AMD XC7A75T-1FGG676I

Overview

XC7A75T-1FGG676I from AMD is a Kintex-7 FPGA with 75,520 logic cells, 365 I/O pins, and -1 speed grade operating at 1.0V core voltage; it integrates 365 SelectIO™ pins, 240 DSP slices, and 4.25 Mb of block RAM for high-performance embedded vision and industrial control applications.

For engineers reviewing the XC7A75T-1FGG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, DSP slice availability, block RAM capacity, and thermal performance in compact industrial enclosures.

Technical Context

The XC7A75T-1FGG676I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices supporting 25×18-bit multiply-accumulate operations, and integrated PCIe® Gen2 x4 endpoint capability. It supports DDR3/DDR2/LPDDR2 memory interfaces up to 800 MHz and includes dual 622–6.6 Gbps transceivers.

Configuration occurs via Master SPI, Slave Serial, or JTAG modes; configuration memory is loaded from external flash or through ICAP interface. The device supports partial reconfiguration and includes hardened clock management tiles with MMCM and PLL blocks for jitter reduction.

Key Specifications

Pinout & Package

XC7A75T-1FGG676I is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 29×29 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu surface finish. Thermal pad on underside enables direct PCB thermal coupling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC7A75T-1FGG676I, the XC7A100T-1FGG676I offers higher logic density in identical packaging, while the XC7A50T-1FGG484I reduces size and cost at the expense of transceiver count and PCIe integration-enabling tiered scalability across product families.

Availability

XC7A75T-1FGG676I is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging backend systems requiring stable component supply and long-term manufacturability.

Supply support for XC7A75T-1FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt efficiency.

The Kintex-7 family targets high-throughput, cost-sensitive applications demanding balanced logic, DSP, and I/O resources-optimized for industrial automation, test equipment, and medical imaging.

FAQ

What is the maximum supported memory interface speed for XC7A75T-1FGG676I?

The XC7A75T-1FGG676I supports DDR3-1600 (800 MHz data rate) with native PHY implementation. It also interfaces with LPDDR2-800 and QDR II+ SRAM at up to 250 MHz clock frequency. Memory controller configuration is performed using Xilinx Vivado IP integrator with validated timing constraints for each standard.

Does XC7A75T-1FGG676I include built-in PCIe Gen2 support?

Yes, XC7A75T-1FGG676I integrates a hardened PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification v2.1. This eliminates the need for external bridge chips and supports both root complex and endpoint configurations via configuration space access and AXI4-Stream interfaces.

What is the operating temperature range for XC7A75T-1FGG676I?

XC7A75T-1FGG676I is rated for industrial temperature operation from –40°C to +100°C junction temperature. The -1 speed grade guarantees timing closure across this full range when used with appropriate thermal management and voltage regulation per Xilinx DS182 specification.

Can XC7A75T-1FGG676I be configured via JTAG only?

No-XC7A75T-1FGG676I supports multiple configuration modes: JTAG, Master SPI, Slave Serial, and SelectMAP. JTAG is used primarily for debugging and programming during development; production deployment typically uses Master SPI with external flash storage for autonomous startup.

Is partial reconfiguration supported on XC7A75T-1FGG676I?

Yes, XC7A75T-1FGG676I fully supports partial reconfiguration using Xilinx Vivado tools. This allows dynamic replacement of logical modules (e.g., filter coefficients or protocol engines) without resetting the entire device or disrupting active I/O channels.