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AMD XC7A50T-2CSG325I
- Part No.:
- XC7A50T-2CSG325I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A50T-2CSG325I.pdf
- Description:
- IC FPGA 150 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,015
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Product details
Overview
XC7A50T-2CSG325I from AMD (formerly Xilinx) is a Kintex-7 family FPGA with 49,600 logic cells, 285 I/O pins, and 2.5 Gbps transceiver capability in a 324-pin CSG325 package. It integrates Block RAM, DSP slices, and clock management tiles for high-performance embedded vision and industrial control applications.
For engineers reviewing the XC7A50T-2CSG325I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2–3.3 V), -2 speed grade timing margin, and CSG325 thermal/mechanical compatibility with existing PCB footprints.
Technical Context
The XC7A50T-2CSG325I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 18×25 multiplier DSP48E1 slices, and integrated Clock Management Tiles (CMT) containing PLLs and MMCMs. It supports SelectIO standards including LVCMOS, LVDS, and SSTL across its 285 user I/Os.
Its transceivers operate at up to 2.5 Gbps with built-in 8B/10B encoding and elastic buffers, enabling compliance with PCIe Gen1, Gigabit Ethernet, and CPRI protocols without external PHYs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| I/O Pins | 285 - user-configurable bidirectional pins supporting multiple I/O standards and voltage levels |
| Transceiver Speed | 2.5 Gbps - maximum line rate per GTPE2 transceiver channel, sufficient for PCIe Gen1 x1 and SGMII |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade, with tighter setup/hold margins |
| Package | CSG325 - 324-ball fine-pitch CSPBGA, 15×15 mm, 0.8 mm pitch, RoHS-compliant, with thermal pad |
| Block RAM | 2,520 kbit - distributed as 36 Kb BRAM primitives usable as dual-port memory or FIFO buffers |
| DSP Slices | 220 - dedicated 25×18 multiplier-accumulator units optimized for filtering and math-intensive algorithms |
Pinout & Package
The XC7A50T-2CSG325I is housed in a 324-ball CSG325 CSPBGA package with exposed thermal pad, designed for thermal dissipation in industrial temperature range (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and transceivers; shared with I/O banks |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3V supply for Bank 0 I/Os; sets voltage standard for all pins in that bank |
| M0–M2 | Configuration mode select | Three-pin strap determining boot source (e.g., SPI flash, BPI, JTAG) during power-on reset |
| CCLK | Configuration clock | Output-only clock driving external PROM or used as free-running clock source post-configuration |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two MMCMs and one PLL per device enable precise clock synthesis, phase alignment, and jitter reduction across multiple domains |
| SelectIO Technology | Support for 21 I/O standards including LVDS, TMDS, and HSTL allows direct interface to sensors, displays, and FPGAs without level shifters |
| PCIe Gen1 Endpoint | Built-in hard IP supports endpoint configuration with minimal logic resource usage and no external controller required |
| Partial Reconfiguration | Enables dynamic module swapping in-system without full reconfiguration, reducing downtime in mission-critical systems |
| Industrial Temperature Range | Qualified for –40°C to +100°C operation, supporting deployment in factory automation and outdoor infrastructure |
Applications
| Industrial Motor Control | Embedded Vision System |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis synchronization and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA fabric executes custom PWM generation, position interpolation, and safety monitoring logic with sub-microsecond latency. Use Value: XC7A50T-2CSG325I delivers deterministic timing and parallel I/O handling for simultaneous analog/digital sensor acquisition and motor drive command output. | Use Scenario: High-speed image preprocessing pipeline in smart cameras for defect detection on production lines. IC Role / Device Role / Timing Role: XC7A50T-2CSG325I acts as real-time pixel processor-performing Bayer demosaicing, noise reduction, and edge enhancement before CPU offload. Use Value: On-chip DSP slices and BRAM enable 60+ FPS 1080p processing with <500 ns pipeline latency and zero frame buffering overhead. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: Digital backend for ultrasound beamforming modules requiring precise time-aligned ADC sample capture and FIR filtering. IC Role / Device Role / Timing Role: XC7A50T-2CSG325I serves as synchronized data concentrator and digital signal conditioner between 128-channel ADC array and host interface. Use Value: XC7A50T-2CSG325I provides deterministic 100 MHz sampling clock distribution and 220 DSP slices for real-time 128-tap FIR filtering per channel. | Use Scenario: Modular signal generator with arbitrary waveform synthesis and high-fidelity analog output control. IC Role / Device Role / Timing Role: XC7A50T-2CSG325I implements DDS core, trigger sequencer, and DAC interface logic with jitter-controlled clocking. Use Value: Integrated MMCMs achieve <1 ps RMS jitter on DAC sampling clocks, meeting ENOB >14-bit requirements for precision test equipment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A35T-2CSG325I | Fewer logic cells (33,280), reduced DSP slices (160), same package and speed grade | Suitable for lower gate-count designs with identical thermal and board layout constraints | Select when design fits within 35T resources and cost optimization is prioritized over future scalability |
| XC7A75T-2CSG325I | Higher logic capacity (74,400 cells), more DSP slices (340), identical CSG325 footprint and thermal profile | Required for complex video pipelines or multi-protocol bridging where 50T resources are insufficient | Choose when additional logic density and arithmetic throughput are needed without changing PCB or cooling design |
Compared with XC7A35T-2CSG325I and XC7A75T-2CSG325I, the XC7A50T-2CSG325I offers balanced logic density, I/O count, and DSP resources-making it optimal for mid-tier industrial controllers and vision systems where scalability and cost must coexist.
Availability
XC7A50T-2CSG325I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, and medical imaging interfaces requiring stable component supply across extended product lifecycles.
Supply support for XC7A50T-2CSG325I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Kintex-7 family-including XC7A50T-2CSG325I-is engineered for cost-sensitive, high-performance applications demanding logic density, transceiver bandwidth, and power efficiency in industrial and aerospace environments.
FAQ
What is the operating temperature range for XC7A50T-2CSG325I?
The XC7A50T-2CSG325I is rated for industrial temperature operation from –40°C to +100°C. This range is validated per AMD's qualification standards and applies to the full CSG325 package variant. Thermal performance depends on proper PCB layout, copper pour, and airflow; the exposed thermal pad must be soldered to a solid ground plane for reliable operation at maximum junction temperature.
Does XC7A50T-2CSG325I support PCIe Gen1 endpoint functionality?
Yes, XC7A50T-2CSG325I includes hard IP blocks for PCIe Gen1 x1 endpoint operation. It supports link training, configuration space access, and memory-mapped I/O without consuming logic resources. The transceivers meet PCIe Gen1 electrical specifications, and reference clock input is routed through dedicated pins compatible with 100 MHz differential sources.
Can XC7A50T-2CSG325I be configured via SPI flash?
Yes, XC7A50T-2CSG325I supports master SPI configuration mode using on-chip startup circuitry. When M0–M2 pins are set to 001, the FPGA automatically reads bitstream from a standard quad-SPI flash (e.g., Micron MT25QL) connected to dedicated configuration pins (D0–D3, CLK, HOLD#, WP#). Configuration occurs within ~100 ms after power stabilization.
What I/O standards are supported by XC7A50T-2CSG325I?
XC7A50T-2CSG325I supports 21 SelectIO standards including LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, TMDS, HSTL, SSTL, and Differential Signaling. Each I/O bank is independently powered, allowing mixed-voltage operation. Termination resistors (up to 50 Ω) can be enabled per-pin for source-series or parallel termination.
Is partial reconfiguration supported on XC7A50T-2CSG325I?
Yes, XC7A50T-2CSG325I fully supports partial reconfiguration using AMD Vivado tools. Dynamic module swapping is implemented via ICAP (Internal Configuration Access Port) and frame-based bitstream updates. Verified use cases include runtime filter coefficient updates in DSP pipelines and protocol stack switching in communication interfaces-all without disrupting active logic outside the reconfigured region.
XC7A50T-2CSG325I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A50T-2CSG325I FAQ
1.How can I place an order for XC7A50T-2CSG325I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-2CSG325I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-2CSG325I reliable?
The price and inventory of XC7A50T-2CSG325I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-2CSG325I is usually 5 days.
3.What payment methods are accepted for XC7A50T-2CSG325I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-2CSG325I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-2CSG325I?
XC7A50T-2CSG325I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-2CSG325I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-2CSG325I?
For technical support, including XC7A50T-2CSG325I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-2CSG325I requirements.
6.How does Aetrix verify that XC7A50T-2CSG325I is sourced from the original manufacturer or authorized distributors?
All XC7A50T-2CSG325I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-2CSG325I meets industry standards.
7.What is the process for return or replacement of XC7A50T-2CSG325I?
All XC7A50T-2CSG325I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-2CSG325I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-2CSG325I part is unused and in its original packaging.
Return procedure for XC7A50T-2CSG325I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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