AMD XC7A50T-3CSG325E

Overview

XC7A50T-3CSG325E from AMD is a Kintex-7 FPGA with 49,600 logic cells, 2.55 Gbps transceivers, and 285 I/O pins in a 325-pin CSG package. It integrates Block RAM, DSP slices, and clock management tiles for high-performance digital signal processing and embedded control in industrial vision systems.

For engineers reviewing the XC7A50T-3CSG325E datasheet, pinout, applications, or equivalent options, key selection criteria include speed grade (-3), package thermal profile (CSG325E), I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), and transceiver compliance with PCIe Gen2 and SATA Gen2 standards.

Technical Context

The XC7A50T-3CSG325E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 18x25 multipliers, and integrated MMCM/PLL clock generators supporting jitter < 150 fs RMS. It delivers deterministic timing closure for synchronous designs operating up to 640 MHz system clock frequency.

Its SelectIO interface supports single-ended and differential standards including LVDS, TMDS, and HSTL, with programmable slew rate and drive strength per bank. The device includes 24 transceiver quads, each with dedicated TX/RX paths and built-in 8B/10B encoding.

Key Specifications

Pinout & Package

XC7A50T-3CSG325E is housed in a 15×15 mm, 325-ball fine-pitch CSPBGA (CSG325) package with exposed thermal pad and 0.8 mm ball pitch. The package supports reflow soldering per IPC/JEDEC J-STD-020D and meets JEDEC moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital processing applications.

Compared with XC7A50T-3CSG325E, the XC7A75T-3CSG325E offers headroom for future feature expansion while maintaining PCB compatibility, whereas the XC7A35T-3CSG325E reduces bill-of-materials cost where transceiver and logic density are non-critical.

Availability

XC7A50T-3CSG325E is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging acceleration, and automotive ADAS sensor fusion requiring stable component supply across multi-year production cycles.

Supply support for XC7A50T-3CSG325E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies. It acquired Xilinx in 2022 to expand its portfolio of programmable logic devices.

The Kintex-7 family, including XC7A50T-3CSG325E, was designed for high-performance, cost-optimized applications demanding balanced logic density, I/O bandwidth, and transceiver capability in industrial, medical, and test equipment.

FAQ

What is the maximum supported DDR3 memory data rate for XC7A50T-3CSG325E?

The XC7A50T-3CSG325E supports DDR3/DDR3L memory interfaces up to 800 Mbps data rate (400 MHz clock) using its hardened memory controller. This capability is validated across all speed grades and requires proper board-level termination and layout adherence to Xilinx UG470 guidelines. The XC7A50T-3CSG325E achieves this with built-in DQS gating and write-leveling calibration logic.

Does XC7A50T-3CSG325E include hard IP for PCI Express Gen2?

Yes, XC7A50T-3CSG325E integrates a hard PCIe Gen2 endpoint block supporting x1 and x2 configurations. It provides AXI4 streaming and register interfaces, integrated DMA engine, and MSI/MSI-X interrupt support. The XC7A50T-3CSG325E does not require soft-core implementation for basic PCIe functionality, reducing logic utilization and improving timing predictability.

What is the thermal pad specification for the CSG325 package of XC7A50T-3CSG325E?

The XC7A50T-3CSG325E CSG325 package features an exposed thermal pad measuring 11.0 × 11.0 mm centered on the bottom surface. It must be soldered to a dedicated copper thermal plane on the PCB with ≥60% solder coverage. The XC7A50T-3CSG325E datasheet specifies 1.2 W maximum power dissipation under typical industrial ambient conditions with appropriate heatsinking.

Can XC7A50T-3CSG325E operate with mixed I/O voltage standards on different banks?

Yes, XC7A50T-3CSG325E supports independent VCCO supplies per I/O bank, enabling simultaneous use of 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, and 3.3V signaling standards. Each bank's voltage is set by its VCCO pin, and compatible standards (e.g., LVCMOS, SSTL, HSTL) are selected via configuration registers. The XC7A50T-3CSG325E requires strict isolation between adjacent banks with differing VCCO values.

What configuration modes are supported by XC7A50T-3CSG325E?

XC7A50T-3CSG325E supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up, with SPI being the most common for compact, single-flash deployment. The XC7A50T-3CSG325E also supports fallback configuration and multi-boot from dual SPI flash devices using ICAP interface.