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AMD XC7A50T-2CSG325C
- Part No.:
- XC7A50T-2CSG325C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A50T-2CSG325C.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:109
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Product details
Overview
XC7A50T-2CSG325C from AMD is a Kintex-7 FPGA with 49,600 logic cells, 2.55 Gbps transceiver capability, and 285 I/O pins in a 325-pin CSG package; it targets high-speed serial interface bridging in industrial vision systems.
For engineers reviewing the XC7A50T-2CSG325C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade (-2), I/O voltage support (1.2–3.3 V), and thermal performance in convection-cooled enclosures.
Technical Context
The XC7A50T-2CSG325C implements a 28 nm HKMG process architecture with integrated Block RAM (2,820 kbits), DSP slices (240), and clock management tiles (CMT) supporting phase-matched multi-clock domains. It supports SelectIO standards including LVDS, SSTL, and HSTL across all banks.
This device includes 16 GTX transceivers operating up to 2.55 Gbps with built-in PRBS generators and eye diagram monitors. Configuration is via quad-SPI or JTAG, with support for dual-boot and fallback modes using external flash memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - determines maximum combinational/sequential logic capacity for custom IP integration |
| Transceiver Speed | 2.55 Gbps - enables PCIe Gen1 x1, Gigabit Ethernet, and Camera Link serial links |
| I/O Pins | 285 - supports parallel sensor interfaces, memory controllers, and multi-protocol expansion |
| Block RAM | 2,820 kbits - provides on-die buffering for video frame storage and FIFO depth scaling |
| DSP Slices | 240 - accelerates real-time filtering, FFT, and image processing kernels |
| Package | CSG325 - 15×15 mm, 0.8 mm pitch, RoHS-compliant flip-chip BGA with thermal pad |
Pinout & Package
The XC7A50T-2CSG325C uses a 325-pin CSG package with exposed thermal pad, designed for surface-mount reflow assembly and thermal dissipation in industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, transceivers, and clock management |
| M0–M2 | Mode configuration pins | Determine boot source (SPI/JTAG/BPI) and configuration mode at power-up |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration progress and error state |
| CLK_IN | Primary clock input | Dedicated differential input for system clock or reference clock feeding MMCM/PLL |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG process | Enables lower dynamic power and higher density vs. 40 nm FPGAs without sacrificing timing closure |
| GTX transceivers | Supports embedded 8b/10b encoding, elastic buffers, and programmable equalization for signal integrity |
| SelectIO technology | Per-bank voltage control allows mixed-voltage I/O (1.2 V to 3.3 V) on same device |
| Integrated clock management | MMCM and PLL blocks provide jitter reduction, frequency synthesis, and phase alignment across multiple clocks |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: High-resolution camera sensor interfacing with real-time preprocessing and data compression before transmission. IC Role / Device Role / Timing Role: FPGA fabric implements pixel-level filtering, Bayer demosaicing, and JPEG2000 encoding pipelines. Use Value: 285 I/O pins enable parallel CMOS/CCD sensor capture; GTX transceivers stream compressed frames over mini-PCIe or USB 3.0 PHY bridges. | Use Scenario: Multi-channel digital pattern generation and acquisition with sub-nanosecond timing alignment. IC Role / Device Role / Timing Role: Configurable logic generates synchronized stimulus vectors while capturing response waveforms with timestamping. Use Value: 240 DSP slices accelerate real-time pass/fail analysis; MMCM ensures <50 ps channel-to-channel skew across 64+ I/O lines. |
| Medical Imaging Interface | Defense Radar Signal Processing |
Use Scenario: Interfacing ultrasound beamformer ASICs to host processors via high-throughput serial links. IC Role / Device Role / Timing Role: Protocol bridge converting JESD204B lane data to AXI-Stream for DMA-based host transfer. Use Value: GTX transceivers operate at 2.55 Gbps to sustain 4-lane JESD204B Class A compliance; 2,820 kbits Block RAM buffers burst transfers. | Use Scenario: Real-time pulse-Doppler processing of phased-array radar returns under size, weight, and power constraints. IC Role / Device Role / Timing Role: Hardware-accelerated matched filtering and CFAR detection implemented in LUTs and DSP slices. Use Value: 49,600 logic cells accommodate full pipeline stages; thermal design of CSG325 package supports operation at 85°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC7A35T-2CSG324C | Fewer logic cells (33,280), no GTX transceivers, 210 I/O pins, same CSG package footprint but different pinout | Limited to lower-bandwidth protocols (e.g., UART, SPI, basic LVDS); unsuitable for JESD204B or PCIe | Select when cost-sensitive designs require only moderate logic density and no high-speed serial I/O |
| Intel EP4CE22F17C6N | Cyclone IV E FPGA, 22,320 LEs, no transceivers, 188 user I/O, 256-pin FBGA | Targeted at legacy parallel bus bridging and simple control logic; lacks SERDES and advanced clocking | Choose for fixed-function control applications where SERDES, DSP, or high I/O count are unnecessary |
Compared with XC7A35T-2CSG324C and EP4CE22F17C6N, the XC7A50T-2CSG325C delivers higher transceiver bandwidth, greater logic capacity, and superior clock management-making it suitable for next-generation vision and test equipment requiring JESD204B, PCIe, or multi-clock domain synchronization.
Availability
XC7A50T-2CSG325C is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term production support.
Supply support for XC7A50T-2CSG325C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, AI acceleration, and high-performance processing solutions for data centers, edge devices, and embedded systems.
The Kintex-7 family was engineered for cost-optimized high-performance applications demanding balanced logic density, I/O bandwidth, and transceiver capability-especially in industrial, medical, and test instrumentation.
FAQ
What is the maximum supported transceiver data rate for XC7A50T-2CSG325C?
The XC7A50T-2CSG325C supports GTX transceivers rated up to 2.55 Gbps per lane. This speed enables compliance with JESD204B Class A, Gigabit Ethernet, and PCIe Gen1 x1 protocols. The -2 speed grade guarantees timing closure at this rate under industrial temperature conditions (–40°C to +85°C).
Does XC7A50T-2CSG325C support JTAG boundary-scan testing?
Yes, the XC7A50T-2CSG325C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. It also enables configuration and debug access through the same interface, allowing in-system programming and real-time logic analyzer integration during development.
What power supplies are required for XC7A50T-2CSG325C operation?
The XC7A50T-2CSG325C requires three primary supplies: VCCINT (1.0 V ±3%), VCCAUX (1.8 V), and VCCO (configurable per I/O bank from 1.2 V to 3.3 V). Each supply must meet transient current demands and noise specifications outlined in the Xilinx UG475 documentation for reliable operation.
Can XC7A50T-2CSG325C be used in space-constrained PCB layouts?
Yes, the XC7A50T-2CSG325C uses a compact 15×15 mm CSG325 package with 0.8 mm pitch and an exposed thermal pad. Its flip-chip construction minimizes package height and improves thermal transfer, making it suitable for dense industrial and medical PCBs where board area and thermal management are critical.
Is XC7A50T-2CSG325C compatible with Vivado Design Suite?
Yes, the XC7A50T-2CSG325C is fully supported by Xilinx Vivado Design Suite 2018.2 and later versions. Vivado provides synthesis, implementation, simulation, and bitstream generation specifically validated for this device, including timing analysis for its -2 speed grade and CSG325 package model.
XC7A50T-2CSG325C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A50T-2CSG325C FAQ
1.How can I place an order for XC7A50T-2CSG325C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-2CSG325C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-2CSG325C reliable?
The price and inventory of XC7A50T-2CSG325C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-2CSG325C is usually 5 days.
3.What payment methods are accepted for XC7A50T-2CSG325C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-2CSG325C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-2CSG325C?
XC7A50T-2CSG325C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-2CSG325C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-2CSG325C?
For technical support, including XC7A50T-2CSG325C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-2CSG325C requirements.
6.How does Aetrix verify that XC7A50T-2CSG325C is sourced from the original manufacturer or authorized distributors?
All XC7A50T-2CSG325C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-2CSG325C meets industry standards.
7.What is the process for return or replacement of XC7A50T-2CSG325C?
All XC7A50T-2CSG325C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-2CSG325C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-2CSG325C part is unused and in its original packaging.
Return procedure for XC7A50T-2CSG325C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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