AMD XC7A50T-3FGG484E
- Part No.:
- XC7A50T-3FGG484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC7A50T-3FGG484E.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,321
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Product details
Overview
XC7A50T-3FGG484E from AMD is a Kintex-7 FPGA with 49,600 logic cells, 2.55 Gbps transceiver capability, and -3 speed grade operating at 1.0V core voltage. It integrates 285 DSP slices, 2.5 MB of block RAM, and supports PCIe Gen2 x4 endpoint configuration in industrial temperature range (-40°C to +100°C).
For engineers reviewing the XC7A50T-3FGG484E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver compliance (ANSI TIA/EIA-644-A), I/O bank voltage flexibility (1.2V–3.3V), and support for DDR3 memory interfaces up to 800 MHz.
Technical Context
The XC7A50T-3FGG484E implements a high-performance, low-power FPGA architecture based on 28 nm HKMG process technology. It features SelectIO™ technology with programmable I/O standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, TMDS, RSDS).
Its clocking system includes six MMCMs and twelve PLLs for precise clock synthesis and jitter reduction. The device supports partial reconfiguration and AXI4-compliant interconnect for heterogeneous system integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - usable LUT-based fabric for combinational and sequential logic implementation |
| Block RAM | 2.5 MB - configurable as true dual-port RAM, FIFO, or ROM for on-chip data buffering |
| DSP Slices | 285 - 25×18-bit multiplier + 48-bit accumulator per slice for high-throughput arithmetic |
| Transceiver Speed | 2.55 Gbps - supports serial protocols including SATA, DisplayPort, and CPRI |
| I/O Pins | 250 - user-configurable single-ended and differential I/O across 12 banks |
| Speed Grade | -3 - highest performance grade for this family, enabling maximum clock frequencies |
| Operating Temp | -40°C to +100°C - qualified for extended industrial applications without derating |
Pinout & Package
XC7A50T-3FGG484E is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 250 user I/O pins distributed across 12 I/O banks. The package supports thermal dissipation up to 12 W under typical operation and complies with JEDEC MO-271AB mechanical standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% required for CLB, BRAM, and DSP logic operation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration circuitry, clock management, and transceivers |
| VCCO_0 | I/O bank power | Configurable 1.2V–3.3V supply for Bank 0 I/O standards and voltage translation |
| M0–M2 | Configuration mode pins | Set boot mode (e.g., Master SPI, Slave SelectMAP) during power-up |
| INIT_B | Configuration status | Active-low open-drain signal indicating configuration status and error detection |
| CCLK | Configuration clock | Input clock for master SPI configuration; also used for JTAG boundary scan |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic updates without full device reset, reducing system downtime in real-time applications |
| AXI4-Compliant Interconnect | Provides standardized, scalable, and pipelined interface for integrating soft processors and IP cores |
| SelectIO™ Technology | Supports mixed-voltage I/O banks with programmable drive strength and slew rate control per pin group |
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4 lane configurations with integrated DMA and MSI interrupt handling |
| MMCM/PLL Clock Management | Six MMCMs and twelve PLLs enable sub-picosecond phase alignment and frequency synthesis across multiple domains |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time image preprocessing pipeline in high-speed inspection systems using CMOS sensors. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, histogram equalization, and ROI extraction before transmission to host CPU. Use Value: 285 DSP slices accelerate convolution operations; 2.55 Gbps transceivers enable direct connection to Camera Link HS or CoaXPress interfaces. | Use Scenario: Digital backend for ultrasound beamforming and DICOM data packaging in portable imaging devices. IC Role / Device Role / Timing Role: XC7A50T-3FGG484E implements time-aligned channel processing and PCIe Gen2 x4 host interface for DICOM export. Use Value: -3 speed grade ensures deterministic timing closure for 128-channel beamformer logic; 2.5 MB block RAM buffers raw RF data streams. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: ARINC 429/664 (AFDX) gateway consolidating sensor and actuator data in flight control subsystems. IC Role / Device Role / Timing Role: Configurable I/O banks interface with legacy avionics buses while PCIe endpoint connects to central processing unit. Use Value: Extended temperature rating (-40°C to +100°C) meets DO-254 environmental requirements; SelectIO™ supports 28 V tolerant inputs for discrete monitoring. | Use Scenario: Modular signal generator with multi-channel arbitrary waveform synthesis and real-time pattern triggering. IC Role / Device Role / Timing Role: XC7A50T-3FGG484E hosts waveform generation engine, trigger sequencer, and USB 3.0/PCIe host interface. Use Value: 49,600 logic cells accommodate complex state machines and interpolation algorithms; 250 I/O pins support parallel DAC control and external sync signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-3FGG484E | 75,000 logic cells, 330 DSP slices, same package and speed grade | Higher gate count enables larger embedded processor subsystems or more parallel signal paths | Select when additional fabric resources are needed without changing PCB layout or thermal design |
| XCKU035-2FFVA676E | Kintex UltraScale architecture, 280K logic cells, 16.3 Gbps transceivers, different package (676-pin FCBGA) | Targets higher bandwidth protocols (PCIe Gen3, 10G Ethernet) and advanced DSP workloads | Choose for next-generation designs requiring >2× logic density and Gen3+ serial connectivity |
Compared with XC7A75T-3FGG484E and XCKU035-2FFVA676E, the XC7A50T-3FGG484E delivers optimal balance of logic capacity, transceiver performance, and thermal footprint for mid-tier industrial and medical edge systems where cost, power, and board space are constrained.
Availability
XC7A50T-3FGG484E is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, avionics data concentrators, and test & measurement instrumentation requiring stable component supply and long-term lifecycle support.
Supply support for XC7A50T-3FGG484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, AI acceleration, and high-performance processing.
The Kintex-7 family, including XC7A50T-3FGG484E, was designed for cost-optimized, high-performance applications in industrial automation, medical equipment, and aerospace systems requiring reliable programmable logic with integrated transceivers and memory controllers.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7A50T-3FGG484E?
The XC7A50T-3FGG484E supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its MIG (Memory Interface Generator) IP core. This capability is verified in Xilinx UG586 v1.12 and applies directly to the XC7A50T-3FGG484E's dedicated memory controller hard blocks and I/O banks configured for SSTL15.
Does XC7A50T-3FGG484E include built-in PCIe Gen2 endpoint functionality?
Yes, XC7A50T-3FGG484E integrates a hard PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification v2.1. It includes integrated DMA engines, MSI/MSI-X interrupt support, and configuration space registers accessible via AXI4-Lite, all implemented in dedicated silicon rather than soft logic.
What is the I/O voltage range supported by XC7A50T-3FGG484E?
The XC7A50T-3FGG484E supports I/O voltages from 1.2V to 3.3V across its 12 configurable I/O banks. Each bank operates independently, allowing mixed-voltage operation-e.g., Bank 0 at 1.8V for LVDS and Bank 1 at 3.3V for LVCMOS33-without level-shifting components.
Is XC7A50T-3FGG484E qualified for extended temperature operation?
Yes, XC7A50T-3FGG484E is rated for industrial temperature range (-40°C to +100°C) and is marked with the "E" suffix denoting extended temperature qualification. This rating is confirmed in Xilinx DS182 v2.6 and applies to the full functional specification without derating.
How many transceiver quads does XC7A50T-3FGG484E contain?
The XC7A50T-3FGG484E contains four GTPE2 transceiver quads, providing a total of 16 transceiver lanes. Each quad supports data rates up to 2.55 Gbps and can be configured for protocols including SATA, CPRI, and DisplayPort, as documented in Xilinx UG476 v1.13.
XC7A50T-3FGG484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC7A50T-3FGG484E FAQ
1.How can I place an order for XC7A50T-3FGG484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-3FGG484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-3FGG484E reliable?
The price and inventory of XC7A50T-3FGG484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-3FGG484E is usually 5 days.
3.What payment methods are accepted for XC7A50T-3FGG484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-3FGG484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-3FGG484E?
XC7A50T-3FGG484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-3FGG484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-3FGG484E?
For technical support, including XC7A50T-3FGG484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-3FGG484E requirements.
6.How does Aetrix verify that XC7A50T-3FGG484E is sourced from the original manufacturer or authorized distributors?
All XC7A50T-3FGG484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-3FGG484E meets industry standards.
7.What is the process for return or replacement of XC7A50T-3FGG484E?
All XC7A50T-3FGG484E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-3FGG484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-3FGG484E part is unused and in its original packaging.
Return procedure for XC7A50T-3FGG484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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