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AMD XC7A50T-1FGG484C
- Part No.:
- XC7A50T-1FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC7A50T-1FGG484C.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:152
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Product details
Overview
XC7A50T-1FGG484C from AMD (formerly Xilinx) is a Kintex-7 family FPGA with 47,520 logic cells, 2.55 Mb of block RAM, 240 DSP slices, and 285 I/O pins in a 484-pin Fine-Pitch Flip-Chip BGA (FFG) package. It operates at -1 speed grade and supports 1.0V core voltage for high-performance embedded vision and industrial control applications.
For engineers reviewing the XC7A50T-1FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, DSP resource availability, and thermal performance in compact industrial PCB layouts.
Technical Context
The XC7A50T-1FGG484C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated carry chains, and integrated clock management tiles (CMTs) containing PLLs and MMCMs. It supports transceiver line rates up to 6.6 Gb/s via SelectIO technology with SSTL, LVCMOS, HSTL, and differential standards including LVDS and TMDS.
Configuration is performed via JTAG, SPIx4, or BPI parallel interfaces, and it includes integrated configuration memory with fallback support. The device supports partial reconfiguration and AXI interconnect compatibility for SoC integration with MicroBlaze or ARM-based processing systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 47,520 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| Block RAM | 2.55 Mb - supports large on-chip data buffering, FIFOs, or lookup tables without external memory |
| DSP Slices | 240 - enables real-time fixed/floating-point math for filtering, FFT, or motor control algorithms |
| I/O Pins | 285 - provides flexible interface count for multi-protocol connectivity in industrial I/O modules |
| Speed Grade | -1 - specifies maximum operating frequency and timing closure margin for critical paths |
| Core Voltage | 1.0 V - defines power delivery network requirements and impacts dynamic power consumption |
| Package | 484-pin FFG - 19×19 mm flip-chip BGA with 0.8 mm pitch, requiring controlled impedance PCB stackup |
Pinout & Package
XC7A50T-1FGG484C is housed in a 484-pin Fine-Pitch Flip-Chip BGA (FGG) package with 19×19 array, 0.8 mm ball pitch, and thermal pad center. Pin functions are defined per UG475 v1.13 and include dedicated configuration, clock, JTAG, and SelectIO banks grouped by voltage and I/O standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiation | Asserted to reset configuration logic and initiate startup sequence from selected mode |
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master SPI/BPI programming |
| DONE | Configuration Status Output | High-Z until configuration completes; pulled high to indicate successful bitstream load |
| M0–M2 | Mode Selection Inputs | Set boot source (JTAG, SPI, BPI) and configuration width (x1/x2/x4) |
| IO_L1P_T0_0 | Bank 0 I/O (Differential Pair) | Supports LVDS output at up to 1.25 Gb/s or single-ended SSTL-18 input for DDR3 interface |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two MMCMs + one PLL per device enable precise clock synthesis, phase alignment, and jitter reduction for multi-clock domain designs |
| SelectIO Technology | Per-bank programmable I/O standards support mixed-voltage interfaces (1.2–3.3 V) and reduce level-shifter component count |
| Partial Reconfiguration | Allows dynamic logic module swapping without full system reset-critical for adaptive signal processing or field-upgradable firmware |
| AXI Interconnect Support | Native compatibility with AXI3/AXI4 protocols simplifies integration with Zynq-7000 or MicroBlaze-based soft processors |
| Transceiver Capabilities | Up to 16 GTPE2 transceivers (not present in XC7A50T) - not applicable; this variant has no transceivers |
Applications
| Industrial Motor Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time closed-loop servo drive with position feedback, PWM generation, and safety monitoring. IC Role / Device Role / Timing Role: FPGA fabric executes PID control loops, encoder interpolation, and functional safety logic with deterministic sub-microsecond latency. Use Value: 240 DSP slices accelerate motor algorithm execution; 285 I/O pins interface directly with ADCs, gate drivers, and isolation ICs. | Use Scenario: On-camera preprocessing pipeline for high-speed inspection systems using CMOS image sensors. IC Role / Device Role / Timing Role: Configurable logic implements pixel-level filtering, histogram equalization, and ROI extraction before data transfer to host processor. Use Value: 47,520 logic cells support parallel pixel processing; SelectIO supports MIPI CSI-2 bridge via LVDS or sub-LVDS signaling. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Modular I/O base unit supporting analog/digital input/output expansion with field-reprogrammable logic. IC Role / Device Role / Timing Role: FPGA manages cyclic I/O scanning, protocol translation (Modbus TCP/RTU), and watchdog supervision with guaranteed scan cycle timing. Use Value: Block RAM stores I/O mapping tables and protocol state machines; 1.0 V core enables low-heat operation in sealed enclosures. | Use Scenario: High-resolution digital oscilloscope front-end with real-time waveform capture and trigger analysis. IC Role / Device Role / Timing Role: FPGA performs deep memory buffering, hardware-accelerated triggering, and serial-to-parallel data conversion for ADC streams. Use Value: 2.55 Mb block RAM enables 128 Mpts acquisition depth; speed grade -1 ensures reliable timing closure at 200+ MHz sampling control clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A35T-1FGG484C | 33,280 logic cells, 1.8 Mb BRAM, 180 DSP slices - lower density and reduced memory/DSP resources | Suitable for cost-sensitive PLC I/O modules or simpler vision pre-processing where full XC7A50T capacity is unused | Select when design fits within reduced resource budget and thermal/power envelope is tighter |
| XC7A75T-1FGG484C | 61,440 logic cells, 3.24 Mb BRAM, 360 DSP slices - higher density and enhanced compute/memory bandwidth | Preferred for multi-sensor fusion, advanced motion control, or dual-camera synchronized processing | Choose when additional logic, memory, or DSP headroom is required for future feature expansion |
Compared with XC7A35T-1FGG484C and XC7A75T-1FGG484C, the XC7A50T-1FGG484C delivers balanced logic, memory, and DSP resources for mid-tier industrial FPGA applications-avoiding overdesign while maintaining upgrade path headroom.
Availability
XC7A50T-1FGG484C is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, and programmable logic controller (PLC) designs requiring stable component supply across extended production lifecycles.
Supply support for XC7A50T-1FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Kintex-7 family-including XC7A50T-1FGG484C-is engineered for cost-optimized high-performance applications in industrial automation, test equipment, and vision systems where logic density, I/O flexibility, and power efficiency are balanced.
FAQ
What is the maximum supported I/O standard voltage for XC7A50T-1FGG484C?
The XC7A50T-1FGG484C supports I/O bank voltages from 1.2 V to 3.3 V, with individual banks configurable for standards including LVCMOS, SSTL, HSTL, and differential LVDS. Each bank's VCCO must match the selected I/O standard's requirement, and DCI (Digitally Controlled Impedance) is available for on-die termination calibration. XC7A50T-1FGG484C does not support 1.5 V HSTL Class I or 1.8 V DDR3 in all banks-refer to UG475 Table 1-10 for bank-specific limitations.
Does XC7A50T-1FGG484C include built-in transceivers for high-speed serial communication?
No, XC7A50T-1FGG484C does not include GTPE2 or any high-speed transceivers. It belongs to the non-transceiver variant of the Artix-7 family (despite Kintex-7 naming in legacy documentation-correct family is Artix-7). Serial connectivity relies on SelectIO-based protocols such as LVDS, Sub-LVDS, or custom source-synchronous interfaces. XC7A50T-1FGG484C is intended for parallel bus, DDR memory, and moderate-speed differential I/O-not PCIe, SATA, or 10GbE physical layers.
What configuration modes are supported by XC7A50T-1FGG484C?
XC7A50T-1FGG484C supports JTAG, Master SPI (x1/x2/x4), Slave SPI, and Master SelectMAP (BPI) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Internal configuration memory allows fallback to secondary bitstream if primary fails. XC7A50T-1FGG484C requires external nonvolatile storage (e.g., SPI flash) for automatic boot unless JTAG programming is used exclusively in development.
Is XC7A50T-1FGG484C compatible with Vivado Design Suite version 2023.1?
Yes, XC7A50T-1FGG484C is fully supported in Vivado Design Suite 2023.1, including synthesis, implementation, simulation, and bitstream generation. Device files, IP integrator templates, and constraint editors recognize XC7A50T-1FGG484C natively. XC7A50T-1FGG484C also maintains backward compatibility with Vivado 2019.2 through 2022.2 for legacy project migration and long-term toolchain stability.
What thermal considerations apply to XC7A50T-1FGG484C in enclosed industrial enclosures?
XC7A50T-1FGG484C has a maximum junction temperature of 100°C and typical power dissipation of 3.2–5.8 W depending on utilization. In sealed enclosures, a minimum 2-layer PCB with internal ground/power planes and thermal vias under the package is required. XC7A50T-1FGG484C benefits from copper pour on top/bottom layers and optional heat slug attachment-no active cooling needed below 65°C ambient with proper board-level thermal design.
XC7A50T-1FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC7A50T-1FGG484C FAQ
1.How can I place an order for XC7A50T-1FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-1FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-1FGG484C reliable?
The price and inventory of XC7A50T-1FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-1FGG484C is usually 5 days.
3.What payment methods are accepted for XC7A50T-1FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-1FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-1FGG484C?
XC7A50T-1FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-1FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-1FGG484C?
For technical support, including XC7A50T-1FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-1FGG484C requirements.
6.How does Aetrix verify that XC7A50T-1FGG484C is sourced from the original manufacturer or authorized distributors?
All XC7A50T-1FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-1FGG484C meets industry standards.
7.What is the process for return or replacement of XC7A50T-1FGG484C?
All XC7A50T-1FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-1FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-1FGG484C part is unused and in its original packaging.
Return procedure for XC7A50T-1FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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