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AMD XC7A50T-L2FGG484E
- Part No.:
- XC7A50T-L2FGG484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC7A50T-L2FGG484E.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,019
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Product details
Overview
XC7A50T-L2FGG484E from AMD is a Kintex-7 FPGA with 49,600 logic cells, 2.55 Mb of block RAM, 240 DSP slices, and 24 transceivers supporting up to 6.6 Gb/s. It features a -2 speed grade, LVDS I/O, and is packaged in a 484-pin FCBGA with 250 user I/Os. It is used in high-performance industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7A50T-L2FGG484E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver data rate, logic cell count, I/O voltage support (1.2 V/1.35 V/1.5 V/1.8 V/2.5 V/3.3 V), thermal performance in FCBGA-484, and configuration interface compatibility (SPIx4, JTAG).
Technical Context
The XC7A50T-L2FGG484E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and SelectIO technology supporting multiple I/O standards. It integrates PCIe Gen2 x4 endpoint capability and supports partial reconfiguration.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device includes clock management tiles (CMT) with MMCM and PLL blocks for precise clock synthesis and phase alignment across high-speed interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 2.55 Mb - supports on-chip buffering, FIFOs, and data storage without external memory |
| DSP Slices | 240 - enables parallel multiply-accumulate operations for filtering, FFT, and math-intensive algorithms |
| Transceivers | 24 × 6.6 Gb/s - provides serial connectivity for JESD204B, CPRI, and Gigabit Ethernet links |
| User I/O Pins | 250 - supports multi-standard I/O banks with programmable drive strength and termination |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under same conditions |
| Package | FCBGA-484 - 23 mm × 23 mm footprint with 0.8 mm ball pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
XC7A50T-L2FGG484E is housed in a 484-ball Fine-Pitch Column Grid Array (FCBGA) package with 250 user-configurable I/Os distributed across 12 I/O banks. Power and ground balls are arranged per Xilinx (now AMD) Kintex-7 PCB layout guidelines to minimize noise and ensure stable core and I/O voltage delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M1 | CONFIG_DONE | Open-drain output indicating successful configuration completion; pulled high externally to enable downstream logic |
| P17 | INIT_B | Active-low open-drain status signal reflecting internal initialization state during power-up or reconfiguration |
| R15 | CCLK | Configuration clock input for Master SPI mode; drives internal configuration logic at up to 50 MHz |
| T14 | M0–M2 | Mode pins selecting configuration source (JTAG, SPI, BPI, or slave modes); sampled at power-on reset |
| V16 | PROGRAM_B | Active-low asynchronous input initiating full reconfiguration and clearing configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x4 Endpoint | Integrated hard IP enabling direct host CPU communication without external bridge IC or firmware overhead |
| Partial Reconfiguration | Allows dynamic swapping of logic modules at runtime, reducing system downtime and enabling adaptive functionality |
| SEU Detection & Correction | On-die circuitry detects and corrects single-event upsets in configuration memory, improving reliability in radiation-prone environments |
| Bitstream Encryption | AES-256 encryption protects intellectual property by preventing unauthorized readback or cloning of programmed logic |
| Multi-Voltage I/O Banks | Each of 12 I/O banks independently supports 1.2 V to 3.3 V signaling, simplifying mixed-voltage board design |
Applications
| Industrial Imaging Systems | Medical Ultrasound Beamforming |
|---|---|
Use Scenario: Real-time image acquisition and preprocessing from high-resolution CMOS/CCD sensors in factory automation cameras. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, histogram equalization, and ROI extraction before sending compressed frames to host processor. Use Value: 240 DSP slices accelerate convolution kernels; 24 transceivers handle multi-lane Camera Link or CoaXPress interfaces at full bandwidth. | Use Scenario: Digital beam synthesis and dynamic focusing in portable ultrasound machines with phased-array probes. IC Role / Device Role / Timing Role: XC7A50T-L2FGG484E executes time-aligned delay calculations and FIR filtering across 128+ channels in real time. Use Value: -2 speed grade ensures deterministic latency for sub-microsecond channel synchronization; 2.55 Mb block RAM buffers raw echo data per frame. |
| Software-Defined Radio (SDR) | Test & Measurement Equipment |
Use Scenario: Wideband RF signal generation and analysis in field-deployable spectrum analyzers and signal injectors. IC Role / Device Role / Timing Role: Hosts digital up/down converters, modulation/demodulation engines, and protocol stack offload for LTE/5G NR waveforms. Use Value: 24 transceivers interface directly with RFICs via JESD204B subclass 1; 49,600 logic cells accommodate multi-standard waveform libraries. | Use Scenario: High-precision digital oscilloscopes and arbitrary waveform generators requiring deep memory and low-jitter sampling control. IC Role / Device Role / Timing Role: Manages ADC/DAC timing, trigger logic, real-time waveform math, and PCIe Gen2 x4 data streaming to host PC. Use Value: Integrated PCIe endpoint eliminates external switch logic; MMCM-based clocking achieves <1 ps RMS jitter for 1 GS/s sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-L2FGG484I | 74,000 logic cells, 3.25 Mb block RAM, same package and speed grade | Higher gate count supports larger algorithm partitions and dual-domain processing | Select when additional logic density or memory is required without changing PCB layout |
| XCKU035-2FFVA676E | Kintex UltraScale architecture, 225K logic cells, 16.3 Mb BRAM, 20 GTY transceivers (16.3 Gb/s) | Targets next-generation protocols (PCIe Gen3, 100G Ethernet) and higher throughput workloads | Choose for migration paths requiring >2× logic capacity and >2× transceiver speed, accepting new package and toolchain requirements |
Compared with XC7A75T-L2FGG484I and XCKU035-2FFVA676E, the XC7A50T-L2FGG484E delivers optimal balance of cost, power, and performance for mid-scale embedded vision and communications systems where transceiver count and logic density are constrained but deterministic timing and proven qualification are critical.
Availability
XC7A50T-L2FGG484E is available at Aetrix Electronics and suitable for industrial imaging systems, medical ultrasound equipment, and software-defined radio platforms requiring stable component supply over extended production lifecycles.
Supply support for XC7A50T-L2FGG484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering high-performance computing, graphics, and adaptive SoC solutions, with FPGA technology originating from its acquisition of Xilinx in 2022.
The Kintex-7 family was designed for cost-optimized high-performance applications including wired communications, video processing, and military/aerospace systems requiring reliable operation and broad I/O flexibility.
FAQ
What is the maximum supported transceiver data rate for XC7A50T-L2FGG484E?
The XC7A50T-L2FGG484E supports transceiver line rates up to 6.6 Gb/s per channel, compliant with JESD204B, CPRI, and SATA Gen2 standards. This rate is guaranteed under -2 speed grade conditions with proper reference clock jitter and PCB interconnect design meeting Xilinx (AMD) IBIS-AMI modeling requirements. The XC7A50T-L2FGG484E does not support rates beyond 6.6 Gb/s.
Does XC7A50T-L2FGG484E support partial reconfiguration?
Yes, the XC7A50T-L2FGG484E supports partial reconfiguration through Vivado Design Suite tools, allowing dynamic replacement of logical modules without resetting the entire device. This feature requires specific HDL coding practices, floorplanning constraints, and configuration memory partitioning. The XC7A50T-L2FGG484E implements the necessary configuration access ports and control logic to enable this capability.
What configuration modes are supported by XC7A50T-L2FGG484E?
The XC7A50T-L2FGG484E supports Master SPI, Slave Serial, Slave Parallel, JTAG, and Boundary Scan configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. Master SPI is most commonly used for compact, single-flash designs, while JTAG is preferred for debugging and programming during development. The XC7A50T-L2FGG484E does not support BPI or NAND flash boot modes.
Is XC7A50T-L2FGG484E qualified for automotive applications?
No, the XC7A50T-L2FGG484E is not AEC-Q100 qualified and is not rated for automotive temperature ranges. It is specified for industrial operation (–40°C to +100°C junction temperature) and intended for industrial, medical, and test equipment use. For automotive deployment, designers must select AMD's XA (Automotive) qualified Kintex-7 variants, such as XA7A50T, which undergo additional screening and documentation.
What I/O standards are supported on XC7A50T-L2FGG484E banks?
The XC7A50T-L2FGG484E supports LVCMOS, LVTTL, SSTL, HSTL, differential standards including LVDS, BLVDS, RSDS, and TMDS across its 12 I/O banks. Each bank operates independently at 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. The XC7A50T-L2FGG484E does not support MIPI D-PHY or sub-1.0 V I/O standards.
XC7A50T-L2FGG484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC7A50T-L2FGG484E FAQ
1.How can I place an order for XC7A50T-L2FGG484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A50T-L2FGG484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A50T-L2FGG484E reliable?
The price and inventory of XC7A50T-L2FGG484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A50T-L2FGG484E is usually 5 days.
3.What payment methods are accepted for XC7A50T-L2FGG484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A50T-L2FGG484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A50T-L2FGG484E?
XC7A50T-L2FGG484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A50T-L2FGG484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A50T-L2FGG484E?
For technical support, including XC7A50T-L2FGG484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A50T-L2FGG484E requirements.
6.How does Aetrix verify that XC7A50T-L2FGG484E is sourced from the original manufacturer or authorized distributors?
All XC7A50T-L2FGG484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A50T-L2FGG484E meets industry standards.
7.What is the process for return or replacement of XC7A50T-L2FGG484E?
All XC7A50T-L2FGG484E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A50T-L2FGG484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A50T-L2FGG484E part is unused and in its original packaging.
Return procedure for XC7A50T-L2FGG484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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