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AMD XC7A50T-2CS325I
- Part No.:
- XC7A50T-2CS325I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A50T-2CS325I.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,892
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Product details
Overview
XC7A50T-2CS325I from AMD is a Kintex-7 FPGA with 49,600 logic cells, 2.55 Gbps transceivers, 285 I/O pins in a 324-pin CSPBGA package, and -2 speed grade for high-performance industrial control and video processing systems.
For engineers reviewing the XC7A50T-2CS325I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2–3.3 V), transceiver compliance (PCIe Gen2, SATA, CPRI), and thermal performance in compact PCB layouts.
Technical Context
The XC7A50T-2CS325I implements a 28 nm HKMG process architecture with integrated Block RAM (3.8 Mbit), DSP slices (240), and clock management tiles (CMT) supporting phase-matched multi-clock domains. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, TMDS).
Its transceivers operate at 622 Mbps to 2.55 Gbps with built-in PRBS generators/checkers and elastic buffers. Configuration is supported via Master SPI, Slave Serial, or JTAG interfaces with AES-256 bitstream encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - determines maximum combinational/sequential logic capacity for HDL synthesis |
| Block RAM | 3.8 Mbit - provides on-chip memory for FIFOs, frame buffers, or lookup tables |
| DSP Slices | 240 - enables fixed/floating-point MAC operations per clock cycle |
| Transceiver Speed | 2.55 Gbps - supports PCIe Gen2 x4, SATA II, and CPRI Option 3 links |
| I/O Pins | 285 - configurable as single-ended or differential with programmable slew rate and drive strength |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade |
| Package | CSPBGA-325 - 15×15 mm body, 0.8 mm pitch, RoHS-compliant, thermal pad enabled |
Pinout & Package
CSPBGA-325 package with exposed thermal pad, 15×15 mm footprint, 0.8 mm ball pitch, and JEDEC-standard mechanical dimensions. Compatible with standard reflow profiles and automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% required for logic fabric and CLBs; decoupling critical near each power ball |
| VCCAUX | Auxiliary power supply | 1.8V ±3% powers configuration logic, clock management, and transceivers |
| VCCO_0 | I/O bank power | 1.2–3.3V selectable per bank; defines output voltage swing and input threshold |
| M0–M2 | Configuration mode select | Set boot mode (SPI, BPI, JTAG) at power-up; pulled high/low via external resistors |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or error |
| CCLK | Configuration clock | Driven by external master during Slave Serial mode; max 50 MHz frequency |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for adaptive radio or real-time protocol stacks |
| AES-256 Bitstream Encryption | Prevents IP theft by encrypting configuration data stored in external flash memory |
| Integrated PCI Express Endpoint | Hard IP block supporting Gen2 x1/x2/x4 with LTSSM and TLP handling-reduces soft-core overhead |
| UltraScale-Compatible Toolchain | Uses Vivado 2022.2+ for synthesis, place-and-route, and bitstream generation with timing-aware optimization |
| Thermal Monitoring Diode | On-die sensor outputs analog voltage proportional to junction temperature-enables closed-loop fan control |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time image preprocessing pipeline in embedded endoscopy systems with HDMI input and DDR3 memory buffering. IC Role / Device Role / Timing Role: FPGA acts as pixel-domain accelerator, synchronizing camera sensor interface (MIPI CSI-2), performing gamma correction, and managing DDR3 burst transfers. Use Value: XC7A50T-2CS325I delivers deterministic latency (<200 ns) for pixel clock domain crossing and supports dual 10-bit parallel I/O banks for sensor data capture. | Use Scenario: Ultrasound beamformer controller interfacing with ADC arrays and FPGA-based digital down-conversion (DDC) modules. IC Role / Device Role / Timing Role: XC7A50T-2CS325I serves as timing-critical DDC engine, executing 128-tap FIR filters at 125 MSPS using dedicated DSP slices. Use Value: XC7A50T-2CS325I achieves 2.5 Gbps transceiver link to host PCIE endpoint while maintaining sub-10 ps jitter for sampling clock recovery. |
| Avionics Data Concentrator | 5G Small Cell Baseband |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation unit in UAV flight control subsystems with DO-254 compliance requirements. IC Role / Device Role / Timing Role: XC7A50T-2CS325I implements dual-redundant protocol engines with deterministic arbitration and time-stamped message logging. Use Value: XC7A50T-2CS325I meets <1 µs worst-case interrupt latency under full I/O load and supports ECC on on-chip BRAM for certified data integrity. | Use Scenario: Layer 1 PHY processing in outdoor small cell units requiring CPRI fronthaul and LTE-A carrier aggregation. IC Role / Device Role / Timing Role: XC7A50T-2CS325I hosts CPRI v6.1 fronthaul interface and OFDM modulation/demodulation chains using hardened transceivers and DSP resources. Use Value: XC7A50T-2CS325I sustains 2.4576 Gbps CPRI line rate across all 4 transceiver lanes with <0.5 UI jitter at receiver input. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-2CSG324I | 74,880 logic cells, same package footprint but no thermal pad; 324-ball vs. 325-ball layout | Higher gate count supports larger FFT engines but lacks thermal pad for sustained 1W+ operation | Select when additional LUTs are needed and thermal headroom is managed externally |
| XCKU035-2FFVA676I | UltraScale architecture, 220K logic cells, 16.3 Gbps transceivers, FCBGA-676 package | Targets 5G NR and radar with higher bandwidth; requires new PCB layout and power delivery design | Choose for next-generation designs needing >10 Gbps serial I/O and hardened DDR4 controller |
Compared with XC7A75T-2CSG324I and XCKU035-2FFVA676I, the XC7A50T-2CS325I offers optimal balance of I/O density, thermal reliability via thermal pad, and PCIe Gen2 integration-making it preferred for space-constrained industrial edge nodes where re-spinning PCBs is cost-prohibitive.
Availability
XC7A50T-2CS325I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC7A50T-2CS325I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through high-performance FPGA and adaptive SoC platforms.
The Kintex-7 family targets cost-sensitive, high-throughput applications such as video processing, wireless infrastructure, and test equipment-balancing logic capacity, transceiver performance, and power efficiency.
FAQ
What is the maximum supported I/O standard voltage for XC7A50T-2CS325I?
The XC7A50T-2CS325I supports I/O voltages from 1.2 V to 3.3 V per bank, with individual bank configuration enabling mixed-voltage operation. Each I/O bank has dedicated VCCO and VREF pins, allowing concurrent use of LVCMOS18, SSTL15, and HSTL_I standards on the same device without level-shifting circuitry.
Does XC7A50T-2CS325I include hardened PCIe Gen2 endpoints?
Yes, the XC7A50T-2CS325I integrates a hardened PCIe Gen2 x1/x2/x4 endpoint block compliant with PCI Express Base Specification 2.1. It handles link training, transaction layer packet (TLP) routing, and error reporting without consuming logic resources, reducing design effort and improving timing predictability compared to soft-core implementations.
What configuration modes does XC7A50T-2CS325I support?
The XC7A50T-2CS325I supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Slave Serial mode uses an external controller to drive CCLK and DINS, while Master SPI boots directly from a standard quad-SPI flash device connected to dedicated configuration pins.
Is XC7A50T-2CS325I qualified for extended temperature operation?
Yes, the XC7A50T-2CS325I is rated for –40°C to +100°C junction temperature (I-grade), with validated operation across the full range under specified voltage and timing conditions. Thermal derating curves and power consumption tables are provided in DS182 for system-level thermal modeling.
Can XC7A50T-2CS325I implement partial reconfiguration in production systems?
Yes, the XC7A50T-2CS325I fully supports partial reconfiguration using Vivado's PRC flow. Verified use cases include runtime swapping of communication protocol stacks (e.g., switching between CAN FD and Ethernet AVB) and adaptive filter coefficient updates in radar signal processing-without disrupting active I/O or memory interfaces.
XC7A50T-2CS325I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A50T-2CS325I FAQ
1.How can I place an order for XC7A50T-2CS325I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-2CS325I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-2CS325I reliable?
The price and inventory of XC7A50T-2CS325I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-2CS325I is usually 5 days.
3.What payment methods are accepted for XC7A50T-2CS325I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-2CS325I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-2CS325I?
XC7A50T-2CS325I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-2CS325I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-2CS325I?
For technical support, including XC7A50T-2CS325I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-2CS325I requirements.
6.How does Aetrix verify that XC7A50T-2CS325I is sourced from the original manufacturer or authorized distributors?
All XC7A50T-2CS325I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-2CS325I meets industry standards.
7.What is the process for return or replacement of XC7A50T-2CS325I?
All XC7A50T-2CS325I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-2CS325I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-2CS325I part is unused and in its original packaging.
Return procedure for XC7A50T-2CS325I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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