AMD XC7A75T-1CSG324I

Overview

XC7A75T-1CSG324I from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and -1 speed grade operating at 1.0V core voltage. It integrates 365 SelectIO™ pins, 240 DSP slices, and 4.2 MB of block RAM, targeting high-performance industrial control and video processing systems.

For engineers reviewing the XC7A75T-1CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, DSP slice availability, block RAM depth, and thermal performance in compact PCB layouts.

Technical Context

The XC7A75T-1CSG324I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic acceleration, and integrated PCIe® Gen2 x4 endpoint capability. It supports DDR3 memory interfaces up to 800 MHz and includes hardened clock management tiles (CMT) with MMCM and PLL.

Its SelectIO™ interface supports LVDS, SSTL, HSTL, and TMDS standards across all 365 user I/Os, with programmable slew rate and drive strength per bank. Configuration is performed via JTAG, SPIx4, or BPI parallel modes using external flash or PROM.

Key Specifications

Pinout & Package

XC7A75T-1CSG324I uses a 324-pin Chip Scale Ball Grid Array (CSG324) package with 15×15 array, 0.8 mm pitch, and 1.0 mm profile. Pin functions are organized into 12 I/O banks, configuration banks (CONFIG), and dedicated power/ground balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC7A100T-1CSG324I and XC7A50T-1CSG324I, the XC7A75T-1CSG324I delivers balanced logic density, I/O count, and DSP resources for mid-scale embedded vision and control-avoiding overdesign while maintaining margin for future feature expansion.

Availability

XC7A75T-1CSG324I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging backend processing, 4K video transport bridges, and test & measurement pattern generation requiring stable component supply and long-term lifecycle support.

Supply support for XC7A75T-1CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded applications.

The Kintex-7 family targets high-performance, cost-optimized applications demanding advanced logic density, transceiver bandwidth, and memory bandwidth-designed for video, wireless infrastructure, and industrial automation.

FAQ

What is the maximum supported DDR3 data rate for XC7A75T-1CSG324I?

The XC7A75T-1CSG324I supports DDR3 interfaces up to 800 MHz clock frequency, enabling 1600 Mbps data rates per pin. This is achieved using calibrated I/O timing, on-die termination, and dedicated memory controller logic within the FPGA fabric. The XC7A75T-1CSG324I's memory interface meets JEDEC DDR3L specifications and includes hardware-assisted write leveling and read leveling.

Does XC7A75T-1CSG324I include a hard PCIe® block?

Yes, the XC7A75T-1CSG324I integrates a hardened PCIe® Gen2 x4 endpoint block compliant with PCI Express Base Specification v2.0. It supports link training, power management states (L0/L1/L2), and transaction layer packet handling without consuming programmable logic resources. The XC7A75T-1CSG324I does not include a root complex; it operates only as an endpoint device.

What configuration modes are supported by XC7A75T-1CSG324I?

The XC7A75T-1CSG324I supports JTAG, Master SPI, Slave SelectMAP, and BPI parallel configuration modes. Mode selection is controlled by M0–M2 pin strapping at power-up. Configuration bitstreams can be loaded from external SPI flash, parallel NOR flash, or through JTAG boundary-scan. The XC7A75T-1CSG324I also supports fallback configuration and multi-boot via external flash partitioning.

Is partial reconfiguration supported on XC7A75T-1CSG324I?

Yes, the XC7A75T-1CSG324I fully supports partial reconfiguration using Vivado Design Suite tools. This allows dynamic replacement of logic modules while the rest of the design remains operational. The XC7A75T-1CSG324I's frame-based bitstream architecture enables secure, verified, and time-bounded reconfiguration of designated reconfigurable partitions without system reset.

What is the operating temperature range for XC7A75T-1CSG324I?

The XC7A75T-1CSG324I is rated for industrial temperature range: –40°C to +100°C case temperature. This rating applies to the -1 speed grade and CSG324 package. Thermal design must ensure junction temperature remains within limits under worst-case power dissipation; AMD provides thermal resistance values (θJA = 22.5°C/W) and power estimation guidelines in UG476.