AMD XC7A75T-1FGG484I

Overview

XC7A75T-1FGG484I from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and 2.5 Gbps transceiver capability, packaged in a 484-pin Fine-Pitch Flip-Chip BGA (FFG). It serves as a high-performance programmable logic fabric for industrial vision processing and real-time protocol bridging.

For engineers reviewing the XC7A75T-1FGG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), -1 speed grade timing performance, and integrated Block RAM (3.8 Mbit) for local data buffering.

Technical Context

The XC7A75T-1FGG484I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 18x25 DSP slices, and 240 user-configurable I/O banks supporting LVCMOS, LVDS, and TMDS signaling. It includes 24 transceivers operating up to 2.5 Gbps with built-in clock correction and elastic buffer support.

Configuration is performed via Master SPI or JTAG, with dual-boot capability enabled by on-chip fallback memory. The device supports partial reconfiguration and AXI4-Stream interfaces for high-throughput data path integration.

Key Specifications

Pinout & Package

XC7A75T-1FGG484I is housed in a 22×22 mm, 484-pin Fine-Pitch Flip-Chip BGA (FFG) package with 1.0 mm ball pitch and Pb-free finish. Thermal pad on underside requires exposed copper thermal land per Xilinx UG475.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC7A75T-1FGG484I, the XC7A100T-1FGG484I provides additional logic density within identical mechanical and electrical constraints, while the XCKU035-2FFVA676I delivers significantly higher serial bandwidth at the cost of increased power and PCB layer count.

Availability

XC7A75T-1FGG484I is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging systems requiring stable component supply across long production lifecycles.

Supply support for XC7A75T-1FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGA, adaptive SoC, and AI acceleration platforms for data center, edge, and embedded markets.

The Kintex-7 family was designed for cost-optimized high-performance applications demanding balanced logic density, transceiver bandwidth, and power efficiency-targeting industrial, medical, and aerospace systems.

FAQ

What is the maximum supported I/O standard for XC7A75T-1FGG484I?

XC7A75T-1FGG484I supports LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, TMDS, and HSTL I/O standards across its 365-user I/O pins. Each of the 240 configurable I/O banks can be independently set to different voltage levels, enabling mixed-signal interface coexistence on a single device. This flexibility allows direct connection to sensors, FPGAs, and microcontrollers without level-shifting circuitry.

Does XC7A75T-1FGG484I support partial reconfiguration?

Yes, XC7A75T-1FGG484I fully supports partial reconfiguration through Vivado Design Suite using the ICAP interface and dedicated reconfigurable partitions. This capability enables runtime logic updates-for example, swapping communication protocol engines (e.g., GigE Vision ↔ USB3 Vision) without resetting the entire system. Implementation requires proper floorplanning and use of supported primitives like BRAM and DSP slices within reconfigurable regions.

What configuration modes are available for XC7A75T-1FGG484I?

XC7A75T-1FGG484I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most commonly used for compact, single-flash boot; JTAG is preferred for debugging and in-system programming. Dual-boot capability is enabled via on-chip fallback memory, allowing automatic recovery from corrupted configuration images.

Is XC7A75T-1FGG484I qualified for automotive applications?

No, XC7A75T-1FGG484I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably in extended temperature environments, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. For automotive ADAS or infotainment systems, AMD's Zynq-7000 SoC or Versal ACAP families with automotive-grade variants are recommended instead of XC7A75T-1FGG484I.

What is the total Block RAM capacity of XC7A75T-1FGG484I?

XC7A75T-1FGG484I contains 3.8 Mbit of total Block RAM distributed across 255 BRAM primitives, each configurable as 36 Kbit dual-port RAM or 18 Kbit single-port RAM. This resource supports deep buffering for video pipelines, real-time FFTs, and protocol state machines. When combined with distributed RAM and UltraRAM (in larger Kintex-7 devices), it enables efficient on-die memory hierarchy without external SRAM or DDR chips.