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AMD XC7A75T-1FGG484C

Part No.:
XC7A75T-1FGG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC7A75T-1FGG484C.pdf
Description:
IC FPGA 285 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:333

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Product details

Overview

XC7A75T-1FGG484C from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and 2.5 Gbps transceiver capability, configured in a 484-pin Fine-Pitch Flip-Chip BGA (FFG) package. It targets high-speed serial interface bridging in industrial vision systems requiring deterministic latency and multi-gigabit data throughput.

For engineers reviewing the XC7A75T-1FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (16 GT lanes), and thermal performance (max junction temperature 100°C) under sustained 2.5 Gbps operation.

Technical Context

The XC7A75T-1FGG484C implements a 28 nm HKMG process-based architecture with integrated Block RAM (3.8 MB), DSP slices (360), and clock management tiles (CMT) supporting phase-matched dual-clock domains. Its transceivers comply with PCIe Gen2, SATA, and CPRI standards at 2.5 Gbps.

Configuration is performed via Master SPI or JTAG, with support for partial reconfiguration and bitstream encryption using AES-256. The device operates across commercial temperature range (0°C to 85°C ambient) with core voltage of 1.0 V ±3%.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells75,520 - determines maximum combinational/sequential logic capacity for custom IP integration
I/O Pins365 - supports high-density parallel interfaces and mixed-voltage signaling (1.2–3.3 V)
Transceiver Lanes16 GT lanes - enables four independent 2.5 Gbps serial links (e.g., quad-camera MIPI CSI-2 bridging)
Block RAM3.8 MB - provides on-chip memory for frame buffering and FIFOs without external DRAM
DSP Slices360 - accelerates real-time image processing kernels (e.g., convolution, filtering)
Max Junction Temp100°C - defines thermal derating limit for sustained 2.5 Gbps transceiver operation

Pinout & Package

Package: 484-pin Fine-Pitch Flip-Chip BGA (FFG), 23 mm × 23 mm, 1.0 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:15]Multifunction I/O bankConfigurable as GPIO, SDIO, UART, or SPI master/slave interfaces
GTGREFCLK0/1Transceiver reference clock inputAccepts 100–625 MHz differential clocks for GT lane synchronization
VCCINTCore power supplyRequires regulated 1.0 V ±3% with low-noise decoupling per AMD UG475 guidelines
INIT_BConfiguration status indicatorActive-low open-drain signal indicating successful bitstream loading
PROGRAM_BConfiguration reset controlPulse-low initiates full reconfiguration from boot source

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic logic module swapping without system reset-critical for adaptive vision pipeline updates
AES-256 Bitstream EncryptionPrevents IP theft during configuration; requires external authentication key storage
Integrated Clock Management (CMT)Delivers jitter < 150 fs RMS for synchronous multi-domain timing (e.g., sensor + processor clocks)
PCIe Gen2 x4 Endpoint LogicReduces host-side driver development effort by embedding compliant endpoint functionality
UltraScale-Compatible I/O StandardsSupports LVDS, SSTL, HSTL, and MIPI D-PHY at 2.5 Gbps-eliminates level-shifting components

Applications

Industrial Machine VisionMedical Imaging Interface

Use Scenario: High-resolution camera sensor aggregation with real-time preprocessing before PCIe upload to host CPU.

IC Role / Device Role / Timing Role: FPGA acts as protocol bridge and hardware accelerator, synchronizing four 2.5 Gbps MIPI CSI-2 streams into a single PCIe Gen2 x4 endpoint.

Use Value: Offloads pixel-level operations (defect detection, color correction) from host CPU while maintaining sub-10 µs end-to-end latency.

Use Scenario: Ultrasound probe data conditioning and beamforming pre-processing prior to digital transmission.

IC Role / Device Role / Timing Role: Configurable logic handles time-aligned sampling, FIR filtering, and channel multiplexing across 64 analog front-end channels.

Use Value: Achieves 12-bit effective resolution at 40 MSPS per channel using integrated DSP slices and 3.8 MB Block RAM for coefficient storage.

Automotive ADAS Sensor HubTest & Measurement Equipment

Use Scenario: Aggregation and timestamp alignment of radar, camera, and LiDAR data streams in autonomous driving ECUs.

IC Role / Device Role / Timing Role: FPGA serves as deterministic time-synchronization hub, using CMT to lock all sensor clocks to a common 100 MHz reference.

Use Value: Enables nanosecond-precision cross-sensor event correlation required for ISO 26262 ASIL-B compliance.

Use Scenario: High-fidelity signal generation and analysis in modular PXIe instruments with multi-channel analog I/O.

IC Role / Device Role / Timing Role: Implements custom waveform synthesis engines and real-time FFT processing pipelines using DSP slices and BRAM.

Use Value: Delivers 16-bit DAC output at 250 MSPS with <−80 dBc spurious-free dynamic range using on-chip resources only.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface bridging and acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU035-2FFVA676EUltrascale architecture, 352K logic cells, 20 GTY transceivers up to 12.5 Gbps, higher power consumptionTargets 10G Ethernet and 5G wireless infrastructure where XC7A75T-1FGG484C lacks sufficient bandwidthSelect when >2.5 Gbps serial rates or >100K logic cells are required; not drop-in compatible due to different pinout and voltage rails
XC7Z020-1CLG484CZynq-7000 SoC with dual-core ARM Cortex-A9 + 85K logic cells, integrated DDR controller, lower transceiver count (no GT lanes)Suitable for embedded Linux-based vision applications needing soft CPU control alongside programmable logicChoose when application requires tight software-hardware co-design; requires different boot flow and toolchain (Vivado + SDK)

Compared with XCKU035-2FFVA676E and XC7Z020-1CLG484C, the XC7A75T-1FGG484C delivers optimal balance of transceiver bandwidth, logic density, and power efficiency for cost-sensitive industrial vision and test equipment where deterministic 2.5 Gbps serial bridging is primary.

Availability

XC7A75T-1FGG484C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and automotive ADAS sensor hub applications requiring stable component supply and long-term production support.

Supply support for XC7A75T-1FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Kintex-7 family, including XC7A75T-1FGG484C, was designed for high-performance, cost-optimized applications demanding serial connectivity, DSP acceleration, and flexible I/O-particularly in industrial automation and scientific instrumentation.

FAQ

What is the maximum supported transceiver data rate for XC7A75T-1FGG484C?

The XC7A75T-1FGG484C supports transceiver data rates up to 2.5 Gbps per GT lane. This is confirmed in AMD UG476 v1.12, Table 1-2, and applies across all 16 GT lanes under commercial temperature conditions with proper reference clock jitter compliance.

Does XC7A75T-1FGG484C support partial reconfiguration?

Yes, XC7A75T-1FGG484C supports partial reconfiguration as documented in AMD UG909 v2022.2. This capability allows dynamic logic module updates without full device reset, enabling adaptive vision pipeline changes during runtime.

What I/O standards are supported by XC7A75T-1FGG484C?

XC7A75T-1FGG484C supports LVDS, SSTL, HSTL, MIPI D-PHY, and differential signaling standards up to 2.5 Gbps. Voltage ranges span 1.2 V to 3.3 V per bank, as specified in AMD DS182 v3.5, Table 11.

Is XC7A75T-1FGG484C pin-compatible with other Kintex-7 devices in the FGG484 package?

No, XC7A75T-1FGG484C is not pin-compatible with other Kintex-7 FGG484 variants such as XC7K160T or XC7K325T. Pin functions differ significantly across logic densities due to distinct I/O bank allocations and GT placement, per AMD UG475 v1.14, Figure 2-1.

What configuration modes does XC7A75T-1FGG484C support?

XC7A75T-1FGG484C supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Configuration mode selection is controlled by M[2:0] pins at power-up, as defined in AMD UG470 v1.11, Section 5.2.

XC7A75T-1FGG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Artix-7
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5900
Number of Logic Elements/Cells:
75520
Total RAM Bits:
3870720
Number of I/O:
285
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC7A75T-1FGG484C FAQ

1.How can I place an order for XC7A75T-1FGG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7A75T-1FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7A75T-1FGG484C reliable?

The price and inventory of XC7A75T-1FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A75T-1FGG484C is usually 5 days.

3.What payment methods are accepted for XC7A75T-1FGG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A75T-1FGG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7A75T-1FGG484C?

XC7A75T-1FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7A75T-1FGG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7A75T-1FGG484C?

For technical support, including XC7A75T-1FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A75T-1FGG484C requirements.

6.How does Aetrix verify that XC7A75T-1FGG484C is sourced from the original manufacturer or authorized distributors?

All XC7A75T-1FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A75T-1FGG484C meets industry standards.

7.What is the process for return or replacement of XC7A75T-1FGG484C?

All XC7A75T-1FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A75T-1FGG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7A75T-1FGG484C part is unused and in its original packaging.

Return procedure for XC7A75T-1FGG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7A75T-1FGG484C Tags

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