AMD XC7A50T-3CPG236E

Overview

XC7A50T-3CPG236E from AMD is a Kintex-7 family FPGA with 49,600 logic cells, 2.55 Gbps transceiver capability, and -3 speed grade for high-performance serial connectivity. It features 285 I/O pins, 2.5 MB of block RAM, and operates at 1.0V core voltage in a 236-pin CP (Chip Scale Package) with 0.8 mm pitch.

For engineers reviewing the XC7A50T-3CPG236E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver data rate, logic density, I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), thermal performance in industrial temperature range (-40°C to +100°C), and configuration interface options (JTAG, SPI, SelectMAP).

Technical Context

The XC7A50T-3CPG236E implements a 28 nm HKMG process architecture with integrated DSP slices (18×25 multiplier-accumulators), clock management tiles (CMT) containing MMCM and PLL blocks, and configurable I/O banks supporting multiple standards including LVDS, SSTL, HSTL, and TMDS. It supports partial reconfiguration and AXI4-compliant interconnects.

Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication available. The device includes dedicated PCIe® Gen2 x4 hard IP block and supports DDR3 memory interfaces up to 800 MHz (1600 Mbps).

Key Specifications

Pinout & Package

XC7A50T-3CPG236E is housed in a 236-ball fine-pitch CSP (CP package) with 0.8 mm ball pitch, designed for compact PCB layouts and thermal efficiency in space-constrained industrial and communications equipment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XC7A50T-3CPG236E, XC7A75T-3CPG236E offers headroom for future feature expansion while maintaining identical footprint and thermal profile; XC7A35T-2CPG236I reduces bill-of-materials cost but sacrifices 33% logic capacity and 13% transceiver bandwidth margin.

Availability

XC7A50T-3CPG236E is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and test equipment requiring stable component supply across long product lifecycles.

Supply support for XC7A50T-3CPG236E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and AI accelerator technologies.

The Kintex-7 family, including XC7A50T-3CPG236E, was engineered for cost-optimized high-performance applications demanding balanced logic density, transceiver bandwidth, and power efficiency in industrial and communications systems.

FAQ

What is the maximum supported DDR3 data rate for XC7A50T-3CPG236E?

The XC7A50T-3CPG236E supports DDR3 memory interfaces up to 800 MHz clock frequency, corresponding to 1600 Mbps data rate. This capability is implemented through dedicated hardware memory controller logic and calibrated I/O timing, enabling reliable operation with standard DDR3 SDRAM components without requiring external PHY devices. The XC7A50T-3CPG236E includes built-in write-leveling and read-leveling calibration sequences.

Does XC7A50T-3CPG236E include a hard PCIe Gen2 endpoint block?

Yes, XC7A50T-3CPG236E integrates a hard PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification Revision 2.1. This dedicated IP eliminates the need for soft-core PCIe implementations, reducing logic utilization and ensuring deterministic timing. The XC7A50T-3CPG236E supports both root complex and endpoint configurations via configuration space registers and BAR mapping.

What configuration modes does XC7A50T-3CPG236E support?

XC7A50T-3CPG236E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7A50T-3CPG236E also supports fallback configuration and dual-boot capability using external flash memory with redundant bitstreams, enhancing field reliability.

Is XC7A50T-3CPG236E qualified for automotive applications?

No, XC7A50T-3CPG236E is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably in harsh thermal environments, it lacks automotive-specific qualification testing, failure-in-time (FIT) reporting, and extended reliability screening required for automotive safety-critical systems. For automotive use, AMD offers Zynq-7000 SoC variants with AEC-Q100 Grade 2 certification.

Can XC7A50T-3CPG236E perform partial reconfiguration?

Yes, XC7A50T-3CPG236E supports partial reconfiguration, allowing dynamic modification of specific logic regions while the rest of the design remains operational. This capability is enabled by the device's hierarchical configuration architecture and verified tools flow in Vivado Design Suite. The XC7A50T-3CPG236E uses frame-based bitstream addressing to isolate reconfigurable partitions without affecting active I/O or clock resources.