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AMD XC7A50T-L2CSG324E
- Part No.:
- XC7A50T-L2CSG324E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A50T-L2CSG324E.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,095
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Product details
Overview
XC7A50T-L2CSG324E from AMD is a Kintex-7 FPGA with 49,600 logic cells, 2.55 Mb of block RAM, 240 DSP slices, and 324-pin CSPBGA package rated for -2L speed grade and extended temperature range (-40°C to +100°C). It serves as a reconfigurable system-on-chip in high-throughput industrial vision and real-time motor control systems.
For engineers reviewing the XC7A50T-L2CSG324E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver line rate (up to 6.6 Gb/s), and configuration interface options (SPIx4, SelectMAP, JTAG).
Technical Context
The XC7A50T-L2CSG324E implements a fully programmable architecture based on 28 nm HKMG process technology, integrating CLBs, I/O banks with independent VCCO, and multi-gigabit transceivers compliant with PCIe Gen2, SATA, and CPRI standards. Its configuration logic supports dual-boot via SPI flash and fallback recovery.
It features dedicated clock management tiles (CMTs) with MMCM and PLL blocks supporting jitter attenuation and frequency synthesis across 10–650 MHz input ranges, and includes integrated XADC for analog monitoring of on-board voltages and temperatures.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 2.55 Mb - enables large on-die data buffering and FIFO construction without external memory |
| DSP Slices | 240 - supports parallel multiply-accumulate operations for real-time filtering and FFT processing |
| Transceiver Line Rate | 6.6 Gb/s - enables direct interfacing with 10G Ethernet PHYs and high-speed ADC/DACs |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - allows mixed-voltage board-level integration with FPGAs, processors, and sensors |
| Configuration Interface | SPIx4, SelectMAP, JTAG - provides flexible boot options including remote field updates and boundary-scan validation |
Pinout & Package
XC7A50T-L2CSG324E uses a 324-pin Chip Scale Package Ball Grid Array (CSPBGA) with 1.0 mm pitch, 15×15 mm body size, and thermal pad exposed on underside for enhanced heat dissipation in compact industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.0V core supply input requiring low-noise regulation and local decoupling |
| A14 | VCCAUX | 1.8V auxiliary supply for configuration, clocking, and transceiver reference circuits |
| M20 | VCCO_13 | I/O bank 13 output voltage setting (1.2V–3.3V configurable per bank) |
| P15 | INIT_B | Open-drain status signal indicating configuration completion or error condition |
| T13 | CCLK | Configuration clock input for master serial mode; driven by external controller or internal oscillator |
| R14 | DONE | Open-drain output confirming successful bitstream loading and device readiness |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG process | Enables higher logic density and lower dynamic power versus 40 nm FPGAs in same family |
| Integrated XADC | Provides dual 12-bit 1 MSPS ADC channels for real-time monitoring of internal die temperature and supply rails |
| PCIe Gen2 x4 endpoint | Supports direct host CPU communication without bridge ICs in embedded computing applications |
| MMCM + PLL clocking | Delivers sub-100 fs jitter performance and phase alignment across multiple clock domains |
| AXI4-compliant interconnect | Enables seamless integration with ARM Cortex-A9 processor subsystems in Zynq-7000 compatible designs |
Applications
| Industrial Machine Vision | Real-Time Motor Control |
|---|---|
Use Scenario: High-speed image acquisition and preprocessing on automated inspection lines with sub-millisecond latency requirements. IC Role / Device Role / Timing Role: Configurable pixel pipeline accelerator implementing Bayer demosaicing, histogram equalization, and edge detection in hardware. Use Value: Reduces host CPU load by offloading compute-intensive vision algorithms while maintaining deterministic timing via dedicated clock domains. | Use Scenario: Closed-loop servo drive control in CNC machines with synchronized PWM generation and current feedback sampling. IC Role / Device Role / Timing Role: Real-time motion controller generating 20 kHz three-phase PWM with <100 ns dead-time insertion and simultaneous ADC capture triggering. Use Value: Achieves <±0.1% torque ripple through precise timing correlation between PWM edges and current sampling windows. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Interfacing ultrasound transducer arrays to digital beamformers using high-speed LVDS links and time-aligned sampling. IC Role / Device Role / Timing Role: Protocol translator and timing synchronizer bridging analog front-end ASICs to FPGA-based beamforming engines. Use Value: Maintains picosecond-level channel-to-channel skew control across 64+ LVDS lanes for coherent echo signal reconstruction. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers with deterministic latency guarantees. IC Role / Device Role / Timing Role: Deterministic packet scheduler and bus controller managing time-triggered communication windows across heterogeneous avionics buses. Use Value: Ensures worst-case end-to-end latency ≤ 50 µs for critical flight actuator commands under full bus load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-L2CSG324I | 74,200 logic cells, 3.25 Mb block RAM, same package and speed grade but higher resource count | Required when design exceeds XC7A50T-L2CSG324E routing capacity or needs additional DSP slices for complex filter banks | Select if future scalability or increased algorithmic complexity justifies higher BOM cost and power consumption |
| XCKU035-L1FFVA676E | Kintex UltraScale architecture, 242K logic cells, 16.5 Gb/s transceivers, larger 676-pin flip-chip BGA | Needed for PCIe Gen3 x8, 100G Ethernet MAC, or multi-gigasample ADC interfaces beyond Gen2 limits | Choose only when migrating to higher bandwidth protocols or requiring hardened IP not available in 7-series |
Compared with XC7A75T-L2CSG324I and XCKU035-L1FFVA676E, the XC7A50T-L2CSG324E delivers optimal balance of logic density, transceiver performance, and thermal footprint for mid-range industrial control and imaging applications where Gen2 transceivers and ~50K LUTs meet functional requirements without over-provisioning.
Availability
XC7A50T-L2CSG324E is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and avionics subsystems requiring stable component supply across extended temperature operation and long production lifecycles.
Supply support for XC7A50T-L2CSG324E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, memory, and I/O resources - especially in industrial control, video processing, and wired communications infrastructure.
FAQ
What is the operating temperature range for XC7A50T-L2CSG324E?
The XC7A50T-L2CSG324E is specified for extended industrial temperature operation from –40°C to +100°C ambient, validated across all speed grades and I/O standards. This rating applies to the full 324-ball CSPBGA package and supports deployment in sealed enclosures without forced air cooling when thermal design meets AMD's recommended PCB copper area and via count per power rail.
Does XC7A50T-L2CSG324E support partial reconfiguration?
Yes, the XC7A50T-L2CSG324E supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module swapping without resetting the entire device. This capability requires use of the PR-enabled bitstream flow and adherence to frame-based placement constraints. The XC7A50T-L2CSG324E maintains full configuration security and timing closure during partial bitstream loads.
What configuration modes does XC7A50T-L2CSG324E support?
The XC7A50T-L2CSG324E supports Master SPI, Slave SelectMAP, JTAG, and Boundary Scan configuration modes. Master SPI mode uses internal oscillator to drive CCLK and supports up to 16 MB flash devices with x4 data width. All modes retain full access to the ICAP interface for runtime reconfiguration and debug visibility.
Can XC7A50T-L2CSG324E interface directly with DDR3 memory?
Yes, the XC7A50T-L2CSG324E includes dedicated DDR3 memory controller IP with support for data rates up to 800 Mbps per pin (DDR3-1600) across up to eight banks. It implements full DQS gating, write leveling, and read leveling calibration sequences, and is validated with JEDEC-compliant DDR3 SDRAM components in the 324-ball CSPBGA footprint.
Is XC7A50T-L2CSG324E pin-compatible with other Kintex-7 devices in the same package?
No, XC7A50T-L2CSG324E is not pin-compatible with other Kintex-7 devices in the 324-ball CSPBGA package. While mechanical footprint and ball pitch match, power rail assignments (VCCINT, VCCAUX, VCCO), configuration pin functions, and transceiver location differ across density variants. Migration requires PCB redesign and I/O constraint revalidation even within the same package code.
XC7A50T-L2CSG324E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A50T-L2CSG324E FAQ
1.How can I place an order for XC7A50T-L2CSG324E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-L2CSG324E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-L2CSG324E reliable?
The price and inventory of XC7A50T-L2CSG324E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-L2CSG324E is usually 5 days.
3.What payment methods are accepted for XC7A50T-L2CSG324E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-L2CSG324E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-L2CSG324E?
XC7A50T-L2CSG324E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-L2CSG324E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-L2CSG324E?
For technical support, including XC7A50T-L2CSG324E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-L2CSG324E requirements.
6.How does Aetrix verify that XC7A50T-L2CSG324E is sourced from the original manufacturer or authorized distributors?
All XC7A50T-L2CSG324E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-L2CSG324E meets industry standards.
7.What is the process for return or replacement of XC7A50T-L2CSG324E?
All XC7A50T-L2CSG324E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-L2CSG324E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-L2CSG324E part is unused and in its original packaging.
Return procedure for XC7A50T-L2CSG324E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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