods are accepted for XC7A50T-1CSG325C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-1CSG325C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-1CSG325C?
XC7A50T-1CSG325C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-1CSG325C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-1CSG325C?
For technical support, including XC7A50T-1CSG325C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-1CSG325C requirements.
6.How does Aetrix verify that XC7A50T-1CSG325C is sourced from the original manufacturer or authorized distributors?
All XC7A50T-1CSG325C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-1CSG325C meets industry standards.
7.What is the process for return or replacement of XC7A50T-1CSG325C?
All XC7A50T-1CSG325C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-1CSG325C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-1CSG325C part is unused and in its original packaging.
Return procedure for XC7A50T-1CSG325C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7A50T-1CSG325C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

