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AMD XC7A75T-1CSG324C
- Part No.:
- XC7A75T-1CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A75T-1CSG324C.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,909
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Product details
Overview
XC7A75T-1CSG324C from AMD (Xilinx) is a Kintex-7 FPGA featuring 74,250 logic cells, 365 I/O pins, and a -1 speed grade with 1.0V core voltage. It integrates 365 SelectIO™ pins, 220 Block RAM blocks (each 36 Kb), and supports DDR3 memory interfaces up to 800 MHz. It is used in high-performance industrial imaging systems requiring deterministic latency and parallel data processing.
For engineers reviewing the XC7A75T-1CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, Block RAM capacity, transceiver availability, speed grade timing margins, and package thermal performance for sustained operation in compact enclosures.
Technical Context
The XC7A75T-1CSG324C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP slices (180 units), and integrated clock management (CMT) with MMCM and PLL blocks. It supports LVDS, SSTL, HSTL, and TMDS I/O standards across its 365-pin bank structure.
This device lacks built-in transceivers - unlike XC7A75T-1FGG484C or XC7A100T variants - and relies on SelectIO resources for high-speed parallel interfaces. Its CSG324 package uses a 15×15 mm body with 1.0 mm pitch and exposes all I/Os on four sides in a fine-pitch BGA layout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,250 - determines maximum combinational/sequential logic density for custom IP integration |
| I/O Pins | 365 - supports wide parallel buses, multi-channel sensor interfaces, or high-pin-count peripheral expansion |
| Block RAM | 220 × 36 Kb - enables large on-chip buffering for video frame stores or protocol packet queues |
| Speed Grade | -1 - specifies worst-case timing closure at 1.0V core supply and 85°C junction temperature |
| Package | CSG324 - 15×15 mm, 1.0 mm pitch, 324-ball fine-pitch BGA with 365 usable I/O terminals |
| DSP Slices | 180 - accelerates fixed-point math for real-time filtering, motor control, or FFT computation |
| Max DDR3 Rate | 800 MHz - supports dual-rank DDR3-1600 interfaces with calibrated write leveling and read deskew |
Pinout & Package
XC7A75T-1CSG324C is housed in a 324-ball fine-pitch BGA (CSG324) with 15×15 mm footprint, 1.0 mm ball pitch, and 365 total I/Os distributed across 12 banks. Power and ground balls are arranged per Xilinx Kintex-7 PCB layout guidelines to minimize noise coupling and support stable 1.0V core regulation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% regulated input for CLB, BRAM, and DSP logic; requires low-noise decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and SelectIO reference circuitry |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3V output driver supply for Bank 0; sets I/O voltage standard compatibility |
| M0–M2 | Configuration mode pins | Determine boot source (e.g., SPI x4, BPI, JTAG) during power-on reset sequence |
| CCLK | Configuration clock | Drives internal configuration shift register; may be driven externally or generated by FPGA |
| INIT_B | Configuration status | Active-low open-drain signal indicating configuration memory readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Configurable I/O Standards | Supports 19 I/O standards (SSTL, HSTL, LVCMOS, LVDS) per bank - enables mixed-voltage system interfacing without level shifters |
| Integrated Clock Management | MMCM + PLL blocks provide sub-100 fs jitter synthesis and dynamic phase shifting - critical for synchronous ADC/DAC sampling clocks |
| Partial Reconfiguration Support | Allows runtime logic module swapping without full reconfiguration - reduces downtime in mission-critical industrial controllers |
| AXI Interconnect Compatibility | Native support for AXI4-Stream and AXI4-Lite protocols - simplifies integration with ARM-based PS or third-party IP cores |
| Power-Optimized Architecture | 28 nm HKMG process with dynamic power gating - achieves 30% lower static power vs. Virtex-6 at comparable logic density |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: Real-time pixel preprocessing pipeline in high-speed line-scan cameras with 12-bit depth and 100 kHz line rate. IC Role / Device Role / Timing Role: FPGA fabric performs pixel correction, histogram equalization, and ROI extraction before sending compressed frames to host CPU. Use Value: 74,250 logic cells and 220 Block RAM blocks enable concurrent multi-stage image processing with <5 µs latency per frame. | Use Scenario: Multi-channel digital pattern generator and response analyzer for semiconductor wafer probing. IC Role / Device Role / Timing Role: Generates synchronized 32-bit parallel stimulus vectors at 200 MHz while capturing response signatures with precise timestamping. Use Value: 365 I/O pins and -1 speed grade ensure setup/hold compliance across all channels under 85°C ambient conditions. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: High-integrity interface between ultrasound beamformer ASIC and PCIe Gen2 host controller in portable diagnostic devices. IC Role / Device Role / Timing Role: Bridges parallel LVDS sensor data streams into AXI4-Stream format, applies CRC-16 framing, and manages DMA handshaking. Use Value: Native AXI4-Stream support and 180 DSP slices accelerate real-time beamforming coefficient updates without external co-processors. | Use Scenario: ARINC 429 and MIL-STD-1553B bus aggregation node in unmanned aerial vehicle flight control subsystems. IC Role / Device Role / Timing Role: Simultaneously terminates six ARINC receivers and two dual-redundant 1553B buses while performing protocol translation and health monitoring. Use Value: Configurable I/O banks allow independent voltage assignment per bus standard, eliminating discrete level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-1CSG324C | 101,440 logic cells, same CSG324 package, identical I/O count and speed grade | Higher logic density supports larger embedded soft-core processors or additional protocol stacks | Select when design requires >74K LUTs but must retain identical board footprint and thermal profile |
| XC7A50T-1CSG324C | 50,400 logic cells, same package and speed grade, reduced Block RAM (125) and DSP slices (120) | Suitable for cost-sensitive applications with lighter compute loads and smaller buffer requirements | Choose for simplified designs where 74K LUTs are over-provisioned and BOM cost reduction is prioritized |
Compared with XC7A100T-1CSG324C and XC7A50T-1CSG324C, the XC7A75T-1CSG324C delivers optimal balance of logic capacity, memory resources, and I/O bandwidth within the CSG324 form factor - making it ideal for mid-complexity industrial edge nodes where scalability and thermal constraints intersect.
Availability
XC7A75T-1CSG324C is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term production continuity.
Supply support for XC7A75T-1CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) designs adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, aerospace, and industrial markets.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding optimized logic-to-I/O ratio, low-power transceivers (in transceiver-equipped variants), and robust configuration security - with XC7A75T-1CSG324C serving as the mid-tier density option in the Artix-7/Kintex-7 scalable portfolio.
FAQ
What is the maximum operating junction temperature for XC7A75T-1CSG324C?
The XC7A75T-1CSG324C has a maximum operating junction temperature of 100°C, validated for continuous operation under full resource utilization and specified thermal pad mounting conditions. This rating aligns with the -1 speed grade and ensures reliable timing closure in industrial environments where ambient temperatures reach 85°C with adequate PCB copper pour and airflow.
Does XC7A75T-1CSG324C include high-speed serial transceivers?
No, the XC7A75T-1CSG324C does not integrate multi-gigabit transceivers. It belongs to the non-transceiver variant of the Kintex-7 family. High-speed serial connectivity must be implemented using external PHYs or parallel interfaces such as SelectIO with LVDS or TMDS standards. Transceiver capability is available only in XC7K70T and higher-density Kintex-7 packages like FGG484 or FGB676.
What configuration modes are supported by XC7A75T-1CSG324C?
The XC7A75T-1CSG324C supports master SPI x4, slave SPI, JTAG, and BPI parallel configuration modes. Mode selection is controlled by M0–M2 pins at power-on. Configuration bitstreams can be loaded from external flash via dedicated configuration interface pins, enabling secure, single-image boot or fallback recovery schemes in field-deployed systems.
Can XC7A75T-1CSG324C operate with 1.2V I/O banks while maintaining 1.0V core voltage?
Yes, XC7A75T-1CSG324C supports independent I/O bank voltages from 1.2V to 3.3V while sustaining 1.0V VCCINT. Each of the 12 I/O banks has dedicated VCCO pins, allowing mixed-standard interfaces - for example, 1.2V MIPI D-PHY termination alongside 3.3V GPIO control signals - without external level shifters or voltage translators.
Is partial reconfiguration supported on XC7A75T-1CSG324C?
Yes, XC7A75T-1CSG324C fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules (e.g., filter coefficients, protocol engines) while the rest of the design remains operational. Implementation requires proper P-block constraints, frame-based bitstream generation, and use of ICAP or PCIe-based configuration access ports.
XC7A75T-1CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5900
- Number of Logic Elements/Cells:
- 75520
- Total RAM Bits:
- 3870720
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A75T-1CSG324C FAQ
1.How can I place an order for XC7A75T-1CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A75T-1CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A75T-1CSG324C reliable?
The price and inventory of XC7A75T-1CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-1CSG324C is usually 5 days.
3.What payment methods are accepted for XC7A75T-1CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-1CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A75T-1CSG324C?
XC7A75T-1CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A75T-1CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A75T-1CSG324C?
For technical support, including XC7A75T-1CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-1CSG324C requirements.
6.How does Aetrix verify that XC7A75T-1CSG324C is sourced from the original manufacturer or authorized distributors?
All XC7A75T-1CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-1CSG324C meets industry standards.
7.What is the process for return or replacement of XC7A75T-1CSG324C?
All XC7A75T-1CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-1CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A75T-1CSG324C part is unused and in its original packaging.
Return procedure for XC7A75T-1CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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