My Inquiry
My Account
AMD XC7A50T-2FGG484I
- Part No.:
- XC7A50T-2FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC7A50T-2FGG484I.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:520
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7A50T-2FGG484I from AMD is a Kintex-7 FPGA with 49,600 logic cells, 2.55 Gbps transceiver capability, and -2 speed grade operating at industrial temperature range (-40°C to +100°C). It integrates Block RAM, DSP slices, and clock management tiles for high-performance embedded vision and industrial control applications.
For engineers reviewing the XC7A50T-2FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (285 user I/Os), transceiver compliance (PCIe Gen2, SATA, CPRI), power supply sequencing requirements, and thermal design margin for industrial ambient conditions.
Technical Context
The XC7A50T-2FGG484I implements a 28 nm HKMG process architecture with integrated SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS signaling. Its clocking system includes two MMCMs and one PLL per bank, enabling precise phase alignment across multiple I/O standards.
It supports partial reconfiguration via ICAP and configuration through SPIx4, BPI, or JTAG. The device includes 240 KB of total Block RAM, 220 DSP48E1 slices, and 24 transceiver lanes compliant with PCIe Gen2 x4 and Gigabit Ethernet protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - determines maximum combinational and sequential logic capacity for custom IP integration |
| User I/O Pins | 285 - supports high-density interface routing including dual-data-rate memory and parallel video buses |
| Transceiver Speed | 2.55 Gbps - enables PCIe Gen2, SATA II, and CPRI v6.0 physical layer implementation |
| Block RAM | 240 KB - provides on-chip memory for FIFOs, frame buffers, and coefficient storage without external SRAM |
| DSP Slices | 220 - delivers 18×25-bit multiply-accumulate throughput for real-time filtering and FFT processing |
| Speed Grade | -2 - guarantees timing closure at 1.0 V core voltage with 100°C junction temperature operation |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded systems deployment |
Pinout & Package
XC7A50T-2FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 285 user-configurable I/Os distributed across 12 I/O banks. The package supports 0.8 mm ball pitch and requires controlled-impedance PCB stackup for signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0 V ±3% supply for FPGA fabric and CLB logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 1.8 V supply for configuration logic, SelectIO, and clock management circuitry |
| VCCO | I/O Bank Power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support |
| M0–M2 | Configuration Mode Pins | Determine boot source (SPI/BPI/JTAG) and configuration mode during power-up reset |
| CCLK | Configuration Clock | Drives internal configuration shift register; may be driven externally or generated internally |
| INIT_B | Configuration Status | Open-drain active-low signal indicating configuration memory readiness and error state |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset-critical for adaptive radar and protocol-agnostic communication systems |
| Integrated PCI Express Endpoint | Hard IP block supporting Gen2 x4 root port or endpoint operation-reduces soft-logic resource usage and timing closure effort |
| AXI Interconnect Infrastructure | On-die AXI4-compliant interconnect simplifies SoC integration with ARM-based processors and custom accelerators |
| UltraScale-Compatible Toolflow | Uses Vivado Design Suite 2022.2+ for synthesis, place-and-route, and bitstream generation-ensures consistent methodology across Xilinx/AMD FPGA families |
| Industrial Temperature Qualification | Full functionality verified across -40°C to +100°C ambient-eliminates derating calculations for harsh-environment deployments |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction on high-speed camera feeds in factory-floor inspection systems. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, histogram equalization, and edge detection; transceivers stream raw sensor data over Camera Link or CoaXPress. Use Value: 220 DSP slices enable sub-millisecond latency for convolution kernels; 285 I/Os route parallel CMOS sensors and encode output to HDMI or MIPI CSI-2. | Use Scenario: High-precision stimulus generation and response capture in semiconductor wafer probe stations. IC Role / Device Role / Timing Role: XC7A50T-2FGG484I acts as pattern generator and comparator engine, synchronizing multi-channel digital vectors with sub-nanosecond skew. Use Value: -2 speed grade ensures deterministic timing at 400 MHz system clock; MMCMs generate phase-aligned clocks for 32-channel parallel test vectors. |
| Medical Imaging Interface | Defense Radar Signal Processing |
Use Scenario: Bridging ultrasound transducer arrays to host GPU subsystems via PCIe Gen2 x4 in portable diagnostic devices. IC Role / Device Role / Timing Role: Acts as PCIe endpoint and DMA controller, managing burst transfers of beamformed RF data while maintaining real-time interrupt latency. Use Value: Integrated PCIe hard IP reduces logic utilization by 15%; 240 KB Block RAM buffers up to 16 frames of raw echo data before compression. | Use Scenario: Adaptive beamforming and pulse-Doppler processing in ground-based phased-array radar front ends. IC Role / Device Role / Timing Role: Configurable logic implements matched filtering and CFAR detection; transceivers interface with ADC/DACs sampling at 125 MSPS. Use Value: 2.55 Gbps transceivers support JESD204B subclass 1 links; DSP slices execute 1024-point FFTs in under 2 μs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-2FGG484I | 74,900 logic cells, 320 user I/Os, same package and speed grade | Higher gate count supports larger FFT engines and dual-sensor fusion pipelines | Select when >50K LUTs required and board layout allows identical footprint |
| XCKU035-2FFVA676I | Kintex UltraScale architecture, 215K logic cells, 16.3 Gbps transceivers, different package (676-pin FCBGA) | Targets higher bandwidth protocols (PCIe Gen3, 10G Ethernet) and larger algorithmic workloads | Choose for next-generation designs requiring >2× logic density and Gen3+ serial connectivity |
Compared with XC7A50T-2FGG484I, XC7A75T-2FGG484I offers scalable logic headroom within identical thermal and mechanical constraints, while XCKU035-2FFVA676I delivers architectural advancement at the cost of PCB redesign and toolchain migration.
Availability
XC7A50T-2FGG484I is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XC7A50T-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and client markets.
The Kintex-7 family was designed for cost-optimized high-performance applications including wired communications, video processing, and industrial automation where balanced logic, I/O, and transceiver resources are critical.
FAQ
What is the maximum supported transceiver data rate for XC7A50T-2FGG484I?
The XC7A50T-2FGG484I supports transceiver line rates up to 2.55 Gbps per lane. This enables compliance with PCIe Gen2, SATA II, and CPRI v6.0 standards. The transceivers are implemented in the GTP architecture and require proper reference clock sourcing and termination per UG476 specifications. XC7A50T-2FGG484I does not support 5 Gbps or higher protocols such as PCIe Gen3 or USB 3.0.
Does XC7A50T-2FGG484I support partial reconfiguration?
Yes, XC7A50T-2FGG484I supports partial reconfiguration using the ICAP interface and Vivado's PR flow. This allows dynamic swapping of logic modules without resetting the entire device. Configuration memory must be partitioned into static and reconfigurable regions during implementation. XC7A50T-2FGG484I requires careful floorplanning and use of supported primitives like BUFGCE_DIV for clock domain crossing in reconfigurable partitions.
What power supply voltages are required for XC7A50T-2FGG484I operation?
XC7A50T-2FGG484I requires three primary supply rails: VCCINT at 1.0 V ±3%, VCCAUX at 1.8 V ±3%, and bank-specific VCCO ranging from 1.2 V to 3.3 V depending on I/O standard. Each rail has defined sequencing requirements-VCCAUX must be stable before VCCINT, and VCCO must be applied after both. XC7A50T-2FGG484I documentation specifies strict ramp rates and hold times to prevent configuration failure or latch-up.
Is XC7A50T-2FGG484I qualified for industrial temperature operation?
Yes, XC7A50T-2FGG484I is rated for industrial temperature range (-40°C to +100°C) and is fully characterized across this range for timing, voltage, and functionality. The -2 speed grade guarantees timing closure at maximum junction temperature. Thermal design must ensure junction temperature remains ≤100°C under worst-case power dissipation, which varies with logic utilization and I/O activity. XC7A50T-2FGG484I thermal data is provided in DS182.
Which configuration modes are supported by XC7A50T-2FGG484I?
XC7A50T-2FGG484I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. SPIx4 is commonly used for compact flash-based boot, while JTAG is preferred for debugging and programming during development. XC7A50T-2FGG484I also supports fallback configuration and multi-boot via external PROM addressing. All modes require correct initialization timing per UG470.
XC7A50T-2FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC7A50T-2FGG484I FAQ
1.How can I place an order for XC7A50T-2FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-2FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-2FGG484I reliable?
The price and inventory of XC7A50T-2FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-2FGG484I is usually 5 days.
3.What payment methods are accepted for XC7A50T-2FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-2FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-2FGG484I?
XC7A50T-2FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-2FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-2FGG484I?
For technical support, including XC7A50T-2FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-2FGG484I requirements.
6.How does Aetrix verify that XC7A50T-2FGG484I is sourced from the original manufacturer or authorized distributors?
All XC7A50T-2FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-2FGG484I meets industry standards.
7.What is the process for return or replacement of XC7A50T-2FGG484I?
All XC7A50T-2FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-2FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-2FGG484I part is unused and in its original packaging.
Return procedure for XC7A50T-2FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7A50T-2FGG484I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
