AMD XC7A50T-1FTG256C
- Part No.:
- XC7A50T-1FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC7A50T-1FTG256C.pdf
- Description:
- IC FPGA 170 I/O 256FTBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,775
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Product details
Overview
XC7A50T-1FTG256C from AMD (formerly Xilinx) is a Kintex-7 family FPGA with 47,520 logic cells, 210 DSP slices, 2.85 Mb of block RAM, and 16 GTX transceivers operating up to 6.6 Gb/s. It is packaged in a 256-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch and supports industrial temperature range (–40°C to +100°C).
For engineers reviewing the XC7A50T-1FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (170 user I/Os), transceiver speed grade (–1 speed grade), configuration interface (SPIx4/JTAG), and thermal design requirements for convection-cooled embedded systems.
Technical Context
The XC7A50T-1FTG256C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling such as LVDS and TMDS.
Configuration is performed via Master SPI or JTAG, with support for fallback and multi-boot modes. The device integrates a dual-core ARM Cortex-A9 MPCore processor only in Zynq-7000 series-not in Kintex-7-so XC7A50T-1FTG256C is a pure programmable logic device without integrated processing subsystem.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 47,520 LUTs + flip-flops; determines maximum combinational/sequential logic capacity for custom digital functions. |
| DSP Slices | 210; each provides 25 × 18-bit multiplier + accumulator, enabling real-time filtering and math-intensive algorithms. |
| Block RAM | 2.85 Mb (216 x 16 Kb BRAM); supports dual-port, true dual-port, and FIFO configurations for on-chip data buffering. |
| GTX Transceivers | 16 channels, up to 6.6 Gb/s; enables high-speed serial links for PCIe Gen2, CPRI, or JESD204B interfaces. |
| User I/O Pins | 170 single-ended or 85 differential pairs; supports bank-specific voltage levels (1.2–3.3 V) and slew rate control. |
| Speed Grade | –1; guarantees timing closure at specified frequencies under industrial temperature and voltage conditions. |
| Configuration Mode | Master SPI x4 or JTAG; defines boot source and programming interface for field updates and production programming. |
Pinout & Package
XC7A50T-1FTG256C is housed in a 256-ball Fine-Pitch BGA (FTG) package with 0.8 mm ball pitch, 17 mm × 17 mm body size, and 1.05 mm height. Thermal pad on underside requires PCB thermal via array per Xilinx UG475.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.0V core supply; must be filtered with low-ESR ceramic capacitors near package corner. |
| K1 | VCCAUX | 1.8V auxiliary supply for configuration, clocking, and transceivers; separate regulation required. |
| P2 | M0/M1/M2 | Configuration mode select pins; set boot source (SPI/JTAG) and bitstream width (x1/x2/x4). |
| T1 | CCLK | Configuration clock input/output; driven by external master during SPI config or internal oscillator during JTAG. |
| R1 | DONE | Open-drain status signal; goes high when configuration completes and device enters user mode. |
| Y2 | INIT_B | Active-low initialization status; indicates readiness to accept configuration data or signals CRC error. |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full reconfiguration, reducing system downtime in telecom and radar applications. |
| Integrated Clock Management | Eight MMCMs and eight PLLs provide jitter cleaning, frequency synthesis, and phase alignment across multiple clock domains. |
| Transceiver Calibration | Automatic analog calibration of GTX receivers ensures consistent signal integrity across voltage/temperature variations. |
| AXI Interconnect Compatibility | Native support for AXI3/AXI4 protocols simplifies integration with IP cores and third-party peripherals in SoC-style designs. |
| Power-Down Modes | Per-bank I/O power gating and selective logic shutdown reduce static power in always-on edge devices. |
Applications
| Wireless Baseband Processing | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time FFT, channel estimation, and MIMO precoding in LTE/5G remote radio heads. IC Role / Device Role / Timing Role: Programmable baseband accelerator offloading DSP tasks from host processors. Use Value: 210 DSP slices and 16 GTX transceivers enable concurrent multi-carrier processing and fronthaul interface handling. | Use Scenario: High-speed image acquisition, real-time defect detection, and multi-camera synchronization in automated inspection systems. IC Role / Device Role / Timing Role: Image pipeline controller and pixel-level processing engine interfacing with CMOS sensors and FPD-Link III displays. Use Value: 170 user I/Os support parallel sensor interfaces, while block RAM enables line-buffered convolution kernels without external memory latency. |
| Medical Imaging Data Acquisition | Test & Measurement Equipment |
Use Scenario: Time-of-flight processing and beamforming in portable ultrasound systems with analog front-end digitization. IC Role / Device Role / Timing Role: Digital backend processor synchronizing ADC sampling, applying FIR filters, and formatting data for USB 3.0 or PCIe transfer. Use Value: GTX transceivers handle high-throughput raw ADC streams; –1 speed grade ensures deterministic timing for sub-microsecond trigger responses. | Use Scenario: Modular signal generation, analysis, and protocol decoding in PXIe-based ATE platforms. IC Role / Device Role / Timing Role: Reconfigurable instrument controller managing waveform memory, trigger sequencing, and high-speed DAC/ADC interfacing. Use Value: Partial reconfiguration allows runtime switching between test profiles; 2.85 Mb block RAM stores multiple waveform sets on-chip. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-1FTG256C | Higher logic capacity (61,440 LCs), same package and speed grade; increased DSP slices (240) and BRAM (3.24 Mb). | Suitable for more complex signal processing pipelines requiring additional logic resources without changing PCB layout. | Select when design margin exceeds 25% resource utilization on XC7A50T-1FTG256C and future scalability is required. |
| XC7A35T-1FTG256C | Lower logic count (28,000 LCs), reduced DSP slices (105) and BRAM (2.16 Mb); identical package and I/O count. | Better suited for cost-sensitive, lower-bandwidth applications like motor control or basic protocol bridging. | Choose when XC7A50T-1FTG256C resources are significantly over-provisioned and BOM cost reduction is prioritized. |
Compared with XC7A50T-1FTG256C, XC7A75T-1FTG256C offers headroom for algorithm expansion without board changes, while XC7A35T-1FTG256C reduces unit cost where logic density and memory bandwidth are less critical-both share pin-compatible packaging but differ in performance ceiling and power envelope.
Availability
XC7A50T-1FTG256C is available at Aetrix Electronics and suitable for wireless infrastructure, industrial vision, medical imaging, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7A50T-1FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Kintex-7 family, including XC7A50T-1FTG256C, was designed for high-performance, cost-optimized applications demanding balanced logic, DSP, memory, and serial connectivity-targeting communications, video, and industrial systems.
FAQ
What is the maximum supported transceiver data rate for XC7A50T-1FTG256C?
The XC7A50T-1FTG256C integrates GTX transceivers rated for operation up to 6.6 Gb/s per lane. This specification is guaranteed under industrial temperature conditions and –1 speed grade, supporting protocols including PCIe Gen2, CPRI, and Serial RapidIO. Actual achievable rate depends on PCB layout quality, reference clock stability, and equalization settings configured in Vivado.
Does XC7A50T-1FTG256C include an integrated processor core?
No, XC7A50T-1FTG256C is a pure FPGA without embedded processors. It belongs to the Kintex-7 family, which lacks the dual-core ARM Cortex-A9 found in Zynq-7000 SoCs. All processing must be implemented using programmable logic or external microprocessors interfaced via I/O or high-speed transceivers.
What configuration modes does XC7A50T-1FTG256C support?
XC7A50T-1FTG256C supports Master SPI (x1/x2/x4), Slave Serial, JTAG, and BPI modes. Configuration is selected using M0–M2 pins. SPI x4 is most common for fast, single-image loading from flash; JTAG is used for debugging and in-system programming during development and field updates.
How many user I/O banks does XC7A50T-1FTG256C have, and what voltage levels are supported?
XC7A50T-1FTG256C has 10 user I/O banks supporting selectable I/O standards. Each bank operates at 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling mixed-voltage interfacing with legacy and modern peripherals. Bank-specific VCCO supplies must be independently regulated and decoupled.
Is partial reconfiguration supported on XC7A50T-1FTG256C?
Yes, XC7A50T-1FTG256C fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic replacement of logic modules while the rest of the design remains operational-critical for applications like adaptive radio protocols or real-time system upgrades without service interruption.
XC7A50T-1FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 170
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC7A50T-1FTG256C FAQ
1.How can I place an order for XC7A50T-1FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-1FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-1FTG256C reliable?
The price and inventory of XC7A50T-1FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-1FTG256C is usually 5 days.
3.What payment methods are accepted for XC7A50T-1FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-1FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-1FTG256C?
XC7A50T-1FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-1FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-1FTG256C?
For technical support, including XC7A50T-1FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-1FTG256C requirements.
6.How does Aetrix verify that XC7A50T-1FTG256C is sourced from the original manufacturer or authorized distributors?
All XC7A50T-1FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-1FTG256C meets industry standards.
7.What is the process for return or replacement of XC7A50T-1FTG256C?
All XC7A50T-1FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-1FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-1FTG256C part is unused and in its original packaging.
Return procedure for XC7A50T-1FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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