AMD XC7A75T-1FGG676C

Overview

XC7A75T-1FGG676C from AMD (Xilinx) is a Kintex-7 FPGA with 74,250 logic cells, 365 I/O pins, and 285 DSP slices, operating at -1 speed grade (1.0 ns CLB delay), housed in a 676-pin Fine-Pitch Flip-Chip BGA (FFG676) package for high-density programmable logic applications in industrial control and video processing.

For engineers reviewing the XC7A75T-1FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, DSP slice availability, speed grade timing closure, thermal performance in FFG676, and compatibility with Vivado 2023.2+ toolchain.

Technical Context

The XC7A75T-1FGG676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (BRAM), and dedicated transceivers supporting up to 6.6 Gb/s. It integrates SelectIO technology with support for LVDS, SSTL, HSTL, and differential signaling standards across its 365 user I/Os.

It features 408 KB of total block RAM, 285 25×18-bit DSP slices for high-throughput arithmetic, and supports JTAG, ICAP, and PCIe Gen2 x4 configuration interfaces. The -1 speed grade guarantees maximum clock frequencies up to 628 MHz for internal logic and 1,066 Mbps DDR3 memory interface operation.

Key Specifications

Pinout & Package

The XC7A75T-1FGG676C is packaged in a 676-ball Fine-Pitch Flip-Chip BGA (FGG676) with thermal lid, 27×27 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-271AC footprint. Pin assignment follows Xilinx UG475 v1.14 for Kintex-7 FGG676 devices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC7A75T-1FGG676C, XC7A100T-1FGG676C offers headroom for scaling logic density without PCB redesign, while XC7A50T-1FGG484C reduces BOM cost and board area at the expense of I/O and computational throughput.

Availability

XC7A75T-1FGG676C is available at Aetrix Electronics and suitable for industrial motor control, medical imaging systems, 4K video transport bridges, and test & measurement equipment requiring stable component supply and long-term FPGA lifecycle support.

Supply support for XC7A75T-1FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing solutions for data center, AI, and embedded markets.

The Kintex-7 family targets high-performance, cost-sensitive applications demanding balanced logic, I/O, and DSP resources - optimized for video, wired communications, and industrial automation.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7A75T-1FGG676C?

The XC7A75T-1FGG676C supports DDR3 SDRAM interfaces up to 1,066 Mbps (533 MHz clock) in the -1 speed grade, compliant with JEDEC DDR3-1066 specifications. This capability is validated in Xilinx UG571 and requires proper PCB layout adherence to impedance-controlled routing and termination guidelines. XC7A75T-1FGG676C includes dedicated memory controller logic and I/O banks configured for SSTL15.

Does XC7A75T-1FGG676C include built-in PCIe Gen2 x4 endpoints?

Yes, XC7A75T-1FGG676C integrates a hard PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification 2.1. It supports both root complex and endpoint modes, with automatic link training and configuration space access. XC7A75T-1FGG676C does not require soft-core implementation, reducing resource usage and improving timing predictability.

What configuration modes are supported by XC7A75T-1FGG676C?

XC7A75T-1FGG676C supports master SPI, slave SPI, master BPI, slave BPI, JTAG, and ICAP configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from external flash (SPI/BPI) or through JTAG for debugging. XC7A75T-1FGG676C also supports fallback and multi-boot configurations using external flash partitioning.

Is partial reconfiguration supported on XC7A75T-1FGG676C?

Yes, XC7A75T-1FGG676C fully supports partial reconfiguration (PR) as defined in Xilinx UG908. PR allows dynamic replacement of logic modules without resetting the entire device, enabling adaptive functionality in real-time systems. XC7A75T-1FGG676C requires Vivado Design Suite 2018.2 or later and specific floorplanning constraints to implement PR regions.

What thermal management considerations apply to XC7A75T-1FGG676C in FGG676 package?

XC7A75T-1FGG676C in the FGG676 package includes an integrated thermal lid and requires a minimum 4-layer PCB with dedicated thermal vias under the package body. Xilinx recommends a θJA of ≤25°C/W for typical industrial ambient conditions. XC7A75T-1FGG676C junction temperature must remain below 100°C; thermal simulation using Xilinx Power Estimator (XPE) is mandatory for accurate power and cooling validation.